Extending Probe Card Life for Fine Pitch Probe Cards Gene Humphrey International Test Solutions, Inc. June 10, 2002

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1 Extending Probe Card Life for Fine Pitch Probe Cards Gene Humphrey International Test Solutions, Inc. June 10, 2002 Southwest Test Workshop 9-12 June 2002 Long Beach, CA USA 1

2 Material Considerations Relative Accumulation Comparison of 5 Common Probe Materials Effects of Probe Tip Roughness Effect of Cleaning Materials Comparison of 4 Common Probe Materials Comparison of 5 Common Cleaning Materials 2

3 Accumulation Study 5 Probe Cards One each of ReW, W, BeCu, P, NTK Each Card with 10 Probes of the Same Material Same Build Configuration Study Conducted in Production Environment No Electrical Testing One Touch per die 3 mil Overdrive Same Test Condition for All Cards No Cleaning 3

4 Probe 1 Comparison ReW Baseline ReW 10TD ReW- 50TD ReW 100TD W Baseline W 10TD W- 50TD W 100TD 4

5 Comparison Probe 1 BeCu Baseline BeCu 10TD BeCu- 50TD BeCu 100TD NTK Baseline NTK 10TD NTK- 50TD NTK 100TD 5

6 Probe 1 Comparison P Baseline P 10TD P- 50TD P 100TD 6

7 Probe 2 Comparison ReW Baseline ReW 10TD ReW- 50TD ReW 100TD W Baseline W 10TD W- 50TD W 100TD 7

8 Probe 2 Comparison BeCu Baseline BeCu 10TD BeCu- 50TD BeCu 100TD NTK Baseline NTK 10TD NTK- 50TD NTK 100TD 8

9 Probe 2 Comparison P Baseline P 10TD P- 50TD P 100TD 9

10 Probe 3 Comparison ReW Baseline ReW 10TD ReW- 50TD ReW 100TD W Baseline W 10TD W- 50TD W 100TD 10

11 Probe 3 Comparison BeCu Baseline BeCu 10TD BeCu- 50TD BeCu 100TD NTK Baseline NTK 10TD NTK- 50TD NTK 100TD 11

12 Probe 3 Comparison P Baseline P 10TD P- 50TD P 100TD 12

13 Accumulation Conclusions Relative Accumulation ReW and W Accumulate at nearly the same rate BeCu and NTK Accumulate at nearly the same rate P Accumulation Rate Least of All Materials Studied Substantial Difference in the Accumulation on ReW and P 13

14 Effect of Roughness Does the Probe Roughness Effect Accumulation Rates? One ReW Probe Card 100 Touchdowns After Sanding Flat with 3µm Lapping Film 100 Touchdowns After Sanding Flat with 0.5µm Lapping Film No Electrical Testing 14

15 0.5 µm vs 3 µm Probe 1 Probe 2 Probe 3 Probe 4 Probes sanded with 0.5µm AlO2 lapping film, 100TD Probe 1 Probe 2 Probe 3 Probe 4 Probes sanded with 3µm AlO2 lapping film, 100TD ReW Probes, same probes, same OD 15

16 Roughness Conclusion Appears That Roughness Does Effect the Rate of Accumulation of Material on the Probe Tips 16

17 Durability Comparison An Extremely Abrasive Analysis Troy Harnish and Bill Wenholz, SWTW

18 The Evaluation Basics Identical and simple probe cards One probe card designated for each cleaning material Cantilever design (epoxy ring) Probe metallurgy and target size (flat) Tungsten (25um) Rhenium Tungsten (25um) Beryllium Copper (25um) Palladium (25um) Cleaning products in wafer format Common probe card metrology analysis Z only cleaning motion with indexing & OD extremes 18

19 3µm-LF SEM Comparison ReW P BeCu W Baseline 100k Touchdowns 19

20 0.5µm Cushion Lapping Film ReW P BeCu W Baseline 100k Touchdowns 20

21 Sanding Debris Tungsten - 75µ l Rhenium Tungsten - 80µ l 21

22 Tungsten Carbide SEM Comparison ReW P BeCu W Baseline 500k Touchdowns 22

23 Tungsten Carbide Photos Mushroom Effect Mushroom effect Tungsten Beryllium Copper 23

24 Custom Ceramic SEM Comparison ReW P BeCu W Baseline 500k Touchdowns 24

25 Custom Ceramic Photos Mushroom Effect 25

26 Probe Polish 99 SEM Comparison ReW P BeCu W Baseline 1 Million Touchdowns 26

27 Durability Conclusions ReW and W Most Durable P and BeCu Much Less Durable Tungsten Carbide and Ceramic Less Destructive Than Any Lapping Film Probe Polish Least Destructive 27

28 Reshaping Tests On Going Research Goals Reshaping Materials for Each Common Probe Materials Control the Shape Cost Effective Option to Extend Probe Card Life 28

29 BEFORE/AFTER W Probe, 6000 Touchdowns 29

30 X DIAMETER CHANGE TUNGSTEN PROBE RESHAPE MICRONS BEFORE AFTER PROBE # 30

31 Y DIAMETER CHANGE TUNGSTEN PROBE RESHAPE MICRONS BEFORE AFTER PROBE # 31

32 Reshaping Recipe 32

33 Reshaping Plate 33

34 Tip Cleaning Window 34

35 Conclusion The Cleaning Recipe Must be an Integral Part of the Overall Test Program Different Probe Materials Accumulate Debris at Different Rates Surface Roughness Effects Debris Accumulation 35

36 Conclusion Material Used in Cleaning Dramatically Effects Probe Card Life Reshaping Probes can Extend Probe Card Life 36

& Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards

A A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards Jae-Ha Lee Byung-Ho Jo Dr Phicom Corporation May 12, 2003 1 Probe Card Comparison Criteria 1. MEMS