GAS Piezo Actuator Type Mass Flow Controllers

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11 GAS Piezo Actuator Type Mass Flow Controllers Purifying the process gas is an extremely important part of forming the thin films that are required in today s semiconductor manufacturing.

1 11 GAS Piezo Actuator Type Mass Flow Controllers Purifying the process gas is an extremely important part of forming the thin films that are required in today s semiconductor manufacturing. Improving the purity of the gas involves increasing the effectiveness of purifiers and filters, as well as using ultra-clean gas flow systems. Conventional wisdom indicates that to make a gas supply system ultra clean, the areas that come in contact with the gas must be extremely well polished, and the entire system should be metal. In the controller field, where the structure of gas supply systems is necessarily extremely complex, the above were considered difficult conditions to meet. Yet HORIBA STEC succeeded in developing a method for massproducing metal diaphragm valves, and in 84, the company released its - 4 series of all-metal controllers, which came to be known as the ultra clean controllers. Research and development have continued, and now HORIBA STEC offers a variety of controllers that surpass the needs of the marketincluding the -73 series, which has become the de facto standard in compact controllers.

Piezo Actuator Type Mass Flow Controllers 12-73 series The series that became the de facto standard in compact controllers scompact: With just 16 mm between surfaces, can perform flow rate control at

scompatible with SDS (Safe Delivery Source Model): The -734 OLD model offers differential pressure control from 1.33 kpa. Conforming gases: SDS cylinders packed with ASH3, BF3, SiF4, GeF4, etc.

Compact controllers - series The best-selling series that showed the world what ultra-clean means sultra clean: All metal construction (-4M type) Mass flow controllers scompatible with a wide variety

2 Piezo Actuator Type Mass Flow Controllers series The series that became the de facto standard in compact controllers scompact: With just 16 mm between surfaces, can perform flow rate control at up to 3 SLM (N2) (up to 5 SLM (N2) is available with this series). sflow rate control at extremely low flow rates: The -73 F.S. 1 SCCM model offers flow rate control for flow rates as low as.2 SCCM. scompatible with SDS (Safe Delivery Source Model): The -734 OLD model offers differential pressure control from 1.33 kpa. Conforming gases: SDS cylinders packed with ASH3, BF3, SiF4, GeF4, etc. (SDS is a registered trademark of Matheson Tri-Gas, Semi-Gas, Semi-Gas Division, and ATMI, Inc.) sultra clean: All metal construction (-73M type) sauto-close function is standard. Compact controllers - series The best-selling series that showed the world what ultra-clean means sultra clean: All metal construction (-4M type) Mass flow controllers scompatible with a wide variety of flow rate control needs: Flow rate control between.1 SCCM and 1 SLM (N2) available in a single series. smodels that prevent thermal siphoning: Mass flow controllers that are not affected by the installation orientation (-MF/45MF types). Feature a new sensor (patent pending) that prevents thermal siphoning through the very principles of its construction. sconforming gases: C2F6, C3F8, C4F8, SF6, SiF4, etc, sultra clean: All metal construction (-4M type) sauto-close function is standard. smodel with purge mode: -SP type swide range model: -SR type -1/451 The ultimate in analog controllers Mass flow controllers shigh reliability: New sensor design, stable zero point: achieve ± mv/y (typical) shigh precision: ±.8 F.S. (-1 type) sfast response: Feature an ultra-quick start function and offer response times under a second over the entire flow rate range. smodels that prevent thermal siphoning: Mass flow controllers that are not affected by the installation orientation (-4MF type). Feature a new sensor (patent pending) that prevents thermal siphoning through the very principles of its construction. Conforming gases: C3F6, C3F8, C4F8, SF6, SiF4, etc, sultra clean: All metal construction (-41M type) sauto-close function is standard.

3 13 GAS -73 series - ( controller ) Model SEF- ( meter ) Materials used in gas contact area Valve type M: type, SUS316L, R: type, SUS316L, Viton Open at power-off: O Close at power-off: C LD 714 Standard flow rate range (N2 equivalent F.S.) (for series) 1/2/3 SCCM 5/1//5/1 /5 SCCM 1/2 SLM 3/5/1 SLM /3 SLM 5 SLM (H2:1 SLM) 2/3/5/1 SCCM SCCM 2kPa 3 SCCM 2.7kPa Standard flow rate range (N2 equivalent F.S.) (for SEF series) Flow rate control range Response speed Accuracy Linearity Repeatability Operating differential pressure (for series) Maximum operating pressure Pressure Resistance Leak Integrity Operating temperature Flow rate setting signal Flow rate output signal Drive power source 5/1//5/1 /5 SCCM 1/2/3/5/1 SLM 1 SCCM to 5 SLM: 5 to 3 kpa (d) 1 SLM: 1 to 3 kpa (d) Standard Fitting*1 1/4 VCR type or IGS 3/8 VCR type 1/4 VCR type or IGS *1 Can be made compatible with an integrated unit flange. * A model that has a signal cable connector on the side is available for use with integrated gas panels (for -734/735/7355 series). * The standard flow rate range and operating differential pressure are different in the controllers ( series) versus the meters (SEF series). * SCCM and SLM are symbols indicating gas flow rate (ml/min, L/min at C, 11.3 kpa). * Viton is registered trademark of E. I. DuPont de Nemours. /3 SLM 5/1 SLM 2 to 1% F.S. Less than 1 sec (T8) ±.5% F.S. ±.2% F.S. SLM: 1 to 3 kpa (d) to 3 kpa (d) 3 SLM: to 3 kpa (d) 3 kpa (G) 1 MPa (G) M: 5 x 1-12 Pa m 3 /s (He) R: 1 x 1-8 Pa m /s (He) 5 to 5 C (accuracy guaranteed between and 35 C).1 to 5VDC (Input impedance : more then 1MΩ) to 5VDC (Minimun load resistance 2kΩ) +VDC ± 5%, 6 ma; - VDC ± 5%, 6 ma, 2.7 VA 1.33 to 11.3 kpa (d) 5/1//5/1 /5 SCCM 1/2/3/5/1 SLM to 1% F.S. + VDC ± 5%, 6 ma - VDC ± 5%, 6 ma, 1.8 VA - series Model - SEF- ( controller ) ( meter ) Materials used in gas contact area Valve type (MK3) 45(MK3) Open at power-off: O Close at power-off: C M: type, SUS316L, R: type, SUS316L, Viton SP Open at power-off: O SR Open at power-off: O MF 45MF SUS316L Open at power-off: O Close at power-off: C Standard flow rate range (N2 equivalent F.S.) 5/1//3/5/1 /3/5 SCCM 1/2/3/5 SLM 1 SLM SLM 3 SLM 5 SLM 5 SLM 1 SLM 5/1//5 1/ SCCM 5 SCCM 1/2/3/5 SLM 5/1//3/5/1 /3/5 SCCM 1/2/3/5 SLM 1 SLM SLM Flow rate control range Response speed Accuracy 2 to 1% F.S. (MK3: ± 2% F.S.) Less than 1 sec (T8).5 to 1% F.S. (1 to 1%) ±.2% F.S. (.5 to 1%) 2 to 1% F.S. Linearity Repeatability Operating differential pressure (for series) 5 to 3kPa (d) 1 to 3kPa (d) *1 to 3kPa (d) ±.5% F.S. (MK3: ) ±.2% F.S. *1 *1 1 to 3kPa (d) to 3kPa (d) 5 to 3kPa (d) 1 to 3kPa (d) Maximum operating pressure 3 kpa (G) Pressure Resistance 1 MPa (G) Leak Integrity M: 1 x 1-11 Pa m 3 /s (He) R: 1 x 1-8 Pa m 3 /s (He) Operating temperature 5 to 5 C (accuracy guaranteed between and 35 C) Flow rate setting signal.1 to 5VDC (Input impedance : more then 1MΩ) Flow rate output signal to 5VDC (Minimun load resistance 2kΩ) Drive power source +VDC ± 5% 6mA -VDC ± 5% 6mA 1.8VA +VDC ± 5% ma -VDC ± 5% ma 2.4VA Standard Fitting 1/4 VCR type 3/8 VCR type 1/4 VCR type *1 Operating pressure under atmospheric pressure conditions on the secondary side. * SCCM and SLM are symbols indicating gas flow rate (ml/min, L/min at C, 11.3 kpa). * Gases used by the -4MK3: N2, H2, O2, He, Ar. Gases used by the -45MK3: N2, H2, O2. * Viton is registered trademark of E. I. DuPont de Nemours. -41series Model - SEF- ( controller ) ( meter ) Materials used in gas contact area Valve type Standard flow rate range (N2 equivalent F.S.)* 1 Flow rate control range Response speed* 2 Accuracy Linearity Repeatability Operating differential pressure (for series) Maximum operating pressure Pressure Resistance Leak Integrity Operating temperature Flow rate setting signal Flow rate output signal Drive power source Standard Fitting Long-term zero point stability* 3 Standard functions s 1 1 5/1//3/5/1//3/5 SCCM 1/2/3/5 SLM ±.8% F.S. 5 to 3kPa (d) M: type, SUS316L, R: type, SUS316L, Viton Open at power-off: O Close at power-off: C 2 to 1% F.S. Less than 1 sec across the entire flow rate control range (T8) ±.5% F.S. ±.2% F.S. 3 kpa (G) 1MPa (G) M: 5 x 1-12 Pa m 3 /s (He), R: 1 x 1-8 Pa m 3 /s (He) 5 to 5 C (accuracy guaranteed between and 45 C).1 to 5VDC (Input impedance : more then 1MΩ) to 5VDC (Minimun load resistance 2kΩ) + VDC ± 5%, 6 ma; - VDC ± 5%, 6 ma, 1.8 VA 1/4 VCR type mv/y typical Auto-close (AC), ultra-quick start function standard Mount-free sensor (precision ) * 4 1 SLM SLM 1 to 3kPa (d) *1 SCCM and SLM are symbols indicating gas flow rate (ml/min, L/min at C, 11.3 kpa). *2 Responsiveness from % setting (fully closed setting) until entire flow range is reached. *3 Value under set conditions (ambient temperature change within ± 2 C). *4 Models with mount-free sensor: Mass flow controllers: -1MF, -451MF; Mass flow meters: SEF-1MF, SEF-451MF * Viton is registered trademark of E. I. DuPont de Nemours

4 Piezo Actuator Type Mass Flow Controllers 14 High-speed response with ultra quick start (within one second for the entire flow control range) sultra quick start function s responsiveness during startup of each line 5V 4V 3V 2V 1V Gas A Gas B Gas C Gas D Gas E seconds Time required to achieve set flow rate, starting at sremarkable improvement in responsiveness during startup Mass flow controller valve control has traditionally been carried out through PID control, in which the sensor output signal is compared with the flow rate settings signal from the exterior of the unit. With this method, control is applied starting when the valve is still closed and continuing until an extremely low flow rate (2% F.S.) is achieved, so it takes time until the valve is able to begin controlling the gas flow rate effectively, and responsiveness within one second of start up is extremely difficult to achieve while meeting all the specified conditions. The ultra quick start function opens the valve for a brief moment, until the sensor output reaches a fixed value, after which the unit is transferred to PID control. This results in a dramatic improvement in the start-up response speed from the time when the valve is still closed until a low flow rate is achieved, and enables responsiveness across the entire flow rate control range within one second. The processes developed in recent years require low flow rate control and almost full scale flow rate control within a very short time, and since the range that a single unit can cover is quite large, a controller with ultra quick start can significantly increase both quality and throughput. Characteristics of the mount-free sensor (MF sensor) swhat is thermal siphoning? Thermal siphoning is a kind of convection that can occur within the flow rate sensor as the sensor is heated up. This convection can result in the output of a flow rate signal that resembles zero point drift, even when the flow rate is not being controlled. Thermal siphoning is more likely to be affected if the controller is installed vertically. The effect created varies in proportion with the molecular weight and pressure. sthe design of the mount-free sensor (MF sensor) The mount-free sensor is a newly designed sensor (patent pending) that prevents the orientation of the unit from being a factor through the very principles of its construction. The equivalent heater is constructed to prevent convection. It is suitable for use with C3F8, C4F8, SF6, SiF4, and other similar gases. Heater Sensor Bypass Gas Inlet Zero output voltage (mv) Gas: C4F8 Primary pressure: kpa Connecting the -SP/SR s-sp This model offers improved purge efficiency. : When the valve open signal is input to the valve open/close signal input pin through an SC-EH2 type cable, it is possible to achieve a purge flow rate several times higher than that of ordinary models. SC-EH2 type cable s-sr This model offers improved purge efficiency. : When the valve open signal is input to the valve open/close signal input pin through an SC-EH2 type cable, it is possible to achieve a purge flow rate several times higher than that of ordinary models. SC-EH2 type/dh2 type Purge input Conversion adapter F.G. ground SP PAC DU SU SR Zero adjustment Communications SC-E4/D4: CA-4W SC-EH2/DH2: CA-HW

5 21 GAS Mass flow controllers for integrated gas panels Integrated gas panels are made up of separate modules, including controllers, valves, regulators, filters, and so on, that perform the functions that were traditionally performed by parts in gas supply systems. Integrated gas panels can be manufactured without welding joints and piping since individual modules are used, and they are smaller and easier to maintain than traditional gas supply systems. sadvantages Compatible with a wide variety of fittings Compatible with every type of fitting, including C seals, CS seals, and W seals. Easier to maintain Unidirectional desorption makes it easier to desorb the controller. Less dead volume The amount of useless volume at the joint area is greatly reduced. ssample integrated gas panel design Hand valve Regulator Air valve Filter Flow Air valve Pitch size 1.1 inch 1.5 inch Compatible model series -Z512 series -Z1D series (DeviceNet compatible controllers) -73 series -Z512/522 series -Z1DW series (DeviceNet compatible controllers) -F7 series -F4 series -V1D series -73 series SUC processing After machining, the surface of the stainless steel (SUS316L) that makes up the unit is polished until its roughness is at the sub-micron level. sadvantages Improves gas emission characteristics. Controls particle generation. Valve Sensor OUT CRP processing After machining, the surface of the stainless steel (SUS316L) that makes up the unit is subjected to composite electrolytic polishing, and then a 1% Cr2O3 oxidation film is formed on the surface. sadvantages Reduces outgassing of moisture and hydrocarbon gases. Increases resistance to corrosion by chlorine gases (highly corrosive gases). Has a non-catalytic effect on the spontaneous decomposition of SiH4/B2He and other similar chemicals. Suppresses contamination by particles from certain corrosive gases. soutgas data 1/4 x 2 Ar, 1.2 L/min, RT 1 hours 1 EP CRPS IN Surface roughness measurement sresults of surface roughness measurement.2 µm.1 µm H2O concentration (ppb) Time (minutes) snon-catalytic data 1 1/4 x 1 m Ra.35 µm RMS.35 µm Rt.1 µm Ro.6 µm Rv.6 µm Rz. µm Sm.113 µm SC 13 TL Slope.3 Rmax.31 µm Measurement conditions Measurement scaling factor Drive speed Cutoff Measurement length Results 5.3 mm/s.8 mm 2.5 mm SiH4 concentration (ppm) Pure Ni Hastelloy-EP SUS316L -EP SUS316L -CRPS Temperature ( C)

6 Mass Flow Controllers 22 Connecting analog controllers (examples) sconnecting to a digital power source, display unit, and settings unit Basic connections SC-Eseries Display unit DU-12 Settings unit SU-52 PAC series sconnecting to a dedicated controller Control using PAC-S6 SC-Dseries Control using PAC-D2 SC-Dseries PAC -S6 Flow rate output Flow rate alarm (high/low) PAC -D2 Flow rate output Flow rate alarm (high/low) Program control External control mode Flow rate setting Valve fully open/fully closed signal Etc. External control mode Flow rate setting Valve fully open/fully closed signal Etc. Control using an FI-11 integrator/control unit SC-Dseries FI- 11 Flow rate output Flow rate alarm (high/low) Integrated flow rate control External control mode Flow rate setting Valve fully open/fully closed signal Etc. sconnecting to an external controller Basic connections SC-Aseries Flow rate setting signal: to 5 VDC Flow rate output signal: to 5 VDC Alarm output (for some models) Valve control signal: Fully open/fully closed Drive power source: ± VDC Connector connections Pin no Signal name Valve forced open/close signal Analog flow rate output signal ( to 5 VDC) Power source input (+ VDC) COMMON power source Power source input (- VDC) Analog flow rate setting signal ( to 5 VDC) COMMON signal Alarm (option) Valve voltage monitor (option) Connector used: D-subminiature contact pin connector (with M3 fitting screws)

7 Mass Flow Controllers 26 Choosing the appropriate controller model and specifications s series -733 Model M *1 Seal material O *2 Valve structure SUC *3 Gas contact area surface processing Ar *4 Gas types 1SCCM *5 Full-scale flow rate and unit 1/4VCR *6 Fitting Individual specifications *7 *1 Select the seal material. M: Metal seal R: Rubber seal If you are using poisonous or corrosive gases, we recommend using M (metal) as the seal material. (Examples: AsH3, B2H6, PH3, GeH4, H2Se, BCl3, BF3, Cl2, F2, HBr, HF, SiCl4, TiCl4, CiF3, HCI, WF6, etc.) *2 Select the desired valve state for when there is no electricity. (Select the desired normal valve state.) O: Open C: Closed (This option is not available for flow meters.) *3 Gas contact area surface processing The gas contact area can be processed to ultra clean levels (option). SUC: Surfaces are polished until the roughness is at the sub-micron level. CRP: A CRP film (passivation film) is formed on the gas contact surfaces (stainless steel). *4 Select the types of gas you wish to use. *5 Select the full scale flow rate and flow rate unit. The flow rate unit is usually noted at C or C (11.3 kpa). See Chart 1 for more information. *6 Fitting A variety of contact joints other than 1/4 VCR type fitting can be used. Units can also be made compatible with integrated gas panels. Please contact HORIBA STEC for more information. Chart 1 Flow rate unit L/min ml/min C display SLM SCCM C display LM CCM *7 Units can be adjusted to meet non-standard specifications. Please contact HORIBA STEC for more information. sdigital interface RS-5.F-Net protocol : -Z512MG/Z522MG RS-422A.F-Net protocol : -F7series -V1Dseries DeviceNet : -Z514MG/Z524MG -Z1D/Z1DWseries Series -Z5 -Z1D/DW -F7 -V1D G1A -E4J -E Standard Flow Range (N2 Equivalent F.S.) 5SCCM to 5SLM 5SCCM to 1SLM 5SCCM to 3SLM 1SCCM to 5SLM 1SCCM to 1SLM 5SCCM to 1SLM 5SCCM to SLM 1SCCM to 5SLM 1SCCM to 3SLM 1SCCM to 5SLM 5SCCM to 1SLM 1SCCM to 1SLM 5SCCM to SLM Operating temparture Seal material Interface Fitting Internal Normal High surface Digital (F-Net) Digital Metal Rubber Analog VCR Type Swagelok IGS temp model temp model polishing RS-422A RS-5 DeviceNet type 1.1inch 1.5inch Standard Standard Standard Mass flow meters: For the SEF series, please start by deciding without valve structure and then consider the other options.

8 27 GAS Dimensions <1> -Z M4 P.C.D.42±.1 <2> -V1 series -Z1D series 45 2-M4 P.C.D.42±.1 H E W I T A B D C <3> -46 -Z13DW M8 4-M4 5 <4> M4, depth 5 R.4 3 *Please contact HORIBA STEC for information on details not shown here Model H T W I (1/4 VCR) -Z512 -Z522 -Z11D -Z12D -Z13D -Z11DW -Z12DW -Z13DW -F73 -F74 -F75 -F -F45 /SEF-V11DM /SEF-V1DM -73 /SEF (LD) /SEF-735 /SEF-7355 SEF-714 /SEF-(MF) /SEF-45(MF) /SEF-455 /SEF-46 -SP/SR -1(MF) -451(MF) -EJ -E45J -E4(MK3) -E5(MK3) -E6 -E7 /SEF-647 *1 /SEF-64 *1-834 /SEF-8 /SEF-845 /SEF-8455 /SEF-846 /SEF-241 /SEF-1 /SEF-51 /SEF-31 /SEF-3 /SEF-4 /SEF-5 /SEF-55 /SEF-6 *1-4MK2 3-5MK *2 16 *2 16 *2 16 *2 16 *2 16 *2 16 *2 16 *2 16 * I (1/4 Swagelok) *1 Please contact HORIBA STEC for details on the dimensions of the /SEF-647/64. *2 Surface dimensions: mm models can also be produced. * Please contact HORIBA STEC to request a copy of the dimension drawing. * Equivalent products are sometimes used in place of the joints listed here. I (3/8 VCR) I (3/8 Swagelok) A B C D E See <1> See <3> See <3> See <4>

9 Mass Flow Controllers Accessory dimensions spac-s6 Max or higher spac-d1/d Max *3 or higher *1 or higher spac-1i spac-4i/6i ±.3 4-M ± ±.2 sdu-12e 2-ø 2-M3 tap sdu-12k ± ± ±.3.7± Panel thickness:.8 mm to 3. mm 7 5±1 83± ssu-52ed Digital dial 168 dia Panel installation opening 3.3 dia. 1.5 dia. ssu-52ea * 24 1 dia. 22/2 dia..5 dia. Panel installation opening 1.5 dia..5 ssettings unit.1.6±.7 ø6 ø1.3 3/8- UNEF thread dia sfi n *1 or higher 1.6 *Where n is the number of PAC-S6 units installed. +.5 n-2 *Where n is the number of PAC-D1/D2 units installed. 118±2 ± ±2 (2±2) M4 3 1 * Dimensions in parentheses ( ) are for the PAC-61. Analog dial 1

GAS Solenoid Actuator Type Mass Flow Controllers

5 GAS Solenoid Actuator Type Mass Flow Controllers Smaller, less expensive equipment offering more functions is now considered a primary factor in increasing productivity. The demand for smaller, more