*1) *1) *1) *2) *3) *4) *4) *4) *5) *5) *5) *6) *6) *6) Research ad Developmet Cocerig Advacemet of Composite Product by Ijectio i Mold Improvemet of Iterfacial Adhesio Performace MIKI Yasuhiro *1), NAKAI Takeo *1), NISHIMURA Keiichi *1), MITSUHASHI Masaori *2), YOKOYAMA Atsushi *3), OTANI Keichi *4), YAGUCHI Syuichi *4), ENDO Norihiro *4), NAKAGAWA Takashi *5), UEDA Yoshika *5), KIRIYAMA Akiyoshi *5), AZUMA Moriya *6), ISHIMARU Takeshi *6) ad SUNAGARE Masayuki *6) Advacemet of composite product techique i mold was itegrated to create the compoud ijectio moldig product which has the characteristic ot obtaied by a sigle resis, ad the improvemet of the adhesio performace of ijectio moldig resis was examied. The curret state of the adhesio performace betwee two kids of resis was evaluated by usig eleve kids of marketed resis accordig to the value of the tesile stregth. As a result, it was thought that the resi o the base side had to select either of resi of ABS, PA66, PA66+G3, PC or PC+G3 resis accordig to the use state of a real product whe the urethae was molded o the surface side of the product. It has bee uderstood that adhesio of betwee the PPO resi ad the urethae resi, ad POM resis with a o the whole difficult fabricatio becomes possible, sice the improvemet of the adhesio performace betwee resis two kids is examied with UV lamp. O the other had, adhesio the resi with a o the whole difficult fabricatio became possible by part heatig the adhesive iterface with the haloge lamp at about te secods. Especially, the adhesio performace of PP resis ad POM resis were improved up to about 8% of matrix tesile stregth i the maximum by part heatig with the haloge lamp. 5 Table 11 Table Table Urethae FS12S-18SAE 13) Fig. JIS K7113 1 Fig. Table Table *1) *2) *3) *4) *5) *6)
6 No.2923 Resi Resis ad stadard coditios of ijectio moldig Brad Maufacturig Compay Temperature (K) Pressure () Speed () Temperature of Mold (K) Polypropylee PP PS69 Chisso Co., Ltd. 493 1 9 323 ABS ABS Kralastic K-2938A Nippo A&L Ic. 53 55 9 323 Nylo 66 PA66 Amila CM31N Toray Idustries, Ic. 543 15 9 333 Nylo 66 PA+G3 Amila + GF3% CM31G3 Toray Idustries, Ic. 543 15 9 333 Noryl PPO 731-71 GE Plastics Japa Ltd. 533 5 9 343 Acetal Copolymer POM Duraco M9S Polyplastics Co., Ltd. 473 25 9 353 Polybutylee Terephthalate PBT Duraex Polyplastics Co., Ltd. 58 4 9 353 Polypheylee PPS DIC-PPS Daiippo Ik & 593 25 9 393 Sulfide FZ-114 Chemicals, Ic. Polycarboate PC Novarex 725A Mitsubishi Egieerig Plastics Co. Ltd. 553 6 9 363 Polycarboate PC+G3 Novarex Mitsubishi Egieerig + GF3% 725G3 Plastics Co. Ltd. 553 6 9 363 Urethae Urethae Miractra E998 Japa Miractra Co., Ltd. 473 55 9 318 Speed Pressure Temperature Various coditios of ijectio moldig Level 1 Level 2 Coditio described i Table 1 2% is decreased from the described coditio i Table 1. Coditio described i Table 1 2% is icreased from the described coditio i Table 1. Coditio described i Table 1 It is 2K high temperature i Table 1 from the described coditio. Specime (JIS K7113) Chael of meltig resi Appearace of ijectio molded specime (b)diagoal (c)with steps (a)vertical The forms of bush made of brass prepared for the first test specime (Shape o adhesio sidevertical, diagoal, ad with steps for chael of meltig resi) 25-36A- S/N145 2mm 3mJ 36 12 UL-SH2 6 6mm 251 2 Fig. PP POM 9Ksec PA66 PPO 12Ksec 5565 23 5 5mm/miUrethae 1mm/mi 5mm
Liftig speed of temperature / sec -1 15 1 5 5 7 8 15 175 245 Output power of haloge heater /W Liftig speed of temperature o surface of resi by haloge irradiatio (PPO resi, PA66 resi) (PP resi, POM resi) Table Table Table Table ABSPA66PPOPBTPPS PC PA66+G3POM PC+G3 154 Fig. 2 PP Urethae POM POM 7 65 ABSUrethae PA66Urethae PA66+G3Urethae POMPCPBTPCPCUrethae PC+G3 Urethae PPPPS ABSPBTABSPPSABSPCPOMPPSPOM UrethaePBTUrethae PPSUrethae ABSPA66 PPO PBTPPSPC Urethae Fig.-1 Fig.-2 7 Qualitative result of adhesive property Secod resi First resi PP ABS PA66 PA66+G3 PPO POM PBT PPS PC PC+G3 Urethae PP ABS PA66 PA66+G3 PPO POM PBT PPS PC PC+G3 Urethae Combiatio of resi which ca be adhered Combiatio of resi which caot be adhered
8 No.2923 ABSPC PBTPC PCPBT PA+G3 PA Urethae PA+G3 Urethae Table PC+G3 Urethae POM PC ABSUrethae ABS PA66 PA66+G3 PPPPSPBTPC Urethae PC PC+G3 PA+G3 2K Ijectio coditio Weld PP resis Ijectio coditio Weld Urethae resis 25 5 25 5 Tesile stress of PP ad Urethae resis compoud by ijectio i mold Ijectio coditio PP / PPS PPS / PP Ijectio coditio POM / PPS PPS / POM 25 5 25 5 Ijectio coditio ABS / PBT PBT / ABS Ijectio coditio ABS / PPS PPS / ABS 25 5 25 5 Ijectio coditio ABS / PC PC / ABS Ijectio coditio POM / PC PC / POM 25 5 25 5 Tesile stress of betwee two kids of resis compoud by ijectio i mold
9 Ijectio coditio 25 PBT / PC PC / PBT 5 Ijectio coditio ABS / Urethae Urethae / ABS Ijectio coditio PA66 / Urethae Urethae / PA66 25 5 5 1 Ijectio coditio POM / Urethae Urethae / POM Ijectio coditio PBT / Urethae Urethae / PBT 25 5 25 5 Ijectio coditio PPS / Urethae Urethae / PPS Ijectio coditio PC / Urethae Urethae / PC 25 5 5 1 Ijectio coditio PA+G3 / Urethae Urethae / PA+G3 Ijectio coditio PC+G3 / Urethae Urethae / PC+G3 25 5 25 5 Tesile stress of betwee two kids of resis compoud by ijectio i mold
1 No.2923 Ifluece of ijectio coditio o tesile stress First resi Secod resi Speed Pressure temperature PP PPS Small Large POM PPS Small ABS PBT Small Small ABS PC Small Large POM PC Large Small Small PC POM Small PBT PC Large Large PC PBT Small Large ABS Urethae Large Small Small Urethae ABS Small PA66 Urethae Small Urethae PA66 Small Urethae POM Small Small Urethae PBT Small Small Urethae PPS Small PC Urethae Small Small Urethae PC Small PA+G3 PA Small Large PC PC+G3 PA+G3 Urethae Small Urethae PA+G3 Small Large Large PC+G3 Urethae Small Urethae PC+G3 Small Large Fig.Table PPO Urethae POM Fig. PA66 PA66 Urethae POM PPO Urethae 9MPa ( 12 ) 3MPa 6 4) Improvemet of iterfacial adhesio performace by UV lamp First resi Secod resi PA66 PPO POM PA66 PPO Table PA66PPOPOM POM Urethae Urethae 4 Combiatio of resi which ca be adhered Urethae Combiatio of resi which caot be adhered Table UV radiatio time /sec 3 6 12 Weld PA66 resis UV radiatio time /sec 3 6 12 Weld POM resis 5 1 5 1 UV radiatio time /sec 3 6 PA66 / Urethae 5 1 UV radiatio time /sec 3 6 PPO / Urethae 5 1 Tesile stress of betwee two kids of resis compoud i mold by UV radiatio
11 Table PPPA66PPOPOM Urethae PPO Urethae Table PPO Fig. Fig. Fig. Fig. PP POM Improvemet of iterfacial adhesio performace by haloge lamp Secod resi First resi PP PA66 PPO POM PP PA66 PPO POM Urethae Combiatio of resi which ca be adhered Combiatio of resi which caot be adhered Table 77 82 PA66 PPO Fig. PA66 POM PP 5) PPO PA66 Temperature of resi /K 29 31 33 38 47 PP resis Temperature of resi /K 29 31 35 41 53 PA66 resis 5 1 Tesile stregth /N 5 1 Tesile stregth /N Temperature of resi /K 29 31 33 38 47 POM resis Temperature of resi /K 29 31 35 41 53 PA66 / Urethae 75 15 Tesile stregth /N 25 5 Tesile stregth /N Temperature of resi /K 29 31 35 41 53 PPO / Urethae Temperature of resi /K 29 31 33 38 47 POM / Urethae 25 5 Tesile stregth /N 25 5 Tesile stregth /N Tesile stregth of betwee two kids of resis compoud i mold by haloge radiatio
12 No.2923 13 14 PA66Urethae 1 PPO POM Urethae 6) 11 1) 2) Urethae ABS PA66 PA66+G3 PC PC+G3 1) NEC 53 No.3 2 3) 2) PPO Urethae POM 13 4(21) 3) 49No.3 4) 11(23) 4) 1842(1982) 1 5) MOULDING13 PP POM 8 No.24(1989) 6) 13 (23)