Plasma Cleaner. Yamato Scientific America. Contents. Innovating Science for Over 125 Years. Gas Plasma Dry Cleaner PDC200/210/510 PDC610G.

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1 Yamato Scientific America Innovating Science for Over 125 Years Plasma Cleaner Contents Gas Plasma Dry Cleaner PDC200/210/510 PDC610G Gas Plasma Reactor

Gas Plasma Dry Cleaner Plasma Surface Treatment Device PDC200/210/510 High frequency output 300W (PDC200) 500W (PDC210/510) Stage size 250 170mm (PDC200/210) 410 210mm (PDC510) Small and compact,

uniformity Simple touch panel system (Direct Plasma) mode Plasma processing of CSP, BGA, COB substratum Removal of organic films and metal oxidized films Dry cleaning of printed circuit board

2 Gas Plasma Dry Cleaner Plasma Surface Treatment Device PDC200/210/510 High frequency output 300W (PDC200) 500W (PDC210/510) Stage size mm (PDC200/210) mm (PDC510) Small and compact, suitable for R&D purposes Simple and compact plasma surface treatment device (Reactive Ion Etching) Plasma mode, with (Direct Plasma) mode as option Excellent electrode structure for plasma uniformity Simple touch panel system (Direct Plasma) mode Plasma processing of CSP, BGA, COB substratum Removal of organic films and metal oxidized films Dry cleaning of printed circuit board Surfactant process LED assembly For R&D Oxygen molecule Oxygen atom (ion) Sample Wafer and etc. Box Carbon dioxide Quartz stand PDC210 Diagram (Direct Plasma) mode (Reactive Ion Etching) Ion Etching) mode mode Oxygen molecule Oxygen atom (ion) Sample Wafer and etc. Carbon dioxide Quartz stand Ar Ions Inorganic matter Si wafer and etc. Box box Model PDC200 PDC210 PDC510 Plasma mode ( mode option) / selectable Electrode structure Parallel flat stage plate Vacuum gauge Capacitance manometer High frequency output Max 300W Max 500W Oscillation frequency 13.56MHz Quartz oscillator Output setting method Manual setting on LCD touch panel method Auto tuning Controller Programmable (Reactive Ion Etching) mode Display LCD touch panel size W400 D250 H150mm W500 x D300 x H200mm Stage size W250 D170mm W410 x D210mm material Aluminum gas Ar Ions 2 systems (Argon, Oxygen) Nitrogen or dry air Inorganic gas flow control Flow meter matter Mass flow controller Rotary vacuum pump (optional) ~345L/min. Si wafer and etc. ~500L/min. External dimensions W540 D600 H600mm W540 D600 H600mm W700xD700xH700mm Weight ~100kg ~105kg 180kg box Power source Single phase AC115V 50/60Hz 3-phase AC200V~AC240V 50/60Hz 145 PDC200/210/510

Gas Plasma Dry Cleaner Multi Stage Plasma Cleaner PDC610G High-frequency Output 600W Stage size 250 x 220 mm 1-stage, 2-stages, 3-stages selectable Standards FCC / CE compliant FCC and CE certified

among 1-stage, 2-stages, and 3-stages Supports processing of a vertical magazine / modes selectable Supports integrated data logger (optional) point memory function (optional) Complies with FCC and

plating Processing of LED related commercial products Cleaning of electronic parts Resist peeling or residue removal after wetting process Cleaning of accuracy parts including optics and optical

3 Gas Plasma Dry Cleaner Multi Stage Plasma Cleaner PDC610G High-frequency Output 600W Stage size 250 x 220 mm 1-stage, 2-stages, 3-stages selectable Standards FCC / CE compliant FCC and CE certified compact plasma cleaner with selectable / modes and switchable electrodes (1 to 3 stages) covering a wide range of applications Maximum power of 600W with compact package Electrodes can be switched among 1-stage, 2-stages, and 3-stages Supports processing of a vertical magazine / modes selectable Supports integrated data logger (optional) point memory function (optional) Complies with FCC and CE standards Improvement of adhesiveness of various materials and surface reformation Light ashing and light etching process Pretreatment of implemented board bonding, plastic package and print board plating Processing of LED related commercial products Cleaning of electronic parts Resist peeling or residue removal after wetting process Cleaning of accuracy parts including optics and optical fibers, or machine parts Reformation of resin surface including fluoro resin Model Plasma mode Electrode structure Vacuum gauge High frequency output Oscillation frequency Output setting method method Control device Display size Stage size material Reactive gas Vacuum pump External dimension Exterior material Power source Standards PDC610 / selectable 3-stage independent parallel flat plates Capacitance manometer Max 600W 13.56MHz Quartz oscillator Manual setting on LCD touch panel Auto tuning Sequencer LCD touch panel W350 x D270 x H300 mm W250 x D220mm Three stages Aluminum 2 systems (Argon and Oxygen) Nitrogen or dry air Rotary vacuum pump (Approx. 345 L/min) W600 x D722 x H700 mm Stainless steel 3-phase AC200V~AC230V 50/60 Hz 15A (vacuum pump included) FCC / CE marking Plasma Discharge PDC610G 146

Gas Plasma Reactor Compact, Barrel Type, Low Temperature Ashing Device High-frequency output 200W (PR200) 300W (PR300/301) chamber ø100 x 160mm x 1 (PR200) ø64 x 160mm x 3 (PR300) ø118 x 160mm x 1

Isotropy barrel type Compact, space saving design Capable of removing coated organic matter Adjustable RF suitable for various applications Outstanding operability and safety Can be set for a wide

4 Gas Plasma Reactor Compact, Barrel Type, Low Temperature Ashing Device High-frequency output 200W (PR200) 300W (PR300/301) chamber ø100 x 160mm x 1 (PR200) ø64 x 160mm x 3 (PR300) ø118 x 160mm x 1 (PR301) Wide range of application from ashing, etching, dry cleaning, etc. Isotropy barrel type Compact, space saving design Capable of removing coated organic matter Adjustable RF suitable for various applications Outstanding operability and safety Can be set for a wide range of output conditions to handle a variety of testing samples Functionalization of the polymeric material surface improves adhesion Oxidation reaction generates functional groups -OH, >C=O, -COOH on the surface (very small amount of water and carbon dioxide will impact) In nitrogen plasma, a nitrogen atom is incorporated onto the surface, generates a functional group -NH2 Resist peeling Surface modification of materials (metals, polymers, films, ceramics, etc.) Asbestos pre-processing (ashing of membrane filter) Low-temperature ashing (polymer material, coal, food, etc.) PDMS chips bonding to glass and PDMS substrate Production of semiconductors and analysis work PR200 PR300 PR301 Model PR200 PR300 PR301 Plasma mode Direct plasma () High frequency output Max. 200W Max. 300W (100W x 3 chambers) Max. 300W Oscillation frequency 13.56MHz Tuning method Auto matching Manual biaxial chamber Pyrex glass, ø mm x 1 chamber Pyrex glass, ø64 160mm 3 chambers Pyrex glass, ø mm x 1 chamber gas 1 system (oxygen), flow meter control with dry air purge gas Control system Manual leak valve Auto pressure reduction, auto leak valve Piping material Stainless steel, Teflon Stainless steel, Teflon, Copper and Brass Stainless steel, Teflon External dimensions(w D H) 350 x 400 x 500mm mm mm Weight ~25kg ~36kg ~34kg Power source (50/60Hz) AC115V AC115 / AC220V Optional accessories Sample dish, vacuum pump Sample dish, stand, shelf, vacuum pump 147

5 Operation Flowchart Control Panel Main switch Power switch Predecompression Evacuation Gas switch Gas valve CLOSE Piping System (PR300) T Normal Pressure Stop Gas switch Gas valve OPEN Termination PR200 PR300, PR301 PR200 1 chamber (ø100 x 160mm) Example application: asbestos analysis pre-processing Collected to membrane filter Deposited with acetone vapor Acetone PR300 3 chambers (ø64 x 160mm) Contamination free PR301 1 chamber (ø118 x 160mm) Ashing filter with oxygen plasma Interior The gas plasma equipment has a wide range of applications from ashing, etching, dry cleaning, etc. PR301 with observation window PR300 with observation window PR500 Accessories SEM-EDS analysis Phase-contrast microscope Sample dish Sample shelf for PR300 Sample shelf for PR

Gas Plasma Reactors Compact, Barrel Type, Low Temperature Ashing Device High-frequency output 500W chamber ø215 x 305mm Designed with large chamber size made of quartz considered almost completely

6 Gas Plasma Reactors Compact, Barrel Type, Low Temperature Ashing Device High-frequency output 500W chamber ø215 x 305mm Designed with large chamber size made of quartz considered almost completely resistant against most plasma processes PR500 (Manual version) PR510 (Touch panel version) Compact, space saving design with oscillation section integrated with a portion of the chamber Outstanding operability and safety with the automatic tuning system as standand component Equipped with a large quartz chamber (ø215mm) which can process big testing samples Removal of photoresist Cleaning of parts Surfactant treatment Micro polishing Corresponds to wafer and glass substrate Model PR500 (Flow meter) PR510 (Mass flow meter) Method Barrel type chamber direct plasma High frequency output Max. 500W Oscillating frequency 13.56MHz Tuning method Automatic tuning chamber Made of quartz, ø mm gas Dual system (O2 / CF4) Control system Manual Automatic touch panel Piping material Stainless steel, Teflon External dimensions (W D Hmm) Weight ~60kg ~60kg Power source (50/60Hz) AC115V / AC220V Standard accessories Connection cable: 1 complete set Vacuum grease: 1 pc. O-ring for reaction chamber: 1pc. Optional accessories Frame for wafers (2, 3, 4, 5, 6 inches) Multi-purpose angled frame Aluminum etching tunnel Stand 149

Pressure Stop Termination Piping System ()

The gas plasma equipment has a wide range

7 Operation Flowchart Control Panel Main switch Power switch Predecompression Evacuation T Gas switch Gas valve OPEN PR500 Gas switch Gas valve CLOSE Normal Pressure Stop Termination Piping System () Wafer Ashing ø215mm large caliber chamber The gas plasma equipment has a wide range of applications from ashing, etching, dry cleaning, etc. 150

The SPI Sputter Coater Handbook

The SPI Sputter Coater Handbook Coating of Specimens SPI-Module Sputter Coater with Etch Mode 1. Mount the specimens onto the SEM stub. Keep in mind that many adhesives have high vapor pressure solvents