Yum, Jung Hwan (J. H. Yum or J. Yum et al.)

Similar documents
VLSI Design I; A. Milenkovic 1

THIẾT KẾ VI MẠCH TƯƠNG TỰ CHƯƠNG 2: CMOS Technology

CPE/EE 427, CPE 527 VLSI Design I IC Manufacturing. The MOS Transistor

Fabrication of Novel Lamellar Alternating Nitrogen-Doped

DESIGN AND CHARACTERIZATION OF 20NM SOI MOSFET DOPING ABRUPTNESS DEPENDENT

Phone (610) Fax (610) Hua Tong, Ph.D.

Supporting Information

Electronic Supplementary Information (ESI)

Tunable CoFe-Based Active Sites on 3D Heteroatom Doped. Graphene Aerogel Electrocatalysts via Annealing Gas Regulation for

Supporting Information

Wide-dynamic-range, fast-response CBr 4 doping system for molecular beam epitaxy

Influence of HALO and drain-extension doping gradients on transistor performance

Sputter Depth Profiling by SIMS; Calibration of SIMS Depth Scale Using Multi-layer Reference Materials

TOTAL-IONIZING-DOSE RESPONSE OF 65 nm MOSFETS IRRADIATED TO ULTRA- HIGH DOSES. GIULIO BORGHELLO

Supporting Information. Metal organic framework-derived Fe/C Nanocubes toward efficient microwave absorption

VERTICAL-CAVITY SURFACE-EMITTING LASERS (VCSEL): TECHNOLOGIES AND GLOBAL MARKETS

Off-gassing from III-V Wafer Processing -- A Collaboration of SEMATECH and IMEC

Layered polyaniline/graphene film from sandwich-structured polyaniline/graphene/polyaniline nanosheets for high-performance pseudosupercapacitors

state asymmetric supercapacitors

Supporting Information

THRESHOLD VOLTAGE FLUCTUATION IN N-MOS DUE TO TRAP POSITION AND DOPING PROFILE

Supplementary Information

Random Diffusion Masking Defect

FT28_mks.qxp 21/11/ :06 Page 1

REACTIVE ION ETCHING OF SILICON DIOXIDE USING BOTH OXYGEN AND CARBON DIOXIDE AS GAS ADDITIVES. dames E. Constantino ABSTRACT

Quartz etch process to improve etch depth linearity and uniformity using Mask Etcher IV

Supporting Information

Supporting Information. In-Situ Facile Bubble-Templated Fabrication of New-Type Urchin-Like (Li, Mo)- Doped Lix(Mo0.3V0.7)2O5 for Zn 2+ Storage

Facile synthesis of N-rich carbon quantum dots by spontaneous. polymerization and incision of solvents as efficient bioimaging probes

Interconnected hierarchical NiCo 2 O 4 microspheres as high performance. electrode material for supercapacitor

Supplementary Information. Flexible crystalline silicon radial junction photovoltaics with vertically aligned tapered microwires

Highly efficient vertical outgassing channels for low-temperature InP-to-silicon direct wafer bonding on the silicon-on-insulator substrate

Plasma Cleaner. Yamato Scientific America. Contents. Innovating Science for Over 125 Years. Gas Plasma Dry Cleaner PDC200/210/510 PDC610G.

Facile fabrication of well-defined polyaniline microtubes derived. from natural kapok fiber for supercapacitor with long-term.

Passive Q-switching and Q-switched mode-locking operations of 2 μm Tm:CLNGG laser with MoS 2 saturable absorber mirror

Hierachical Nickel-Carbon Structure Templated by Metal-Organic Frameworks for Efficient Overall Water Splitting

General Information. Department of Physics, Kansas State University, 116 Cardwell Hall Manhattan, KS 66506, USA. Education

Manufacturing Processes for WSi 2 -GPSOI Substrates and their Influence on Cross-talk Suppression and Inductance

EE 434 Lecture 6. Process Technology

Electronic Supplementary Information (ESI)

EE 432 Lab 3 PMOS source/drain lithography and diffusion

Freescale Semiconductor MMA6222AEG ±20/20g Dual-Axis Medium-g Micromachined HARMEMS Accelerometer

REPRODUCIBILITY IN OPTICAL THIN FILM PROCESSING PART 1, THE VACUUM AND PUMPING

Supplementary Information. A synergistic interaction between isolated Au nanoparticles with oxygen vacancies in

Flexible and Printable Paper Based Strain Sensors for Wearable and Large Area Green Electronics

Supporting Information. High cycling stable supercapacitor through electrochemical. deposition of metal-organic frameworks/polypyrrole positive

OLED vacuum deposition cluster system Sunicel Plus 400 / Plus 400L (Sunic Systems)

SINGULUS TECHNOLOGIES

Full list of publications by Kevin J. Chen

HEMT. Outlook for GaN HEMT Technology 常信和清 吉川俊英 増田哲 渡部慶二. あらまし GaN HEMT High Electron Mobility Transistor GaN HEMT. Abstract

catalytically deposited Cu current collector patterns for high-performance flexible in-plane micro-size energy

Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)

Available online at ScienceDirect. Energy Procedia 92 (2016 )

Supplementary Information. O-vacancy Enriched NiO Hexagonal Platelets Fabricated on Ni. Foam as Self-supported Electrode for Extraordinary

Improved Sputter Depth Resolution in Auger Thin Film Analysis Using In Situ Low Angle Cross-Sections

Supplementary Material

University of MN, Minnesota Nano Center Standard Operating Procedure

The SPI Sputter Coater Handbook

Supporting information

Plasma Sources and Feedback Control in Pretreatment Web Coating Applications

Transformation Optics and Experiments

Philips SAA7118E Multi Standard Video Decoder Process Review

Arizona State University NanoFab PLASMATHERM 790 RIE. Version A

Supporting Information

Supplementary Information

Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters. Roy Knechtel, Sophia Dempwolf, Holger Klingner

Supporting Information

Improvements in the Reliability, Costs and Processing of WLP/RDL Circuits

Instrumentation & Data Acquisition Systems

Design of Matched H-Plane Tee

Supplementary Information

Application Note. ASTRON Remote Plasma Source Ignition Best Practices PROBLEM

Design and Technology Solutions for Development of SiGeMEMS devices. Tom Flynn Vice President, Sales Coventor

Fig. 1: Mechanical vacuum gauge (left) and capacitive vacuum gauge (right)

Supporting Information for

CYCLE ANALYSIS OF LINEAR COMPRESSORS USING THREE- DIMENSIONAL CFD

Short Introduction to Cryo-Pumps and Refrigerators. Dr Graham Rogers Leybold UK Ltd.

G. H. Raisoni College of Engineering,Nagpur (An Autonomous Institute affiliated to Rashtrasant Tukadoji Maharaj Nagpur University)

Introduction of Vacuum Science & Technology. Diffusion pumps used on the Calutron mass spectrometers during the Manhattan Project.

New University Based SRF Materials Research Efforts (in the US)

COMELEC C-30-S Parylene Coating System

Cheng ZHANG Education. Selected Honors and Awards

ProChek, A COMPREHENSIVE FABRICATION PROCESS MISMATCH AND RELIABILITY CHARACTERIZATION TOOL

Key Laboratory of Material Chemistry for Energy Conversion and Storage (Ministry

Stress Analysis of The West -East gas pipeline with Defects Under Thermal Load

Curriculum Vitae. Yu (Will) Wang

Supplementary Information

TEPZZ A_T EP A1 (19) (11) EP A1 (12) EUROPEAN PATENT APPLICATION. (51) Int Cl.: G01L 9/00 ( )

High performance carbon nanotube based fiber-shaped. supercapacitors using redox additives of polypyrrole and. hydroquinone

Outgas of Methane from NEG Coating

Users days 20&21 october 2011 In situ TEM investigation of helium bubble evolution in SiC at high-temperature under displacing irradiation

ECE520 VLSI Design. Lecture 9: Design Rules. Payman Zarkesh-Ha

Supporting Information

Analyses of the fuel cell stack assembly pressure

Electronic Supplementary Information. Hierarchically porous Fe-N-C nanospindles derived from. porphyrinic coordination network for Oxygen Reduction

CHEMICAL ENGINEERING SENIOR LABORATORY CHEG Initiated Chemical Vapor Deposition

Octahedral Pd Nanocages with Porous Shells Converted by Co(OH) 2 Nanocages with Nanosheet surface as Robust Electrocatalysts for Ethanol Oxidation

NNCI ETCH WORKSHOP SI DRIE IN PLASMATHERM DEEP SILICON ETCHER. Usha Raghuram Stanford Nanofabrication Facility Stanford, CA May 25, 2016

Supplementary Information. Indole-Based Conjugated Macromolecule as Redox- Mediated Electrolyte for Ultrahigh Power Supercapacitor

Ph.D., Industrial and Systems Engineering, 2009

Transcription:

Yum, Jung Hwan (J. H. Yum or J. Yum et al.) To apply the job opportunity in the fields of microelectronic devices, oxide superconductor, optoelectronics, nano devices and laser system of electrical engineering Email: redeyes78@utexas.edu phone: 010-3561-6142 EDUCATIONAL BACKGROUND PhD in Electrical Engineering Solid state & Plasma Quantum Electronics track, Electrical and Computer Engineering Department, University of Texas at Austin Period: August, 2006 2012. May Master of Science in Electrical Engineering Electrical Engineering Department, University of Southern California, Los Angeles, California Period: January, 2005 May, 2006 Bachelor of Science in Electrical Engineering Korea University, Seoul, Korea Period: March, 1997 February, 2004. Military Service (April, 1999 June 2001) PhD DEGREE S PROJECTS 1. New Gate oxide design for III-V channel devices Designed the novel ALD BeO ALD BeO precursor synthesis 2. Electrical and Physical Characterization for High-k Gate Dielectrics for MOSFETS Measurement of mobility degradation, SILC(Stress Induced Leakage Current), N(P)BTI(Negative or Positive Bias Temperature Instability), HCI(Hot Carrier Injection), TZDB(Time Zero Dielectric Breakdown), TDDB(Time Dependent Dielectric Breakdown), Charge Pumping, Conductance Method, Combined high-low Frequency CV, Split CV 3. Ⅲ-V MOSFETS Process Developments and Characterization Improving and Optimizing process fabrication of Ⅲ-Ⅳ MOSFETs(CAP) such as GaAs, InGaAs, InP and InAs epi substrates Surface Passivation technique development and mechanism characterization 4. ReRam Characterization and modeling Measurement Forming/Reset/Set with compliance current level ITIC Measurement and Characterization, and Its Modeling WORK EXPERIENCE Research Associate, Unist, Ulsan, South Korea Period: July, 2015 Current Graphene Superconductor Synthesis EUV Mask Engineer, Sematech, Albany NY, USA Period: Feb, 2014 June, 2015

Multilayer deposition for Extreme Ultra Violet lithography blank mask. Atomic layer controlled Mo/Si and Mo/Be growth for high reflectivity. IBD and PVD Mo/Si growth using non-ion beam deposition. Mechanism Study of Particle Generation in Magnetron Sputtering. III-V S/D Contact Engineer, Sematech, Albany NY, USA Period: Jan, 2012 Feb, 2013 S/D metal contact engineering for InGaAs FinFETs. S/D and Channel engineering to minimize the contact resistivity. P, As and S monolayer doping on Si, Ge and III-V substrates ssoi, SiGe, Ge and III-V FinFETs process development and integration. Channel & Gate strain engineering development Epi channel growth development, optical characterization, epi defect evaluation, and integration. Monolayer doping technique development for low S/D contact resistance and low junction depth. Flash, Soak, and Microwave annealing for dopant activation and high dielectric quality. Research Assistant, Department of Electrical Engineering, Univ. Texas at Austin, USA Period: August, 2006 2012. Jan High thermal dissipation layer development (ALD BeO) for heat sink and low power devices. ReRAM dielectric and metal electrode development, and switching modeling. Developing the electronic materials and semiconductor device fabrication processes. Characterization and modeling of the thin dielectric breakdown and reliability in high-k gate dielectrics, gate electrode and high-k thin films for semiconductor memory applications. Intern, Sematech Corporation, Austin, TX Period: June, 2009 Dec. 2011 Period: December, 2006 December, 2007 New oxide design (ALD BeO) Electrical and physical characterization for high-k on Si and high mobility substrates ReRAM and TANOS characterization Research Assistant, Faculty of Electronics and Interconnections Korea University (within top5 in Korea), Seoul, Korea Period: January, 2002 - Mar, 2002 Design and simulation of photonic crystal fiber (PCF) and Coplanar Waveguide (CPW) line Modeling and simulating of CPW (coplanar waveguide) and FCPW (Finite Grounded CPW) crosssection EDUCATIONAL BACKGROUND Semiconductor Device Physics, Laser electronics, Quantum Mechanics, Quantum magnetism, Si/Ge/III- V doping, Delta doping, Fluid Dynamics, Plasma Physics, Fourier Optics, Adaptive Optics, Thin Film Characterization, Surface Chemistry, Statistical Mechanics, Thermodynamics, Inorganic Chemistry, Organic Chemistry, Lattice Dynamics, Solid State Ionics, Crystallography, Condensed Matter Physics, Nonlinear Optics, Optoelectronics, Superconductor Physics, Low Temperature Physics, Cryogenic Engineering, EUV Mask and Optics, Crystal Physics, Crystal Chemistry, Ceramic Synthesis COMPUTER SKILLS Languages: C/C++, JavaScript, HTML Simulation Tools: Spartan (Quantum Chemistry DFT simulation) SEMICONDUCTOR SKILLS Characterization Technique:

MOS CV, IV, Conductance Method, Terman Method, SILC, TDDB, Transistor characteristics (Id-Vg, Id-Vd), Channel Mobility Estimation by split CV, Dit estimation by Charge Pumping, Bias-Temperature Instability Measurement, Pulsed Id-Vg Instrumentation EDS, XRD, XPS, TEM, SEM, AFM, Cascade probe station, Semiconductor Parameter Analyzer (HP4145, 4156) LCR Meter (HP4194, HP4285), Pulse Generator (HP8115), pa meter/dc voltage source (HP4140), Switch matrix (Si 5010, Agilent E5252) and Digital Oscilloscope (Tektronix TDS3000), Keithly Device processing: Mask fabrication, Photolithography, E bean lithography, Thin-film deposition (ALD, sputter, E-beam evaporation, CVD, and PECVD), RIE, Wet etch, RTA, mask layout and fabrication International Certificate SCJP(Sun Microsystems Certificated Java Programmer) Patent United States Patent. J. H. Yum (1 st inventor), Process for preparing a beryllium oxide layer on a semiconductor substrate US 20130093029 A1 HONORS & AWARDS Sematech Research Award, 2011 Scholarship, Ministry of electric, information and communication, Korea, 2004 ~ 2006 Study Scholarship, Korea University, 2002 PUBLICATIONS J. H. Yum, H. S. Shin, Ryan M. Mushinski, Todd. W. Hudnall, J. Oh, W. Y. Loh, C. W. Bielawski, G. Bersuker, S. K. Banerjee, W. E. Wang, P.D. Kirsch, and R. Jammy, A Comparative Study of Gate First and Last Si MOSFETs Fabrication Processes Using ALD Beryllium Oxide as an Interface Passivation Layer, VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium J. H. Yum, H. S. Shin, R. Hill, J. Oh, H. D. Lee, Ryan M. Mushinski, Todd. W. Hudnall, C. W. Bielawski, S. K. Banerjee, W. Y. Loh, Wei-E Wang, and Paul Kirsch, A Study of Capping Layers for Sulfur Monolayer Doping on III-V Junctions, Appl. Phys. Lett. 101, 253514 (2012) J. H. Yum, G. Bersuker, and S. K. Banerjee, Theoretical Approach Evaluating Beryllium Oxide as A Gate Dielectric In the view points of Electromagnetics and Thermal stability, Appl. Phys. Lett. 100, 053501 (2012) J. H. Yum, G. Bersuker, Todd. W. Hudnall, C. W. Bielawski, P. Kirsch, and S. K. Banerjee, A Study of Novel ALD Beryllium Oxide as an Interface Passivation Layer for Si MOS Devices, VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on Volume 1-2 J. H. Yum, J. Oh, Todd. W. Hudnall, C.W. Bielawski, G. Bersuker, and S. K. Banerjee Comparative Study of SiO2, Al2O3, and BeO Ultrathin Interfacial Barrier Layers in Si Metal-Oxide- Semiconductor Devices Active and Passive Electronic Components Volume 2012, Article ID 359580, 7 pages J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, G. Bersuker, M. Downer, C. W. Bielawski, J. C. Lee and S. K. Banerjee, Crystallinity of Atomic Layer Deposited Beryllium Oxide Thin Film and Its Related Electrical and Physical Characteristics on Si and GaAs substrates, Thin Solid Films 520 (2012) 3091 3095

J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, G. Bersuker, M. Downer, C. W. Bielawski, J. C. Lee and S. K. Banerjee, Atomic layer deposited beryllium oxide: Effective passivation layer for III-V metal/oxide/semiconductor devices, J. Appl. Phys. 109, 064101 (2011) J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, G. Bersuker, M. Downer, C. W. Bielawski, J. C. Lee and S. K. Banerjee, Inversion Type InP Metal Oxide Semiconductor Field Effect Transistor Using Novel Atomic Layer Deposited BeO Gate Dielectric, Appl. Phys. Lett. 99, 033502 (2011) J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, M. Downer, C. W. Bielawski, G. Bersuker, J. C. Lee and S. K. Banerjee, Comparison of Self Cleaning Effect and Electrical Characteristics between Atomic Layer Deposited BeO and Al 2 O 3 as an Interface Passivation Layer on GaAs MOS Devices, J. Vac. Sci. Technol. A 29(6), Nov/Dec (2011) J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, M. Downer, C. W. Bielawski, G. Bersuker, J. C. Lee and S. K. Banerjee. ALD Beryllium Oxide as a High-k Gate Dielectric for III-V MOS Devices, International ALD Conference (2011) J. H. Yum, G. Bersuker, T. Akyol, M. Lei, D. A. Ferrer, K.W. Park, Todd. W. Hudnall, M. Downer, C. W. Bielawski, E. T. Yu, J. Price, P. Kirsch, R. Jammy, J. C. Lee and S. K. Banerjee, ALD BeO: Novel Barrier Layer for High Performance Gate Stacks on Si and High Mobility Substrates, in IEDM Tech. Dig., 2011, pp. 638 641. J. H. Yum, T. Akyol, M. Lei, D. A. Ferrer, K.W. Park, Todd. W. Hudnall, M. Downer, C. W. Bielawski, G. Bersuker, E. T. Yu, J. Price, J. C. Lee and S. K. Banerjee, Epitaxial ALD BeO: Efficient Oxygen Diffusion Barrier for EOT Scaling and reliability improvement, Tran of Electron Device Vol. 58, No. 12, DEC (2011) J. H. Yum, G. Bersuker, T. Akyol, M. Lei, D. A. Ferrer, Todd. W. Hudnall, M. Downer, C. W. Bielawski, J. C. Lee and S. K. Banerjee, A Study of Highly Crystalline Novel Beryllium Oxide Using Atomic Layer Deposition, J. Crystal Growth 334 (2011) 126 133 D. Koh, J. H. Yum, T. Akyol, D. A. Ferrer, M. Lei, T. W. Hudnall, M. C. Downer, C. W. Bielawski, R. Hill, G. Bersuker, S. K. Banerjee, Novel atomic layer deposited thin film beryllium oxide for InGaAs MOS Devices Indium Phosphide and Related Materials (IPRM), 2012 International Conference on 27-30 Aug. 2012 Ming Lei, J. H. Yum, J. Price, Todd W. Hudnall, C. W. Bielawski, S. K. Banerjee, P. S. Lysaght, G. Bersuker, and M. C. Downer APPLIED PHYSICS LETTERS 100, 122906 (2012) Spectroscopic evaluation of band alignment of atomic layer deposited BeO on Si(100) M. Lei, J. H. Yum, S. K. Banerjee, G. Bersuker, M. C. Downer, physica status solidi (b) Volume 249, Issue 6, pages 1160 1165, June 2012, Band offsets of atomic layer deposited Al2O3 and HfO2 on Si measured by linear and nonlinear internal photoemission Hyoung-Sub Kim, Injo Ok, Manhong Zhang, F. Zhu, S. Park, J. Yum, Han Zhao, and Jack. C. Lee, Gate oxide scaling down in HfO2-GaAs metal-oxide-semiconductor capacitor using germanium interfacial passivation layer, Appl. Phys. Lett., Vol. 91, pp. 042904, 2007. InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao and Jack C. Lee, Temperature Effects of Si Interface Passivation Layer Deposition on High-k III-V Metal Oxide Semiconductor Characteristics. Applied physics letters, 91, 2007. Han Zhao, Hyoung-Sub Kim, Feng Zhu, Manhong Zhang, Injo OK, Sung Il Park, Jung Hwan Yum and Jack C Lee, Metal-oxide-semiconductor capacitors on GaAs with germanium nitride passivation layer, Applied Physics Letters, 91, 172101, (2007) Sung Il Park, InJo Ok, Hyoung-sub Kim, Feng Zhu, Manhong Zhang, Jung Hwan Yum, Zhao Han, and Jack C. Lee, Optimization of electrical characteristics of TiO2-incorporated HfO2 n-type doped gallium arsenide metal oxide semiconductor capacitor with silicon interface passivation layer, in Applied Physics Letters 91, 081908(2007). Hyoung-Sub Kim, Injo Ok, Manhong Zhang, F. Zhu, S. Park, J. Yum, Han Zhao, and Jack C. Lee, Gate oxide scaling down in HfO2-GaAs metal-oxide-semiconductor capacitor using germanium interfacial passivation layer, Appl. Phys. Lett., Vol. 91, pp. 042904, (2007).

Han Zhao, Hyoung-Sub Kim, Feng Zhu, Manhong Zhang, Injo OK, Sung Il Park, Jung Hwan Yum, and Jack C. Lee, Metal-oxide-semiconductor capacitors on GaAs with germanium nitride passivation layer, Applied Physics Letters, 91, 172101 (2007) Hyoung-Sub Kim, I. Ok, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, J. Oh, P. Majhi, and Jack C. Lee, Flatband voltage instability characteristics of HfO2-based GaAs metal-oxidesemiconductor capacitors with a thin Ge layer, Appl. Phys. Lett., Vol. 92, pp. 102904, (2008). Hyoung-Sub Kim, I. Ok, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, J. Oh, P. Majhi, and Jack C. Lee, Inversion-type enhancement-mode HfO2-based GaAs metal-oxidesemiconductor field effect transistors with a thin Ge layer, Appl. Phys. Lett., Vol. 92, pp. 032907, (2008). InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, Domingo Garcia, Prashant Majhi, N. Goel and W. Tsai, C. K. Gaspe, M.B. Santos, and Jack C. Lee, "Metal gate: HfO2 metal-oxidesemiconductor structures on high-indium-content InGaAs substrate using physical vapor deposition. Appl. Phys. Lett. 92, 112904 (2008). InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, Domingo Garcia, Prashant Majhi, and Jack C. Lee, Influence of the substrate orientation on the electrical and material properties of GaAs metal-oxide-semiconductor (MOS) Capacitors and self-aligned transistors using HfO2 and silicon interface passivation layer (IPL) Appl. Phys. Lett. 92, 1 (2008) InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, Domingo Garcia, Prashant Majhi, N. Goel and W. Tsai, C.K. Gaspe, M.B. Santos, and Jack C. Lee, Self-aligned nchannel metal-oxidesemiconductor field effect transistor on high-indium-content In0.53Ga0.47As and InP using physical vapor deposition HfO2 and silicon interface passivation Layer. Appl. Phys. Lett. 92, 202903 (2008) InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao and Jack C. Lee, Self aligned n- channel GaAs metal oxide semiconductor field-effect transistors (MOSFETs) Using HfO2 and silicon interface passivation layer: post metal annealing optimization. Microelectronics Engineering (2008). Hyoung-Sub Kim, I. Ok, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, P. Majhi, N. Goel, W. Tsai, C. K. Gaspe, M. B. Santos, and Jack C. Lee, A study of Metal-OxideSemiconductor Capacitors on GaAs, In0.53Ga0.47As, InAs, and InSb Substrates using a Germanium Interfacial Passivation Layer, Appl. Phys. Lett., (2008). Hyoung-Sub Kim, I. Ok, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, P. Majhi, and Jack C. Lee, HfO2-based InP n-channel metal-oxide-semiconductor field-effect transistors and metal-oxidesemiconductor capacitors using a germanium interfacial passivation layer, Appl. Phys. Lett., 93, 102906 (2008) Han Zhao, Davood Shahrjerdi, Feng Zhu, Manhong Zhang, Hyoung-Sub Kim, Injo OK, Jung Hwan Yum, Sung Il Park, Sanjay K. Banerjee, and Jack C. Lee, Gate-first inversiontype InP metal-oxidesemiconductor field-effect transistors with atomic-layer-deposited Al2O3 gate dielectric, Applied Physics Letters, 92, 233508 (2008) Han Zhao, Davood Shahrjerdi, Feng Zhu, Hyoung-Sub Kim, Injo OK, Manghong Zhang, Jung Hwan Yum, Sanjay K. Banerjee, and Jack C. Lee, Inversion-type indium phosphide metal-oxidesemiconductor field-effect transistors with equivalent oxide thickness of 12 Å using stacked HfAlOx/HfO2 gate dielectric, Applied Physics Letters, 92, 253506 (2008) Han Zhao, Davood Shahrjerdi, Feng Zhu, Hyoung-Sub Kim, Injo OK, Manhong Zhang, Jung Hwan Yum, Sanjay K. Banerjee and Jack C Lee, Inversion-type InP MOSFETs with EOT of 21 Å using atomic layer deposited Al2O3 gate dielectric, Electrochemical and solid-state letters, 11, H233, (2008) Han Zhao, Yen-Ting Chen, Jung Hwan Yum, Niti Goel, Jack C Lee, Effect of channel doping concentration and thickness on device performance for In0.53Ga0.47As metal-oxidesemiconductor transistors with atomic-layer-deposited Al2O3 dielectrics, Applied Physics Letters, 94, 093505 (2009) Han Zhao, Yen-Ting Chen, Jung Hwan Yum, Yanzhen Wang, Niti Goel, Jack C Lee, High performance In0.7Ga0.3As metal-oxide-semiconductor transistors with mobility > 4400 cm2/vs using InP barrier layer, Applied Physics Letters, 94, 193502 (2009)

Han Zhao, Jung Hwan Yum, Yen-Ting Chen, and Jack C Lee, In0.53Ga0.47As n-mosfets with ALD Al2O3, HfO2 and LaAlO3 gate dielectrics, Journal of Vacuum Science and Technology B, 27, 2024, (2009) Feng Zhu, Han Zhao, I. Ok, H.S. Kim, M. Zhang, S. Park, J. Yum, Niti Goel, C.K. Gaspe, M.B. Santos, W. Tsai and Jack C. Lee, Effects of anneal and silicon interface passivation layer thickness on device characteristics of In0.53Ga0.47As n-mosfets with HfO2 gate oxide, Electrochemical and Solid-State Letters, 12, H131 (2009) Feng Zhu, Han Zhao, I. Ok, H.S. Kim, J. Yum, Niti Goel, C.K. Gaspe, M.B. Santos, W. Tsai, and Jack C. Lee, A high performance In0.53Ga0.47As Metal-Oxide-Semiconductor Field Effect Transistor with silicon interface passivation layer, Applied Physics Letters, 94, 013511 (2009) Yen-Ting Chen, Han Zhao, Jung Hwan Yum, Yanzhen Wang, and Jack C. Lee, "Metaloxidesemiconductor field-effect-transistors on indium phosphide using HfO2 and silicon passivation layer with equivalent oxide thickness of 18Å ", APPLIED PHYSICS LETTERS 94, 213505, May 2009 Han Zhao, Yen-Ting Chen, Jung Hwan Yum, Yanzhen Wang, Fei Xue, Fei Zhou, Jack Lee, High Performance InGaAs MOSFETs with High Mobility using InP Barrier Layer, Electrochemical Society Transactions, Vol. 25, Issue #7, p. 397-404 (2009). H Zhao, J. Lee, et al, Effects of gate-first and gate-last process on interface quality of In0.53Ga0.47As metal-oxide-semiconductor capacitors using atomic-layer-deposited Al2O3 and HfO2 oxides, Applied Physics Letters, 95, 253501 (2009) Yen-Ting Chen, Han Zhao, Jung Hwan Yum, Yanzhen Wang, Fei Xue, Fei Zhou, and Jack C. Lee "Improved electrical characteristics of TaN/Al2O3 / In0.53Ga0.47As metal-oxidesemiconductor field-effect transistors by fluorine incorporation", APPLIED PHYSICS LETTERS 95, 013501 (2009) Yen-Ting Chen, Han Zhao, Jung Hwan Yum, Yanzhen Wang, Fei Xue, Fei Zhou, and Jack C. Lee, Effects of fluorine incorporation on the electrical properties of atomic-layerdeposited Al2O3 gate dielectric on InP substrate, Journal of The Electrochemical Society, 157 (3) G71-G75 January (2010) InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J Yum, S. Koveshnikov, W. Tsai, V. Tokranov, M. Yakimov, S. Oktyabrsky, and Jack C. Lee Metal Gate HfO2 MOS Structures on InGaAs Substrate with Varying Si Interface Passivation Layers and PDA Conditions, Conference on the Physics and Chemistry of Semiconductor Interfaces, 2007 Feng Zhu, Injo Ok, Hyoung-sub Kim, Manhong Zhang, Sung Il Park, Jung Hwan Yum and Jack C. Lee, Investigation of the passivation mechanism of ultra-thin silicon interface layer for III-V MOS devices, Conference on the Physics and Chemistry of Semiconductor Interfaces (PCSI) (2007). Hyoung-Sub Kim, Injo Ok, Feng Zhu, M. Zhang, S. Park, J. Yum, H. Zhao, and Jack C. Lee, n- and p-channel TaN/HfO2 MOSFETs on GaAs substrate using a germanium interfacial passivation layer, The 65th annual Device Research Conf., pp. 99, 2007. Hyoung-Sub Kim, I. Ok, M. Zhang, F. Zhu, S. Park, J. Yum, S. Koveshnikov, W. Tsai, V. Tokranov, M. Yakimov, S. Oktyabrsky, and Jack C. Lee, HfO2-based Metal-Oxide-Semiconductor Capacitors on n-ingaas Substrate with a Thin Germanium Passivation Layer, The International Conference on Compound Semiconductor Manufacturing Technology, pp. 69, 2007. InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J Yum, S. Koveshnikov, W. Tsai, V. Tokranov, M. Yakimov, S. Oktyabrsky, and Jack C. Lee Hydrogen Incorporation of Metal Gate HfO2 MOS Structures on In0.2Ga0.8As Substrate with Si Interface Passivation Layer, International Conference on Compound Semiconductor Manufacturing Technology, 2007. InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J Yum, S. Koveshnikov, W. Tsai, V. Tokranov, M. Yakimov, S. Oktyabrsky, and Jack C. Lee, Metal Gate HfO2 MOS Structures on InGaAs Substrate with Varying Si Interface Passivation Layer and PDA Condition, J. Vac. Sci. Technol. B 25, Jul/Aug 2007. Injo Ok, Hyung-sub Kim, Manhong Zhang, Feng Zhu, Sung-il Park, Junghwan Yum, Han Zhao and Jack C. Lee, Post Metal Annealing Optimization of Self-Aligned n- channel GaAs MOSFETs Using HfO2 and Silicon Interface Passivation Layer, the International Symposium on Advanced Gate Stack Technology, September 2007.

InJo Ok, H. Kim, M. Zhang, F. Zhu, S. Park, J. Yum, H. Zhao, Domingo Garcia, Prashant Majhi, and Jack C. Lee, Influence of the substrate orientation on the electrical and material properties of GaAs MOSFETs Using HfO2 and Silicon Interface Passivation Layer, Semiconductor Interface Specialists Conference (SISC), December 2007. InJo Ok, H. Kim, M. Zhang, F. Zhu, H. Zhao, S. Park, J. Yum, Domingo Garcia, Prashant Majhi, N. Goel and W. Tsai, C.K. Gaspe, M.B. Santos, and Jack C. Lee, Self-Aligned nchannel MOSFET on InP and In0.53Ga0.47As Using Physical Vapor Deposition HfO2 and Silicon Interface Passivation Layer. IEEE Device Research Conference, June 2008. Feng Zhu, Injo Ok, Hyoung-sub Kim, Manhong Zhang, Sung Il Park, Jung Hwan Yum, Han Zhao and Jack C. Lee, Can GaAs MOS device match with its silicon counterpart in interface quality by using silicon interface passivation layer and HfO2 gate oxide? Electronic Materials Conference (EMC) (2008). Feng Zhu, H. Zhao, I. Ok, H.S. Kim, M. Zhang, S. Park, J. Yum, S. Koveshnikov, V. Tokranov, M. Yakimov, S. Oktyabrsky, W. Tsai and Jack C. Lee, Charge trapping and wearout characteristics of self-aligned enhancement-mode GaAs n-mosfet with Si interface passivation layer and HfO2 gate oxide, Compound Semiconductor IC Symposium (CSICS) 2008. Feng Zhu, Han Zhao, H.S. Kim, I. Ok, J. Yum and Jack C. Lee, The effects of silicon interface passivation layer thickness on device characteristics of InP enhancement-mode nmosfets with HfO2 gate oxide, IEEE SISC Semiconductor Interface Specialists Conference 2008 Feng Zhu, Han Zhao, H.S. Kim, I. Ok, J. Yum and Jack C. Lee, A high performance enhancementmode In0.53Ga0.47As nmosfet with directly sputtered HfO2 gate oxide, IEEE SISC Semiconductor Interface Specialists Conference 2008 H. Zhao, D. Shahrjerdi, F. Zhu, H.S. Kim, J. Yum, S. Banerjee and J. C. Lee Atomic-layerdeposited Al2O3 gate dielectrics on InP using sulfur passivation, 50th Electronic Materials Conference, (2008) H. Zhao, D. Shahrjerdi, F. Zhu, H.S. Kim, J. Yum, S. Banerjee and J. C. Lee Atomic-layerdeposited Al2O3 gate dielectrics on InP using sulfur passivation, 50th Electronic Materials Conference, (2008) H. Zhao, Y. Chen, J. Yum, Y. Wang, N. Goel, S. Koveshnikov, W. Tsai, and J. C. Lee, HfO2-Based In0.53Ga0.47As MOSFETs (EOT 10Å) Using Various Interfacial Dielectric Layers, IEEE Device Research Conference, (2009) Han Zhao, Jung Hwan Yum, Yen-Ting Chen, and Jack C Lee In0.53Ga0.47As n-mosfets with ALD Al2O3, HfO2 and LaAlO3 gate dielectrics, 36th Conference on the Physics and Chemistry of Semiconductor Interfaces, (2009) Yen-Ting Chen, Han Zhao, Jung Hwan Yum, Yanzhen Wang, Fei Xue, Fei Zhou, and Jack C. Lee, "In0.53Ga0.47As MOSFETs with CF4 plasma treatment and Al2O3 gate oxide", International Symposium on Advanced Gate Stack Technology (ISAGST), August 2009 Yen-Ting Chen, Han Zhao, Jung Hwan Yum, Yanzhen Wang, and Jack C. Lee, "Atomic layer deposited HfO2 gate dielectrics on InP using silicon interface passivation layer "Electronic Materials Conference (EMC) 2009 Han Zhao, Yen-Ting Chen, Jung Hwan Yum, and Jack C Lee Channel Doping Concentration and Thickness Dependence of Device Performance for In0.53Ga0.47As n-mosfets with ALD Al2O3 dielectrics, 2009 Materials Research Society Spring Meeting J. Lee, H. Zhao, Y. Chen, J. Yum, F. Xue, F. Zhou and Y. Wang, (Invited Paper) High Performance InGaAs MOSFETs with High Mobility using InP Barrier Layer" 216 th Electrochemical Society Meeting (E10 - ULSI Process Integration) in Vienna, Austria, October 2009. H. Zhao, N. Goel, J. Huang, Y. Chen, J. Yum, Y. Wang, F. Zhou, F. Xue, and J. Lee, Factors Enhancing In0.7Ga0.3As MOSFETs and Tunneling FETs Device performance IEEE Device Research Conference, (2010). Around 74 journals and conferences as an author or co-author.