TYSTAR TYTAN SILICON NITRIDE LPCVD FURNACE OPERATING MANUAL Version: 1.0 June, 2011

Transcription

1 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE OPERATING MANUAL Version: 1.0 June, 2011 UNIVERSITY OF TEXAS AT ARLINGT Nanofabrication Research and Teaching Facility

2 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 TABLE OF CTENTS 1. Introduction Scope Description Safety Hardware Requirements Training Restrictions, System Checks Operating Procedure Load Recipe Load Wafer Unload Wafer RECIPE

3 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: INTRODUCTI 1.1 Scope These procedures apply to the Tystar Tytan Silicon Nitride LPCVD (Low Pressure Chemical Vapor Deposition) Furnace system. All maintenance should follow the procedures set forth in the manufacturer s maintenance and operations manuals. This document is for reference only. Personnel should be trained by authorized staff before operating this equipment. 1.2 Description Tystar Silicon Nitride LPCVD furnace is configured as a single tube for high temperature (700C - 950C ) at reduced pressures (250 mtorr) to produce low deposition rate CVD processes. The Tystar Silicon Nitride processes are capable of producing highly impermeable barrier layer to H 2 O, O 2, Na, H with excellent material properties as density, refractive index, dielectric constant and slow HF etch rates.the tool has been qualified for low stress and stoichiometric Si 3 N 4 processes. Tystar LPCVD can process up to 25 (4 or 3 diameter) Silicon wafers during a run. The tool operates as a stand-alone unit that comprises of three modules: wafers load/unload module, furnace/process tube module, and gas control module. The system has its own computer, FCS10, whose display panel and keypad are located on the right side of the wafer load/unload module. The furnace uses highly accurate MFC s (mass flow controllers) and uses dichlorosilane (DCS) and ammonia (NH3) as sources for the silicon and nitrogen to achieve optimum mass transport to the wafer surface to achieve optimum LPCVD conditions for improved thickness uniformity and substrate spacing sensitivity. The furnace operation is controlled by using the special function buttons and a series of menu commands. 1.3 Safety This furnace uses DCS (SiH 2 C l2 ) which is a colorless toxic gas that is extremely flammable and explosive in contact with air. This gas can form flammable mixtures in air and release of this gas which has not spontaneously ignited must be considered extremely dangerous and should not be approached. The tool also uses Anhydrous Ammonia (NH 3 ) which is a powerful caustic irritant to the skin, eyes and mucous membranes. Lastly this tool uses Nitrogen ( N 2 ) gas which in high concentrations can be asphyxiates. The process gases are normally pumped out of system; however if the process pressure is not being maintained or the furnace cannot reach base pressure notify NanoFab staff immediately Before using the tool read the DCS (SiH 2 C l2 ) and Ammonia (NH 3 ) material safety data sheets (MSDS) provided. Users are not allowed to open or adjust the any gas bottle valve or regulators for this system. Call NanoFab staff for gas bottle or gas regulator issues. 3

4 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: This tool continuously monitors, displays and records the toxic gas PPM(parts per million) levels using the Drager Polytron 2 XP Transmitters and DraegerGard controller. If a PPM level exceeds an alarm set point the controller will relay an audible and visual alarm throughout the building. If the NanoFab system s alarm light tower YELLOW light goes immediately leave the NanoFab building informing others to leave on your way out. If the light tower s RED alarm light and audible alarm goes immediately leave the NanoFab building through the closest and safest emergency exit and wait for emergency personnel to arrive. DO NOT operate this machine if the Drager Polytron 2 XP Transmitters displays any warnings, faults or if any RED leds are. If any warning, alarms or RED leds are notify NanoFab staff immediately USERS cannot run the tool if EITHER facility ACID or SOLVENT exhaust are OFF. If you suspect an exhaust problem notify staff. Acid exhaust OFF = 0 Solvent exhaust OFF = RED The furnace is connected to high voltage. Be very careful and aware of electrical hazards when operating this tool. If you encounter any electrical malfunctions contact NanoFab staff immediately The furnace will heat to high temperatures (950 0 C). Make sure all high temperature heat shields are installed above the furnace to minimize Drager sensors temperature sensitivity. Make sure quarts boat tongs/forks are in place. Do not touch the quartz boat during wafer unload, the quartz is 550C and will burn your fingers. 4

5 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: This machine has an EMO (Emergency Off) switch/button mounted on the front panel inside the clean room and another in the chase. The EMO switch should be pressed only in an emergency. An emergency would be fire, smoke, toxic gas release, electrocution hazards, and an injury to anyone using this particular piece of equipment. If the EMO is pressed notify NanoFAB staff immediately Read any posted NanoFAB Engineering Change Notices (ECN) for any hardware, process or safety changes before running the tool. 2 HARDWARE 2.1. Process Gases: DCS and NH3 source gases Wafers Load/Unload Module : Load station equipped with vertical HEPA filters with laminar flow. Cantilever non contact wafer loader for 3 to 6 diameter wafers. Automatic wafer loading and unloading at 5 per 550C Furnace Temperature /Process Tube Module : Three zone heaters for optimum temperature control and stability Gas Control Module : The souce gas cabinets contain all gas controls and distribution manifold. Heated DCS gas line. All gas line are orbitally welded and are made of polished stainless steel. Mass flow controllers are used for the control of all process gases Vacuum Pumps /Process Exhaust : Edwards M280 mechanical pump and roots blower on remote stands for low pressure CVD processes. The system is equipped with particle traps, vacuum soft start and oil filtration system. Process exhaust is heated and filtered in Edwards M150 gas reactor column (GRC) that destroys hazardous gas to below TLV ( Threshold Limit Values) levels. 5

6 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: REQUIREMENTS 3.1 Training You must be a qualified user on Tystar Tytan LPCVD Furnace System. The furnace system can be used to deposit LPCVD Si 3 N 4 on 3 to 4 diameter wafers. 3.2 Restrictions The furnace is for 3 or 4 diameter clean Silicon wafers LY No wafers are to be processed that EVER had METAL on them or had been previously processed in RTA, PECVD, Sputtering and e-beam systems All wafers must not have any edge chips, nicks, or cracks. The wafer front and backside must be clean and free of resist or any residues from photolithography, wet or dry etching processes All wafers must have pre-nitridation cleaning process done before nitride deposition such as RCA1, RCA2, 2-3 min in HF dip 1:10 remove any organic contamination and other residues Use dedicated quartz boat for the furnace as shown Any deposition more than 4000Å require NanoFab approval Tystar LPCVD can LY be used Monday-Friday from 8am to 6pm (excluding Holidays and UTA snow days ) Read any posted NanoFab Engineering Change Notices (ECN) for any hardware, process or safety changes before running the tool Users are allowed to start the process in the AM and let the recipe sequence hold at the HLD1 step overnight and unload the wafers the next morning (typical process times are 10 hours). Users must check the status every 3-4 hours (except during the overnight HLD1 step). 6

7 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: Only staff are allowed the Change, Copy or Download process recipes Users can only run Tystar recipes named : LSNITR.002 STNITRSW.002 STNITR After the wafers have completed the process and the quartz boat has moved out to the unload position you have 30 minutes to remove the boat from the quarts cantilever. The quartz boat is very hot (500C - 550C ). Let the wafers cool in the boat 30 minutes before placing them into a cassette/box When using the FCS-10 touch screen always use the light pen for entering system commands USER s are not allowed to open DCS or NH3 gas bottle valves or adjust the bottle regulators. After USER s are finished only staff are allowed to evacuate the line and close the process gas bottles For any Machine Malfunctions, Computer Lock UP s, any type of Alarms notify staff immediately. 3.3 System checks Touch the screen with the light pen at the bottom right side exit the screen saver mode The Main Menu screen will should be displayed. If the Main Menu is not displayed call staff to check the FSC-10 computer. Main Menu 7

8 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: Press DISPLAY STATUS and verify that the FCS-10 (Furnace Control System-10) is in IDLE condition with about 550 ºC actual temperature Go to the chase. Check to ensure the Edwards M280 mechanical pump, Edwards booster pump and oil recirculator is. The pumps will be making a loud noise, the mechanical pump rotor fan blades will be spinning, the booster pump oil will be circulating and the oil recirculator pressure will be 40 and 15 psi. Check to ensure are pump oil levels are ½ up the site glass Check to ensure the pump pack N2 ballast flows are and in specification: N2 ballast 1cc/min Low N2 pump purge is maximum flow High N2 pump purge is 15 l/min Check to ensure the DCS gas supply line heater is and is 50C ± 3 C Check to ensure to the DCS exhaust line heater is and is 45C ± 3 C 8

9 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: Check to ensure the FCS-460 MFC flow controller is in AUTO mode ( MANUAL led will be OFF) and there are no alarms (ALARM ACK led will be OFF) Check to ensure the heat exchanger water flow meter is 2 gallons/ minute. The cooling ring and cold trap water flow will turn automatically during the process Check to ensure the Edwards M150 Gas Reactor Column abatement system has no beacon alarms. The N2 purge should be 1 l/min, cartridge upper temperature at 575C, cartridge LOWER temperature at 500C and the inlet pressure < 1 mbarr (should be negative mbarr) Check to ensure the Applied Energy System HPMII gas manifold controller for DCS and NH3 have no CURRENT or LATCHED sensor fault leds. Check to ensure DCS and NH3 Honeywell Sensors have no alarms leds 9

10 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: OPERATING PROCEDURE 4.1. Load Recipe ( When using the FCS-10 touch screen always use the light pen for entering system commands) Press MAIN MENU. This key takes you to the main menu screen Press RECIPE LOAD. Use arrow keys to select your recipe file.press ENTER twice (double click )to load it. There is a limited disk space in the DCS-10 computer and not all the recipes can be stored at the same time. If your recipe is not listed, contact Nanofab staff to down load it from the host computer Wait for the computer to upload and check for recipe errors. This may take 10 seconds Press MAIN MENU and the press RUN. After the recipe sequence begins press DISPLAY STATUS to monitor the recipe steps and see the process sequence count down timer. 10

11 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: Once the recipe sequence has started the only active button is the ABORT button. If the ABORT button is pressed the software will prompt you for a reply. 4.2 Load Wafer If you press on Yes the system will run an abort recipe and go to IDLE step. If you press Yes call NanoFab staff to remove your wafers. If you press No the process will continue The 1 st step in all sequences is STRT step.when the step is at BOUT the boat holder will come out automatically; it will take 5 minutes. After the BOUT step is finished the audible alarm will go on. Press ALARM ACK to silence the alarm. This step will be LDWF (load wafers). You have 20 minutes to load your wafers. ALARM ACK If the quartz boat is already in the furnace remove the wafer boat with the quartz forks/tongs and load you wafers using the correct size quarts boat ( 3 or 4 boat) and place the wafers with the shinny side facing the clean room (you) and the wafer s major flat in the up direction as shown. If you re processing 3-12 wafers separate them equally between slots. Align the boat on the loader cantilever in such a way that you can see the arrow through the right hole of the boat. 11

12 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: When you are finished loading the wafers the on the loader press EVENT to resume the recipe sequence, otherwise you have up to 20 minutes to load you samples and then the tube will close automatically You can ABORT the process at any step see section The computer will run the program automatically (35 steps over 10 hours). After the nitride deposition and a subsequent 8 cycle pump purge is finished the sequence will automatically stop/hold at HLD1 step. At the HLD1 step the audio alarm will sound again. Press ALARM ACK to silence the alarm. At this step USER s are allowed leave the fab and let the recipe hold at this step overnight and return the next morning to continue the process. (Don t press EVENT unless you can return within 2 hours to remove your wafers) When you are ready to continue the process press EVENT. The process now continues and the boat/wafers will automatically come after several steps. EVENT ALARM ACK 4.3 Unload Wafer The computer will run the program automatically and once the HLD1 step is acknowledged by pressing EVENT the boat will subsequently come out of the furnace. When the boat is fully out the audible alarm will sound indicating that the boat/wafers are ready to unload from the cantilever loader. Press ALARM ACK to stop the alarm sound. You have 30 minutes to retrieve you wafers or the timer will expire and the loader will move back into the furnace automatically. Carefully remove your wafers/boat by using the quartz fork/tongs as shown. Place the hot wafers/boat on the quartz plate and let cool for 30 minutes before putting the wafers into a cassette/box. EVENT Press EVENT the loader will move back into the furnace and the recipe will go to IDLE mode Before you leave, verify that the FCS-10 (Furnace Control System-10) is in IDLE condition. Leave the furnace as clean as you found it. Press MAIN MENU to get to the starting screen Enter the required information in the logbook. 12

13 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: RECIPES Only NanoFab staff are allowed the Change, Copy or Download process recipes To change recipe parameter go to chase and use Host Computer FCS-30 and FCS-20 software programs Click on T2 bubble to open Tube 2 LPCVD recipe menu Click on refresh button to update screen recipes Click on Recipe Manager Icon to open FCS-20 software. FCS-20 home page 13

14 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: At the Function? prompt enter on the keyboard DD to list all recipes or RE to Edit Recipe then press Enter Enter User name ( TYLAN ) and password (Pulsar). Enter Configuration file name ( UTACNF.002) User name ( TYLAN ) and password (Pulsar) Configuration filename ( UTACNF.002) Enter recipe file name: filename.002 The recipe edit menu will display. Recipe filename LSNITR.002 recipe edit menu At the header cmd : widow enter the process step you want to check or change ( DEPO, etc..) At the a recipe step page ( DEPO ) press SP to display parameter set points. 14

15 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: Use arrow keys to scroll to parameter window and enter new value ( i.e time = hh.mm.ss ) Then press Enter To save changes press Home on the keyboard. The software will to a recipe error check and return to the home page. Enter Home on the keyboard again and you will exit the FCS-20 software. Recipe verification FCS-20 home page To upload the modified recipe from the FCS-20 to the FCS-30. Click on the modified recipe and the click on the arrow down function. You should see DSC-30 transporting blocks displayed To upload the modified recipe from the FCS-30 to the FCS-10 simply click on Remote Command: You should see communication with tube message displayed: 15

16 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: If either of the uploads to not complete there may be too many files on the DCS-10 computer or problem with DCS To load the modified recipe to FCS-10 go to Load Recipe sections to and perform those tasks For details of the standard recipes available, contact Nanofab Engineering staff. TYSTAR LPCVD NITRIDE RECIPE : LSNITR.002 IDLE CDITI Value Unit Instructions STEP : IDLE IDLE STATE N2BKFL SCCM BOATSPD 5.0 IPM COOLRNG PREN2 PROCESS RUN SEQUENCE STEP : STRT LOAD BACK FILL TIME: N2BKFL SCCM BOATSPD 5.0 IPM PREN2 If EVENT = then goto BTIN TEMPS out-of-tolerance Then goto CT (NO TOLERANCE STEP : BOUT BOAT OUT TIME: N2BKFL SCCM If OUTLMT = then TEMPL DEGC goto LDWF TEMPC DEGC TEMPS DEGC BOATSPD 5.0 IPM BOATOUT 16

17 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 COOLRNG PREN2 STEP : LDWF LOAD WAFERS TIME: N2BKFL SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC BOATSPD 5.0 IPM COOLRNG SIC PREN2 BOATOUT If EVENT = then goto BTIN TEMPS or PRCPR out-oftolerance Then goto CT (NO TOLERANCE STEP : BTIN BOAT IN TIME: N2BKFL SCCM BOATSPD 5.0 IPM PREN2 BOATIN COOLRNG If DNTLK = OFF then goto STB1 TEMPS or PRCPR out-oftolerance Then goto CT (NO TOLERANCE STEP : STB1 STABILIZE 550 TIME: BOATIN BOATSPD 5.0 IPM COOLRNG Then goto CT (NO TOLERANCE IF DNTLK = goto SHLD IF ANTLK = goto SHLD IF VNTLK = goto SHLD IF GASNTLK = goto SHLD IF EXHNTLK = goto SHLD IF N2PRSAL = goto SHLD STEP : VACC VACUUM Then goto CT (NO TOLERANCE 17

18 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 CHECK TIME: COOLRNG IF PRCPR > 500 MTOR goto SHLD IF DNTLK = goto SHLD IF ANTLK = goto SHLD IF BNTLK = goto SHLD IF VNTLK = goto SHLD IF GNTLK = goto SHLD IF TUBEOT = goto SHLD IF CABOT = goto SHLD IF SCROT = goto SHLD STEP : TEMP TEMP 835 TIME: N2BKFL SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC COOLRNG PREN2 Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PMP2 VAC PUMP 2 TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC Then goto CT (NO TOLERANCE COOLRNG IF PRCPR > 1000 MTOR goto SHLD STEP : PUR2 PUMP/PURGE 2 N2BKFL SCCM TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC COOLRNG PREN2 Then goto cont (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PMP3 TEMPL DEGC 18

19 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 VAC PUMP 3 TEMPC DEGC TEMPS DEGC COOLRNG Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PUR3 PUMP/PURGE 3 N2BKFL SCCM TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC COOLRNG Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD PREN2 STEP : PMP4 HARD PUMP 4 TIME: TEMPL DEGC TEMPC DEGC TEMPS DEGC Then goto CT (NO TOLERANCE COOLRNG IF PRCPR > 1000 MTOR goto SHLD STEP : LKCH LEAK CHECK TIME: TEMPL N/C DEGC TEMPC N/C DEGC TEMPS or PRCPR is out-oftolerance TEMPS N/C DEGC Then goto CT (NO COOLRNG TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : VACP TEMPL DEGC 19

20 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 VACUUM PUMP TEMPC DEGC Then goto CT (NO TOLERANCE TIME: TEMPS DEGC COLDTRP COOLRNG IF PRCPR > 1000 MTOR goto SHLD IF ANTLK = goto SHLD IF BNTLK = goto SHLD IF VNTLK = goto SHLD IF GNTLK = goto SHLD IF CABOT = goto SHLD IF SCROT = goto SHLD IF GASNTLK = goto SHLD IF EXHNTLK = goto SHLD IF N2PRSAL = goto SHLD STEP : STBP STABLE PRESSURE TIME: N2BKFL SCCM TEMPS or PRCPR is outof-tolerance Then goto CT (NO TOLERANCE TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC COOLRNG PRCPR MTOR If PRCPR > 1000 MTOR goto SHLD STEP : TMPC TEMP CHECK TIME: N2BKFL SCCM TEMPL DEGC TEMPS or PRCPR is outof-tolerance TEMPC DEGC Then goto CT (NO TEMPS DEGC TOLERANCE COOLRNG PRCPR N/C MTOR COLDTRP PREN2 STEP : PNH3 PRE NH3 TIME: TEMPL DEGC TEMPC DEGC TEMPS DEGC If Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto ABRT IF ANTLK = goto ABRT IF BNTLK = goto ABRT 20

21 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 COOLRNG PRCPR N/C MTOR IF VNTLK = goto ABRT IF GNTLK = goto ABRT IF CABOT = goto ABRT COLDTRP IF SCROT = goto ABRT IF GASNTLK = goto ABRT PREN2 IF EXHNTLK = goto ABRT IF N2PRSAL = goto ABRT PRENH3 STEP : PDCS PRE DCS TIME: NH SCCM If Then goto cont (NO TOLERANCE DCS 12.0 SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC COOLRNG PRCPR N/C MTOR COLDTRP IF PRCPR > 1000 MTOR goto ABRT IF ANTLK = goto ABRT IF BNTLK = goto ABRT IF VNTLK = goto ABRT IF GNTLK = goto ABRT IF CABOT = goto ABRT IF SCROT = goto ABRT IF GASNTLK = goto ABRT IF EXHNTLK = goto ABRT IF N2PRSAL = goto ABRT PREN2 PREDCS PRENH3 STEP : DEPO DEPOSITI TIME: NH3 N/C SCCM If NH3 or DCS out-of-tolerance Then goto ABRT (NO TOLERANCE DCS N/C SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC COOLRNG PRCPR N/C MTOR IF PRCPR > 1000 MTOR goto ABRT IF ANTLK = goto ABRT IF BNTLK = goto ABRT IF VNTLK = goto ABRT IF GNTLK = goto ABRT IF CABOT = goto ABRT IF SCROT = goto ABRT 21

22 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 COLDTRP IF GASNTLK = goto ABRT IF EXHNTLK = goto ABRT PREN2 IF N2PRSAL = goto ABRT PREDCS PRENH3 STEP : DCSO DCS OFF NH SCCM PRCPR out-of-tolerance TEMPL N/C DEGC Then goto CT (NO TOLERANCE TEMPC N/C DEGC IF PRCPR > 1000 MTOR goto ABRT TEMPS N/C DEGC COOLRNG PRCPR N/C MTOR COLDTRP PREN2 IF ANTLK = goto ABRT IF BNTLK = goto ABRT IF VNTLK = goto ABRT IF GNTLK = goto ABRT IF CABOT = goto ABRT IF SCROT = goto ABRT IF GASNTLK = goto ABRT IF EXHNTLK = goto ABRT IF N2PRSAL = goto ABRT PREDCS PRENH3 STEP : PMPP PUMP GASES TIME: N2BKFL SCCM TEMPL N/C DEGC PRCPR out-of-tolerance Then goto CT (NO TOLERANCE TEMPC N/C DEGC TEMPS N/C DEGC COOLRNG IF PRCPR > 1000 MTOR goto ABRT PRCPR N/C MTOR COLDTRP PREN2 STEP : PMP5 VAC PUMP 5 22

23 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 Then goto CT (NO TOLERANCE COOLRNG IF PRCPR > 1000 MTOR goto SHLD STEP : PUR5 PUMP/PURGE 5 TIME: N2BKFL SCCM COOLRNG PREN2 Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PMP6 VAC PUMP 6 COOLRNG Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PUR6 PUMP/PURGE 6 TIME: N2BKFL SCCM COOLRNG PREN2 Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PMP7 VAC PUMP 7 COOLRNG Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : PUR7 PUMP/PURGE 7 N2BKFL SCCM Then goto CT (NO TOLERANCE 23

24 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 TIME: COOLRNG PREN2 IF PRCPR > 1000 MTOR goto SHLD STEP : PMP8 VAC PUMP 8 COOLRNG Then goto CT (NO TOLERANCE IF PRCPR > 1000 MTOR goto SHLD STEP : STB2 STABILIZE PRESS TIME: N2BKFL SCCM PREN2 COOLRNG If TEMPC = 550 DEGC Then goto HLD1 STEP : HLD1 PURGE / HOLD TIME: N2BKFL SCCM PREN2 COOLRNG SIC Then goto CT (NO TOLERANCE IF PRCPR > 500 MTOR goto SHLD IF PRCPR < 10 MTOR goto SHLD IF N2BKFL < 100 SCCM goto SHLD IF EVENT = Then goto BKF1 STEP : BKF1 SLOW BACKFILL1 TIME: N2BKFL SCCM PREN2 COOLRNG Then goto CT (NO TOLERANCE 24

25 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 STEP : BKFL SLOW BACKFILL2 TIME: N2BKFL SCCM PREN2 COOLRNG Then goto CT (NO TOLERANCE STEP : BKF3 SLOW BACKFILL3 TIME: N2BKFL SCCM PREN2 COOLRNG Then goto CT (NO TOLERANCE STEP : BKF4 SLOW BACKFILL4 TIME: N2BKFL SCCM PREN2 COOLRNG Then goto CT (NO TOLERANCE STEP : BKF5 SLOW BACKFILL5 TIME: N2BKFL SCCM PREN2 COOLRNG Then goto CT (NO TOLERANCE BOATSPD 5.0 IPM STEP : BTOT BOAT OUT TIME: N2BKFL SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC BOATSPD 5.0 IPM BOATOUT TEMPS or PRCPR is outof-tolerance Then goto CT (NO 25

26 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 COOLRNG TOLERANCE PREN2 IF OUTLMT = then goto ULWF STEP : ULWF UNLOAD WAFERS TIME: N2BKFL SCCM TEMPL DEGC TEMPC DEGC TEMPS DEGC BOATSPD 5.0 IPM BOATOUT COOLRNG SIC PREN2 TEMPS or PRCPR is outof-tolerance Then goto CT (NO TOLERANCE +F388 STEP : CLOS CLOSE DOOR TIME: N2BKFL SCCM BOATSPD 5.0 IPM COOLRNG BOATIN PREN2 TEMPS or PRCPR is outof-tolerance Then goto CT (NO TOLERANCE IF DNTLK = OFF then goto ENDP STEP : ENDP END PROCESS TIME: N2BKFL SCCM BOATSPD 5.0 IPM COOLRNG BOATIN PREN2 TEMPS or PRCPR is outof-tolerance Then goto CT (NO TOLERANCE SPECIAL HOLD STEP STEP : SHLD TEMPL N/C DEGC 26

27 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 SPECIAL HOLD TEMPC N/C DEGC TEMPS N/C DEGC BOATSPD 10.0 IPM SIC COOLRNG BOATIN PREN2 ABORT SEQUENCE STEP : ABRT PUMP BOATSPD 10.0 IPM SIC COOLRNG BOATIN PREN2 TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE STEP : ABT1 PUMP / PURGE 1 TIME: N2BKFL SCCM BOATSPD 10.0 IPM SIC COOLRNG BOATIN PREN2 TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT2 STEP : ABT2 VAC PUMP 2 N2BKFL SCCM BOATSPD 10.0 IPM COOLRNG TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT3 27

28 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 STEP : ABT3 PUMP / PURGE 3 N2BKFL SCCM BOATSPD 10.0 IPM PREN2 COOLRNG TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT4 STEP : ABT4 PUMP 3 BOATSPD 10.0 IPM COOLRNG TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT5 STEP : ABT5 SLOW BACKFILL N2BKFL SCCM BOATSPD 10.0 IPM PREN2 COOLRNG TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT6 STEP : ABT6 BACKFILL N2BKFL SCCM BOATSPD 10.0 IPM PREN2 COOLRNG TEMPS or PRCPR is out-oftolerance Then goto CT (NO TOLERANCE IF EVENT = then goto ABT7 STEP : ABT7 N2BKFL SCCM 28

29 DOCUMENT: TYSTAR TYTAN SILIC NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0 END ABORT TIME: TEMPS or PRCPR is out-oftolerance Then goto CT (NO BOATSPD 10.0 IPM TOLERANCE PREN2 COOLRNG TEMPS : Temperature of source zone (From where the steam enters) TEMPL : Temperature of load zone (At the opposite end of source zone) TEMPC : Temperature of center zone BOATSPD : Boat speed SCROT : Silicon Controlled Rectifier Over Temperature sensor TUBEOT :Tube Over Temperature sensor CABOT : Cabinet Over Temperature sensor DNTLK : Door Interlock 29