Product Specification MODEL : 5050A Product Description : EMC5050 5W 36V Address:Guanhuang North road Hu anwei Gaobu Town Tel: 0769-89080660 Fax: 0769-89080658 Page 1 of 8
Feature Viewing angle:120 deg The materials of the LED dice is InGaN 5.0mm 5.0mm 0.7mm RoHS compliant lead-free soldering compatible Package Outline Unit:mm NOTES: 1. All dimensions are in millimeters; 2. Tolerances are±0.03mm unless otherwise noted. Page 2 of 8
Absolute maximum ratings Ta=25±3 Parameter Symbol Value Unit Power dissipation Pd 1 W Forward current If 140 ma Reverse voltage Vr 5 V Operating temperature range Topr -20~+85 Storage temperaturer range Tstg -40~+100 Pulse Forward Current Ifp 140 ma Electrostatic Discharge ESD 2000(HBM) V Electro-optical characteristics Parameter Test Condition Symb ol Value Ta=25±3 Min. Typ. Max. Unit Forward voltage Luminous intensity Viewing angle 50% Iv Reverse current ColorTemperature Chromaticity CIE CRI If=140 ma Vf 34 37 40 V If=140 ma Φ 700 750 -- Lm If=140 ma 2θ 1/2 -- 120 -- Deg Vr=5V Ir -- -- 10 μa If=140 ma TC 2500 -- 7500 K If=140 ma CIE If=140 ma Ra 70 NOTES: 1.Luminous Flux measurement tolerance:±10% 2.Forward Voltage measurement tolerance:±0.1v 3.Color Temperature measurement tolerance:x,y±0.01 4.CRI measurement tolerance:±2 Page 3 of 8
Intensity Bin Limit (IF = 140 ma) Bin Flux(lm) for reference code Min Max 1 700 750 2 750 800 3 800 850 4 850 900 VF Bin Limit (IF = 140 ma) Bin code Min.(V) Max.(V) 1 33 34 2 34 35 3 35 36 4 36 37 5 37 38 6 38 39 7 39 40 Chromaticity CIE Page 4 of 8
Requirements for application and reflow soldering Reflow Soldering Pre-heat 120~160 Pro-heat time Peak temperature Soldering time Condition After reflow soldering rapid cooling should be avoided Temperature-profile(Surface of circuit board) Use the following conditions shown in the figure. <Pb-free solder> 120 seconds Max. 245 Max. 10 seconds Max. Refer to Temperature-profile <Lead solder> Tem pera ture 3 /sec. 245 Max. 10sec.Max. 210 Te m -4 /sec. pe Pre-heating 120~160 rat 60~120sec. 3 /sec. ur e 4 /sec. 220 Max. 10sec.Max. Pre-heating 60sec.Max.. -3 /sec. 4 /sec. 140~160 Above 180 120sec..Max. 120sec..Max. Time Time 1.Reflow soldering should not be done more than two times 2.When soldering,do not put stress on the LEDs during heating Handling Precautions Compare to epoxy encapsulation that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force. As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED product, Failure to comply might leads to damage and premature failure of the LED. Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or handle the silicone lens surface, it may damage the internal circuitry. Not suitable to operate in acidic environment, PH<7. LED operating environment and sulfur element composition cannot be over 25 PPM in the LED mating usage material. Page 5 of 8
When we need to use external glue for LEDs application products, please make sure that the external gluematches the LEDs packaging glue. Additionally,as most of LEDs packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LEDs, which may cause the malfunction of LEDs, the single content of Bromine element is required to be less than 225 PPM,the single content of Chlorine element is required to be less than225ppm,the total content of Bromine element and Chlorine element in the external glue of the applicationproducts is required to be less than 375 PPM. The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top ofpackage. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should betaken to avoid the strong pressure on the encapsulated part. So when using the picking up nozzle, the pressureon the silicone resin should be proper. Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristicssuch as the lower forward voltage, or the not light at low current, even not light. All devices, equipment andmachinery must be properly grounded. At the same time, it is recommended that wrist bands oranti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. Storage Before opening the package, the LEDs should be kept at 30 or less and 60%RH or less. The LEDs shouldbe used within a year. After opening the package, the product should be stored at 30 or less and humidity less than 10% RH, andbe soldered within 24 H. It is recommended that the product be operated at the workshop condition of 30 or less and humidity less than 60% RH. If unused LEDs remain, they should be stored in moisture proofpackages, such as sealed containers with packages of moisture absorbent material (silica gel). It is alsorecommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bagagain. Page 6 of 8
Reliability (1) TEST ITEMS AND RESULTS Ref.Standa Type Test Item rd Test Conditions Note Number of Damage d Resistance to Soldering JESD22-B10 Heat(Reflow Soldering) 6 Tsld=260,5sec 2 times Temperature Cycle JESD22-A10-40 30min 5min 100 cycle 4 100 30min EnvironmentalSequence Thermal Shock JESD22-A10-40 15min 5min 100 cycle 6 100 15min High Temperature JESD22-A10 1000 hrs Storage Ta=100 3 Low Temperature JESD22-A11 Storage 9 Ta=-40 1000 hrs Power temperature JESD22-A10 Cycling 5 On 5min -40 >15min 100 cycle <15min Off5min 100 >15min OperationSequence Life Test JESD22-A10 Ta=25 1000 hrs 8 IF=150mA High Humidity Heat JESD22-A10 80 RH=80% 1000 hrs Life Test 1 IF=150mA (2) CRITERRIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage VF IF=150mA -- U.S.L*) 1.1 Reverse Current IR VR=5V -- U.S.L*) 2.0 Luminous Intensity IV IF=150mA L.S.L**) 0.7 U.S.L.:Upper Standard Level L.S.L.:Lower Standard Level Page 7 of 8
Packaging Specifications Package Tape Specifications:(4000 pcs/reel) 180 φ 60φ 13 ± 0. 2 φ 9.0± 0.1 12.0± 0.15 Dimensions of Tape(Unit:mm) Reel Lead Min.60mm No LEDs NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with data sheet specifications. 4 4,000 pcs/reel. Page 8 of 8