S-200W LP WHITE THERMAL CURE LEGEND INK

Transcription

1 S-200W LP WHITE THERMAL CURE LEGEND INK Screen Print Application Longer Pot Life (minimum of 14 days) Meets NASA Outgas Requirement RoHS Compliant Excellent Heat Resistance in HASL Low Odor 1 P a g e Revised April 03, 2017

2 PROCESSING PARAMETERS FOR S-200W LP LEGEND INK Taiyo S-200W LP is a two-component, thermal curable, white legend ink having outstanding printability, adhesion, and color retention. S-200W LP is available in 1 kg-set size. S-200W LP meets the performance requirements of A-A as it applies to printed circuit board application and to IPC All Taiyo America products comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and electronic equipment. S-200W LP COMPONENTS S-200W LP Part A / Part B Mixing Ratio 95 parts 5 parts Color White White Warranty Period 9 months at 68 F MIXING S-200W LP is supplied in pre-measured containers with a mix ratio by weight of 95 parts S-200 Part A and 5 parts S-200 Part B. S-200W LP can be mixed by hand with a mixing spatula for 5 10 minutes. Mixing can be done with a mechanical mixer at low speeds to minimize shear thinning for 5 10 minutes. Also, mixing can be done with a paint shaker for 5 minutes. The S-200 may be diluted with glycol ether and propylene glycol ether solvents. PRE-CLEANING Prior to legend ink application, the surface needs to be free of contaminates. We recommend that the surface be cleaned chemically to make sure there are no contaminates on the surface. It is not a good idea to mechanically scrub the solder mask prior to applying the legend ink. 2 P a g e Revised April 03, 2017

3 PROCESSING PARAMETERS FOR S-200W LP LEGEND INK SCREEN PRINTING Method: Single Sided and Double Sided Screening Screen Mesh: Screen Mesh Angle: 22.5 Bias Screen Tension: Newtons Squeegee: durometer Squeegee Angle: Printing Mode: Flood / Print FINAL CURE S-200W LP needs to be thermally cured to insure optimal final property performance. Thermal curing can be done in a batch oven or conveyorized oven. Temperature: 300 F (149 C) Time at Temperature: minutes For Process Optimization please contact your local Taiyo America Representative Taiyo America, Inc. (TAIYO) warrants its products to be free from defects in materials and workmanship for the specified warranty period (S- 200W LP Warranty period is 9 Months) provided the customer has, at all times, stored the ink at a temperature of 68 o F or less. TAIYO accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product materially and adversely, shall void this limited warranty. 3 P a g e Revised April 03, 2017

4 FINAL PROPERTIES FOR S-200W LP LEGEND INK S-200W LP: CID A-A-56032D PERFORMANCE REQUIREMENTS Adhesion Test Electrical Resistance (Type II) Abrasion Resistance Chemical Resistance Before Conditioning After Conditioning A-A-56032D Paragraph Chemical Resistance (Type II) Salt Spray Resistance Light Fastness Stability Fungus Resistance Test Method / Requirement Cured ink impressions shall not deteriorate when subjected to trichloroethylene vapors at 86.5 o to 88 o C for a period of not less than three minutes and not greater than six minutes. 1 x ohms minimum 1 x ohms minimum Cured ink impressions shall retain their legibility after subjection to 300 to 303 revolutions of the CS-10 abrasive wheel while under a minimum load of 2.2 pounds in accordance with ASTM D4060. Cured ink impressions shall retain their legibility when immersed for a minimum of 30 minutes in water, denatured ethyl alcohol, and non-odc (Ozone Depleting Chemical) cleaning solvent. In addition to 3.9.2, Type II cured ink shall be resistant to hot solder and solder flux. Cured ink impressions shall not deteriorate when exposed to a 5 percent salt spray solution at 33 o to 37 o C for a period of not less than 48 hours. Cured ink impressions shall not fade and shall remain legible when tested by a light fastness test. To determine conformance, one half of the surface of the test specimens shall be covered to obscure light, and the remaining half shall be exposed for 24 hours to the light source outlined in ASTM G153 using daylight filter and exposure cycle 7 or ASTM G155 using window glass filter and exposure cycle 4. Cured ink impressions shall not fade, chip, peel, or flow and shall remain legible when exposed to a temperature of 118 o to +/- 3 o C for a period of not less than 24 hours. Cured ink impressions shall not support fungi growth when inspected. Results (1.9 x ) (8.6 x ) (303 revolutions) (ASTM G155 using window glass and exposure cycle 4) 4 P a g e Revised April 03, 2017

5 FINAL PROPERTIES FOR S-200W LP LEGEND INK S-200W LP: IPC-4781 MATERIAL SUPPLIER TESTING REQUIREMENTS Test IPC-4781 Paragraph Requirement Results Hardness Minimum 2H - 7H Adhesion to Solder Mask Materials Zero percent loss over base laminate and solder mask material shall not exhibit Resistance to Solvents and delamination, cracks, tackiness, Cleaning Agents swelling, or permanent degradation when exposed to the conditions listed in IPC-TM-650, Method Hydrolytic Stability / Aging No change after 28 days of o C and 90 98% RH Resistance to Tin-Lead Solder Resistance to Lead-Free Solder Simulation of Lead-Free Reflow M&IR (SIR) Before Soldering In Chamber Before Soldering Out of Chamber After Soldering In Chamber After Soldering Out of Chamber Electrochemical Migration 3.9.2, no dendritic growth (4.3x10 9 ohms) (6.2x10 12 ohms) (1.3x10 9 ohms) (8.6x10 12 ohms) (6.21x10 12 ohms) Thermal Shock No blistering, crazing, or delamination Cure Ref.: 3.5.1, , 3.7.2, Non-Nutrient Does not contribute to biological growth Visual Requirements 3.3 Uniform in appearance Additional Tests / Results TEST REQUIREMENT RESULT Outgassing Test ASTM E Processing Condition 150 o C / 60 minutes TML 1 % CVCM 0.10% TML=0.56% CVCM=0.02% 5 P a g e Revised April 03, 2017