Packaging Specification

Pakagig Seifiatio 006 Mirohi Tehology I. S00049F

Note the followig details of the ode rotetio feature o Mirohi devies: Mirohi roduts meet the seifiatio otaied i their artiular Mirohi ata Sheet. Mirohi believes that its family of roduts is oe of the most seure families of its kid o the market today, whe used i the iteded maer ad uder ormal oditios. There are dishoest ad ossibly illegal methods used to breah the ode rotetio feature. ll of these methods, to our kowledge, require usig the Mirohi roduts i a maer outside the oeratig seifiatios otaied i Mirohi s ata Sheets. Most likely, the erso doig so is egaged i theft of itelletual roerty. Mirohi is willig to work with the ustomer who is oered about the itegrity of their ode. Neither Mirohi or ay other semiodutor maufaturer a guaratee the seurity of their ode. Code rotetio does ot mea that we are guarateeig the rodut as ubreakable. Code rotetio is ostatly evolvig. We at Mirohi are ommitted to otiuously imrovig the ode rotetio features of our roduts. ttemts to break Mirohi s ode rotetio feature may be a violatio of the igital Milleium Coyright t. If suh ats allow uauthorized aess to your software or other oyrighted work, you may have a right to sue for relief uder that t. Iformatio otaied i this ubliatio regardig devie aliatios ad the like is rovided oly for your oveiee ad may be suerseded by udates. It is your resosibility to esure that your aliatio meets with your seifiatios. MICROCHIP MKS NO RPRSNTTIONS OR WR- RNTIS OF NY KIN WHTHR XPRSS OR IMPI, WRITTN OR OR, STTUTORY OR OTHRWIS, RT TO TH INFORMTION, INCUING UT NOT IMIT TO ITS CONITION, QUITY, PRFORMNC, MRCHNTIITY OR FITNSS FOR PURPOS. Mirohi dislaims all liability arisig from this iformatio ad its use. Use of Mirohi s roduts as ritial omoets i life suort systems is ot authorized exet with exress writte aroval by Mirohi. No lieses are oveyed, imliitly or otherwise, uder ay Mirohi itelletual roerty rights. Trademarks The Mirohi ame ad logo, the Mirohi logo, uro, dspic, KOQ, miroi, MP, PIC, PICmiro, PICSTRT, PRO MT, PowerSmart, rfpic, ad SmartShut are registered trademarks of Mirohi Tehology Iororated i the U.S.. ad other outries. mab, Filterab, Migratable Memory, MXV, MX, PICMSTR, SV, SmartSesor ad The mbedded Cotrol Solutios Comay are registered trademarks of Mirohi Tehology Iororated i the U.S.. alog-for-the-igital ge, liatio Maestro, dspicm, dspicm.et, dspicworks, CN, CONOMONITOR, FaSese, FlexROM, fuzzy, I-Ciruit Serial Programmig, ICSP, ICPIC, iear tive Thermistor, MPSM, MPI, MPINK, MPSIM, PICkit, PICM, PICM.et, PIC, PICtail, PowerCal, PowerIfo, PowerMate, PowerTool, Real IC, rf, rfpicm, Selet Mode, Smart Serial, SmartTel, Total durae, UNI/O, Wierok ad Zea are trademarks of Mirohi Tehology Iororated i the U.S.. ad other outries. SQTP is a servie mark of Mirohi Tehology Iororated i the U.S.. ll other trademarks metioed herei are roerty of their resetive omaies. 006, Mirohi Tehology Iororated, Prited i the U.S.., ll Rights Reserved. Prited o reyled aer. Mirohi reeived ISO/TS-6949:00 quality system ertifiatio for its worldwide headquarters, desig ad wafer fabriatio failities i Chadler ad Teme, rizoa ad Moutai View, Califoria i Otober 003. The Comay s quality system roesses ad roedures are for its PICmiro 8-bit MCUs, KOQ ode hoig devies, Serial PROMs, miroeriherals, ovolatile memory ad aalog roduts. I additio, Mirohi s quality system for the desig ad maufature of develomet systems is ISO 900:000 ertified. S00049F-age ii dvae Iformatio 006 Mirohi Tehology I.

Pakagig Idex CRMIC SI-RZ U IN-IN FMIY 8-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody... 3 4-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody... 4 8-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody... 5 CRMIC U IN-IN (CRIP) FMIY 8-ead Cerami ual I-lie (J) 300 mil ody (CRIP)... 7 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP)... 8 4-ead Cerami ual I-lie (J) 300 mil ody (CRIP)... 9 4-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP)... 0 6-ead Cerami ual I-lie (J) 300 mil ody (CRIP)... 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP)... 0-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP)... 3 4-ead Cerami ual I-lie (JG) 600 mil ody (CRIP)... 4 8-ead Cerami ual I-lie (JJ) 600 mil ody (CRIP)... 5 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP)... 6 8-ead Cerami ual I-lie with Widow (JW) 600 mil ody (CRIP)... 7 40-ead Cerami ual I-lie (JK) 600 mil ody (CRIP)... 8 40-ead Cerami ual I-lie with Widow (JW) 600 mil ody (CRIP)... 9 CRMIC CHIP CRRIR (CRQU) FMIY 68-ead Cerami eaded (C) Chi Carrier with Widow Square (CRQU)... 84-ead Cerami eaded (C) Chi Carrier with Widow Square (CRQU)... SM-OUTIN TRNSISTOR FMIY 3-ead Plasti Trasistor Outlie (TO) (TO-9)... 3 3-ead Plasti Small Outlie Trasistor Header (M) (SOT-89)... 4 5-ead Plasti Small Outlie Trasistor Header (MT) (SOT-89)... 5 5-ead Plasti Trasistor Outlie () (TO-0)... 6 5-ead Thi Small Outlie Trasistor (OS) (TSOT)... 7 3-ead Plasti Small Outlie Trasistor (TT) (SOT-3)... 8 3-ead Plasti Small Outlie Trasistor (TT) (SOT-3)... 9 3-ead Plasti Small Outlie Trasistor () (SOT-3)... 30 4-ead Plasti Small Outlie Trasistor (RC) (SOT-43)... 3 5-ead Plasti Small Outlie Trasistor (OT) (SOT-3)... 3 6-ead Plasti Small Outlie Trasistor (CH or OT) (SOT-3)... 33 3-ead Plasti Small Outlie Trasistor () (SC-70)... 34 5-ead Plasti Small Outlie Trasistor (T) (SC-70)... 35 eadless Wedge Module Plasti Small-Outlie Trasistor (WM) (SOT-385)... 36 OU C-WTT PCKG (PK) FMIY 3-ead Plasti () (PK)... 37 5-ead Plasti (T) (PK)... 38 7-ead Plasti (K) (PK)... 39 006 Mirohi Tehology I. S00049F-age iii

Pakagig Idex PSTIC U IN-IN (PIP) FMIY 8-ead Plasti ual I-lie (P) 300 mil ody (PIP)...4 4-ead Plasti ual I-lie (P) 300 mil ody (PIP)... 4 6-ead Plasti ual I-lie (P) 300 mil ody (PIP)... 43 8-ead Plasti ual I-lie (P) 300 mil ody (PIP)... 44 0-ead Plasti ual I-lie (P) 300 mil ody (PIP)... 45 4-ead Plasti ual I-lie (P) 600 mil ody (PIP)... 46 4-ead Skiy Plasti ual I-lie (SP) 300 mil ody (PIP)... 47 8-ead Skiy Plasti ual I-lie (SP) 300 mil ody (PIP)... 48 8-ead Plasti ual I-lie (P) 600 mil ody (PIP)... 49 40-ead Plasti ual I-lie (P) 600 mil ody (PIP)... 50 64-ead Shrik Plasti ual I-lie (SS) 750 mil ody (PIP)... 5 PSTIC CHIP CRRIR (PCC) FMIY 0-ead Plasti eaded Chi Carrier () Square (PCC)... 53 8-ead Plasti eaded Chi Carrier () Square (PCC)... 54 3-ead Plasti eaded Chi Carrier () Retagle (PCC)...55 44-ead Plasti eaded Chi Carrier () Square (PCC)... 56 68-ead Plasti eaded Chi Carrier () Square (PCC)... 57 84-ead Plasti eaded Chi Carrier () Square (PCC)... 58 PSTIC SM-OUTIN (SOIC/SOIJ) FMIY 8-ead Plasti Small-Outlie (SN) Narrow, 50 mil ody (SOIC)... 59 4-ead Plasti Small-Outlie (S) Narrow, 50 mil ody (SOIC)... 60 6-ead Plasti Small-Outlie (S) Narrow 50 mil ody (SOIC)... 6 8-ead Plasti Small-Outlie (SM) Medium, 08 mil ody (SOIJ)... 6 6-ead Plasti Small-Outlie (SO) Wide, 300 mil ody (SOIC)... 63 8-ead Plasti Small-Outlie (SO) Wide, 300 mil ody (SOIC)... 64 0-ead Plasti Small-Outlie (SO) Wide, 300 mil ody (SOIC)... 65 4-ead Plasti Small-Outlie (SO) Wide, 7.50 mm (.300 mil) ody (SOIC)... 66 8-ead Plasti Small-Outlie (SO) Wide, 300 mil ody (SOIC)... 67 PSTIC QU FTPCK (QFN) N PSTIC U FTPCK (FN) FMIY 8-ead Plasti ual-flat, No-ead Pakage (MC) x3x0.9 mm ody (FN) Saw Sigulated... 69 8-ead Plasti ual-flat, No-ead Pakage (MF) 6x5 mm ody (FN-S) Puh Sigulated... 70 8-ead Plasti ual-flat, No-ead Pakage (MF) 3x3x0.9 mm ody (FN) Saw Sigulated... 7 8-ead Plasti ual-flat, No-ead Pakage (M) 4x4x0.9 mm ody (FN-S) Saw Sigulated... 7 8-ead Plasti ual-flat, No-ead Pakage (MF) 6x5 mm ody (FN-S) Saw Sigulated... 73 0-ead Plasti ual-flat, No-ead Pakage (MF) 3x3x0.9 mm ody (FN) Saw Sigulated... 74 8-ead Plasti ual-flat, No-ead Pakage (M) 4x4 mm ody (QFN) Saw Sigulated... 75 6-ead Plasti Quad-Flat No-ead Pakage (M) 4x4x0.9 mm ody (QFN) Saw Sigulated... 76 0-ead Plasti Quad-Flat No-ead Pakage (M) 4x4x0.9 mm ody, Saw Sigulated (QFN)... 77 8-ead Plasti Quad-Flat No-ead Pakage (M) 6x6 mm ody (QFN) With 0.55 mm Cotat egth (Saw Sigulated)...78 8-ead Plasti Quad-Flat No-ead Pakage (M) 6x6x0.9 mm ody (QFN-S) With 0.40 mm Cotat egth (Saw Sigulated)...79 44-ead Plasti Quad-Flat No-ead Pakage (M) 8x8 mm ody (QFN)... 80 S00049F-age iv 006 Mirohi Tehology I.

Pakagig Idex PSTIC MICRO SM-OUTIN (MSOP) FMIY 8-ead Plasti Miro Small-Outlie Pakage (MS) (MSOP)... 8 0-ead Plasti Miro Small-Outlie Pakage (MS) (MSOP)... 8 PSTIC SHRINK SM-OUTIN (SSOP) FMIY 6-ead Plasti Small-Outlie Pakage Narrow ody (QR) (QSOP)... 83 0-ead Plasti Shrik Small-Outlie (SS) 09 mil ody, 5.30 mm (SSOP)... 84 4-ead Plasti Shrik Small-Outlie (SS) (SSOP)... 85 8-ead Plasti Shrik Small-Outlie (SS) 09 mil ody, 5.30 mm (SSOP)... 86 PSTIC THIN SHRINK SM-OUTIN (TSSOP) FMIY 8-ead Plasti Thi Shrik Small-Outlie (ST) 4.4 mm ody (TSSOP)... 87 4-ead Plasti Thi Shrik Small-Outlie (ST) 4.4 mm ody (TSSOP)... 88 0-ead Plasti Thi Shrik Small-Outlie (ST) 4.4 mm ody (TSSOP)... 89 PSTIC THIN SM-OUTIN (TSOP) N VRY SM OUTIN (VSOP) FMIY 8-ead Plasti Thi Small-Outlie (TS) 5 x 0 mm ody (TSOP)... 9 8-ead Plasti Very Small Outlie (VS) 8 x 3.4 mm ody (VSOP)... 9 PSTIC OW-PROFI QU FTPCK (QFP) FMIY 3-ead Plasti ow-profile Quad Flatak (P) 7x7x.4 mm ody,.0/0.0 mm ead Form (QFP)... 93 PSTIC MTRIC-QU FTPCK (MQFP) FMIY 44-ead Plasti Metri-Quad Flatak (PQ) 0x0x mm ody,.6/0.5 mm ead Form (MQFP)... 95 64-ead Metri-Quad Flatak (KU) 4x4x.7 mm ody,.6/0.5 mm ead Form (MQFP)... 96 PSTIC QU FTPCK (PQFP) FMIY 44-ead Plasti Quad Flatak (KW) 0x0x.0 mm ody,.95/0.5 mm ead Form (PQFP)... 97 PSTIC THIN-QU FTPCK (TQFP) FMIY 3-ead Plasti Thi-Quad Flatak (PT) 7x7x mm ody,.0/0.0 mm ead Form (TQFP)... 99 44-ead Plasti Thi-Quad Flatak (PT) 0x0x mm ody,.0/0.0 mm ead Form (TQFP)... 00 64-ead Plasti Thi-Quad Flatak (PT) 0x0x mm ody,.0/0.0 mm ead Form (TQFP)... 0 64-ead Plasti Thi-Quad Flatak (PT) 4x4x mm ody,.0/0.0 mm ead Form (TQFP)... 0 80-ead Plasti Thi-Quad Flatak (PT) xx mm ody,.0/0.0 mm ead Form (TQFP)... 03 80-ead Plasti Thi-Quad Flatak (PT) 4x4x mm ody,.0/0.0 mm ead Form (TQFP)... 04 00-ead Plasti Thi-Quad Flatak (PT) xx mm ody,.0/0.0 mm ead Form (TQFP)... 05 00-ead Plasti Thi-Quad Flatak (PF) 4x4x mm ody,.0/0.0 mm ead Form (TQFP)... 06 006 Mirohi Tehology I. S00049F-age v

Pakagig Idex NOTS: S00049F-age vi 006 Mirohi Tehology I.

PRT NUMR SUFFIX SIGNTIONS: XXXXXXXXXX XX X/XX XXX Outlies ad Parameters PCKGING QTP, SQTP or ROM Code; Seial Requiremets Pakage: C = 000 F CO Module,.75 mm MF = ual-flat, No eads (FN-S) 3C = 330 F CO Module,.45 mm M = Quad Flat No eads (QFN) = Plasti eaded Chi Carrier (PCC) MS = Plasti Miro Small Outlie (MSOP) P = Plasti IP MT = 5-ead SOT-89 Small Outlie Trasistor S = ie i Waffle Pak OS = 5-ead Thi Small Outlie Trasistor W = ie i Wafer Form OT = 5-ead SOT-3 Small Outlie Trasistor = 5-lead TO-0 PF = 00-ead Plasti Quad Flatak (TQFP) C = Chi o oard (CO) PQ = Plasti Metri-Quad Flatak (MQFP) CH/OT = 6-ead SOT-3 P = Plasti ow-profile Quad Flatak (QFP) C = Widowed CRQU PT = Plasti Thi-Quad Flatak (TQFP) /RC = Plasti Small Outlie Trasistor (SOT) QR = Plasti Small Outlie Narrow ody (QSOP) = 3-lead PK S = umed ie i Waffle Pak K = 7-lead PK S = 4-lead Small Outlie (50 mil) T = 5-lead PK SM = 8-lead Small Outlie (07 mil) J = 8-ead No-Widowed CRIP SN = 8-lead Small Outlie (50 mil) J = 4-ead No-Widowed CRIP SO = Plasti Small Outlie (SOIC) (300 mil) J = 6-ead No-Widowed CRIP SP = Plasti Skiy IP JG = 4-ead No-Widowed CRIP SS = Plasti Shrik Small Outlie JJ = 8-ead No-Widowed CRIP ST = Thi Shrik Small Outlie (4.4 mm) JK = 40-ead No-Widowed CRIP TO = Trasistor Outlie JW = Widowed CRIP TS = Thi Small Outlie (8mm x 0 mm) KU = Metri-Quad Flatak (MQFP) TT = 3-ead SOT-3 Small Outlie Trasistor KW = Plasti Quad Flatak (PQFP) VS = Very Small Outlie (8 mm x mm) = 3-ead SC-70 W = umed Wafer ( mil) T = 5-ead SC-70 WF = Sawed Wafer o Frame (7 mil) M = 3-ead SOT-89 WF = umed, Sawed Wafer o Frame MC = ual-flat, No eads (FN) WM = SOT-385 eadless Module Proess Temerature: lak = 0 C to +70 C (xteded) = -40 C to +5 C I (Idustrial) = -40 C to +85 C Seed: OR Crystal Frequey esigator for PICmiro MCUs -90 = 90 s P = C to 0 MHz, High-Seed Crystal Osillator -0 = 00 s RC = C to MHz, XT ad RC Osillator Suort - = 0 s XT = C to 4 MHz Iteral, XT, RC Os Suort -5 = 50 s HS = C to 00 khz, P Osillator Suort -7 = 70 s 0 = C to 0 MHz, HS Osillator Suort -0 = 00 s 04 = C to 0 MHz, High-Seed Crystal Osillator -5 = 50 s 04 = C to MHz, XT ad RC Osillator Suort -30 = 300 s 0 = C to 4 MHz Iteral, XT, RC Os Suort Otio: T = Tae ad Reel Shimets F = 00 μs lak = tw = ms X = Rotated iout evie Tye: (U to 0 digits) =.8V PROM Memory C = ow-power CMOS/PROM/PROM MCU C = CMOS PROM MCU CR = ow-power CMOS ROM MCU C = CMOS PROM/PROM MCU CS = ow-power Seurity CR = CMOS ROM MCU F = ow-power Flash MCU F = Flash MCU V = ow Voltage HC = High Seed 4 = -Wire (I C ) HV = High Voltage 5 = SPI 006 Mirohi Tehology I. S00049F-age

Pakagig NOTS: S00049F-age 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody W T U e Uits imesio imits Number of Pis Pith To to Seatig Plae To of ody to Seatig Plae Stadoff Pakage Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow iameter W id egth T id Width U * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-05 rawig No. C04-083 MIN.45.03.05.80.50.30.008.050.06.96.6.440.60 INCHS* NOM 8.00.65.3.035.90.50.40.00.055.08.30.66.450.70 MX.85.43.045.300.530.50.0.060.00.34.7.460.80 MIIMTRS MIN NOM 8.54 3.68 4.9.6 3. 0.64 0.89 7. 7.37.95 3. 3.30 3.56 0.0 0.5.7.40 0.4 0.46 7.5 7.87 4.09 4..8.43 6.60 6.86 MX 4.70 3.63.4 7.6 3.46 3.8 0.30.5 0.5 8.3 4.34.68 7. 006 Mirohi Tehology I. S00049F-age 3

Pakagig iagrams ad Parameters 4-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody W T U e Uits imesio imits Number of Pis Pith To to Seatig Plae To of ody to Seatig Plae Stadoff Pakage Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow iameter W id egth T id Width U * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-05 rawig No. C04-07 MIN.4.00.05.80.693.30.008.05.06.96.6.440.60 INCHS* NOM 4.00.6.0.035.90.700.40.00.054.08.30.66.450.70 MX.8.40.045.300.707.50.0.056.00.34.7.460.80 MIIMTRS MIN NOM 4.54 3.6 4..54 3.05 0.64 0.89 7. 7.37 7.60 7.78 3.30 3.56 0.0 0.5.3.37 0.4 0.46 7.5 7.87 4.09 4..8.43 6.60 6.86 MX 4.6 3.56.4 7.6 7.96 3.8 0.30.4 0.5 8.3 4.34.68 7. S00049F-age 4 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Cerami Side-razed ual I-lie with Widow (JW) 300 mil ody W T U e Uits imesio imits Number of Pis Pith To to Seatig Plae To of ody to Seatig Plae Stadoff Pakage Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow iameter W id egth T id Width U * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-05 rawig No. C04-084 MIN.55.5.040.80.386.30.008.048.06.96.6.490.75 INCHS* NOM 8.00.77.35.050.90.400.40.00.050.08.30.66.500.85 MX.98.55.060.300.44.50.0.05.00.34.7.50.95 MIIMTRS MIN NOM 8.54 3.94 4.48.9 3.43.0.7 7. 7.37 35.0 35.56 3.30 3.56 0.0 0.5..7 0.4 0.46 7.5 7.87 4.09 4..45.70 6.99 7.4 MX 5.03 3.94.5 7.6 35.9 3.8 0.30.3 0.5 8.3 4.34.95 7.49 006 Mirohi Tehology I. S00049F-age 5

Pakagig iagrams ad Parameters NOTS: S00049F-age 6 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie (J) 300 mil ody (CRIP) e Number of Pis Pith To to Seatig Plae Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-030 rawig No. C04-00 Uits imesio imits e MIN.60.00.90.30.370.5.008.045.06.30 INCHS * NOM 8.00.80.030.305.65.385.63.0.055.08.360 MX.00.040.30.300.400.00.05.065.00.400 MIIMTRS MIN NOM 8.54 4.06 4.57 0.5 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.8 4.3 0.0 0.9.4.40 0.4 0.46 8.3 9.5 MX 5.08.0 8.3 7.6 0.6 5.08 0.38.65 0.5 0.6 006 Mirohi Tehology I. S00049F-age 7

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP) W e Number of Pis Pith To to Seatig Plae Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig Uits imesio imits e MIN.60.00.90.30.370.5.008.045.06.30 INCHS * NOM 8.00.80.030.305.65.385.63.0.055.08.360 MX.00.040.30.300.400.00.05.065.00.400 MIN 4.06 0.5 7.37 5.84 9.40 3.8 0.0.4 0.4 8.3 MIIMTRS Widow iameter W.67.70.73 6.78 6.86 6.93 * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-030 rawig No. C04-07 NOM 8.54 4.57 0.77 7.75 6.73 9.78 4.3 0.9.40 0.46 9.5 MX 5.08.0 8.3 7.6 0.6 5.08 0.38.65 0.5 0.6 S00049F-age 8 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 4-ead Cerami ual I-lie (J) 300 mil ody (CRIP) e Number of Pis Pith To to Seatig Plae Stadoff Shoulder-to-Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charaterist i JC quivalet: MS-030 rawig No. C04-00 imesio imits Uits e MIN.60.05.90.80.75.5.008.045.05.35 INCHS* NOM 8.00.80.030.305.88.760.63.0.055.08.360 MX.00.040.35.96.780.00.04.065.0.40 MIIMTRS MIN NOM MX 8.54 4.06 4.57 5.08 0.38 0.76.0 7.37 7.75 8.5 7. 7.3 7.5 9.0 9.30 9.8 3.8 4.4 5.08 0.0 0.30 0.36.4.40.65 0.38 0.46 0.53 8.5 9.4 0.4 Revised 09-6-05 006 Mirohi Tehology I. S00049F-age 9

Pakagig iagrams ad Parameters 4-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP) W e Number of Pis Pith To to Seatig Plae Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig Uits imesio imits e MIN.60.05.90.80.75.5.008.045.05.35 INCHS * NOM 4.00.80.030.305.88.760.63.0.055.08.360 MX.00.040.35.96.780.00.04.065.0.40 MIN 4.06 0.38 7.37 7. 9.0 3.8 0.0.4 0.38 8.5 MIIMTRS Widow iameter W.5.70.0 3.8 4.3 5.33 * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-030 C rawig No. C04-099 NOM 4.54 4.57 0.76 7.75 7.3 9.30 4.4 0.30.40 0.46 9.4 MX 5.08.0 8.5 7.5 9.8 5.08 0.36.65 0.53 0.4 S00049F-age 0 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 6-ead Cerami ual I-lie (J) 300 mil ody (CRIP) e Number of Pis Pith To to Seatig Plae Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-030 rawig No. C04-003 Uits imesio imits e MIN.60.05.90.80.75.5.008.045.05.35 INCHS * NOM 8.00.80.030.305.88.760.63.0.055.08.360 MX.00.040.35.96.780.00.04.065.0.40 MIIMTRS MIN NOM 8.54 4.06 4.57 0.38 0.76 7.37 7.75 7. 7.3 9.0 9.30 3.8 4.4 0.0 0.30.4.40 0.38 0.46 8.5 9.4 MX 5.08.0 8.5 7.5 9.8 5.08 0.36.65 0.53 0.4 006 Mirohi Tehology I. S00049F-age

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP) W W e Uits imesio imits Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow Width W Widow egth W * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MO-036 rawig No. C04-00 MIN.70.55.05.300.85.880.5.008.050.06.345.30.90 INCHS* NOM 8.00.83.60.03.33.90.900.38.00.055.09.385.40.00 MX.95.65.030.35.95.90.50.0.060.0.45.50.0 MIIMTRS MIN NOM MX 8.54 4.3 4.64 4.95 3.94 4.06 4.9 0.38 0.57 0.76 7.6 7.94 8.6 7.4 7.37 7.49.35.86 3.37 3.8 3.49 3.8 0.0 0.5 0.30.7.40.5 0.4 0.47 0.53 8.76 9.78 0.80 3.30 3.56 3.8 4.83 5.08 5.33 S00049F-age 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 0-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP) W e Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig Widow iameter Uits imesio imits e W MIN.70.40.05.308.80.94.5.008.050.05.35.67 INCHS * NOM 0.00.83.60.03.33.88.950.38.00.055.09.385.70 MX.00.75.030.35.96.970.00.0.060.03.40.73 MIIMTRS MIN NOM MX 0.54 4.3 4.65 5.08 3.56 4.06 4.45 0.38 0.58 0.76 7.8 7.95 8.5 7. 7.3 7.5 3.93 4.3 4.64 3.8 3.5 5.08 0.0 0.5 0.30.7.40.5 0.38 0.48 0.58 8.5 9.78 0.4 4.4 4.3 4.39 * Cotrollig Parameter JC quivalet: MS-030 rawig No. C04-5 006 Mirohi Tehology I. S00049F-age 3

Pakagig iagrams ad Parameters 4-ead Cerami ual I-lie (JG) 600 mil ody (CRIP) e Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-03 rawig No. C04-004 Uits imesio imits e MIN.70.40.05.608.5.4.5.008.045.05.65 INCHS * NOM 4.00.90 -- -- --.50.50.63.0.055.08.660 MX.5.75 --.65.58.70.00.04.065.03.70 MIIMTRS MIN NOM 8.54 4.3 4.83 3.56 -- 0.38 -- 5.44 -- 3.00 3. 3.55 3.75 3.8 4.4 0.0 0.30.4.40 0.38 0.46 5.88 6.76 MX 5.7 4.45 -- 5.88 3.4 3.6 5.08 0.36.65 0.58 8.03 S00049F-age 4 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie (JJ) 600 mil ody (CRIP) e Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-03 rawig No. C04-006 Uits imesio imits e MIN.70.40.05.608.5.44.5.008.045.05.65 INCHS * NOM 8.00.90 -- -- --.50.450.63.0.055.08.660 MX.5.75 --.65.58.470.00.05.065.03.70 MIIMTRS MIN NOM 8.54 4.3 4.83 3.56 -- 0.38 -- 5.44 -- 3.00 3. 36.63 36.83 3.8 4.4 0.0 0.30.4.40 0.38 0.46 5.88 6.76 MX 5.7 4.45 -- 5.88 3.4 37.34 5.08 0.38.65 0.58 8.03 006 Mirohi Tehology I. S00049F-age 5

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie with Widow (JW) 300 mil ody (CRIP) W W e Uits imesio imits Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow Width W Widow egth W * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MO-058 rawig No. C04-080 MIN.70.55.05.300.85.430.35.008.050.06.345.30.90 INCHS* NOM 8.00.83.60.03.33.90.458.40.00.058.09.385.40.300 MX.95.65.030.35.95.485.45.0.065.0.45.50.30 MIIMTRS MIN NOM MX 8.54 4.3 4.64 4.95 3.94 4.06 4.9 0.38 0.57 0.76 7.6 7.94 8.6 7.4 7.37 7.49 36.3 37.0 37.7 3.43 3.56 3.68 0.0 0.5 0.30.7.46.65 0.4 0.47 0.53 8.76 9.78 0.80 3.30 3.56 3.8 7.37 7.6 7.87 S00049F-age 6 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Cerami ual I-lie with Widow (JW) 600 mil ody (CRIP) W e Uits imesio imits Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow iameter W * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MO-03 rawig No. C04-03 MIN.95.55.05.595.54.430.5.008.050.06.60.70 INCHS* NOM 8.00.0.60.038.600.50.460.38.00.058.00.660.80 MX.5.65.060.65.56.490.50.0.065.03.70.90 MIIMTRS MIN NOM 8.54 4.95 5.33 3.94 4.06 0.38 0.95 5. 5.4 3.06 3. 36.3 37.08 3.8 3.49 0.0 0.5.7.46 0.4 0.5 5.49 6.76 6.86 7. MX 5.7 4.9.5 5.88 3.36 37.85 3.8 0.30.65 0.58 8.03 7.37 006 Mirohi Tehology I. S00049F-age 7

Pakagig iagrams ad Parameters 40-ead Cerami ual I-lie (JK) 600 mil ody (CRIP) e Uits imesio imits Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MS-03 rawig No. C04-008 e MIN.70.40.00.590.5.04.5.008.045.05.65 INCHS * NOM 40.00.90 --.040.605.50.050.63.0.055.08.660 MX.5.80.060.65.58.070.00.04.065.03.70 MIIMTRS MIN NOM 40.54 4.3 4.83 3.56 -- 0.5.0 4.99 5.37 3.00 3. 5.87 5.07 3.8 4.4 0.0 0.30.4.40 0.38 0.46 5.88 6.76 MX 5.7 4.57.5 5.88 3.4 5.58 5.08 0.36.65 0.58 8.03 S00049F-age 8 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 40-ead Cerami ual I-lie with Widow (JW) 600 mil ody (CRIP) W e Uits imesio imits Number of Pis Pith To to Seatig Plae Cerami Pakage Height Stadoff Shoulder to Shoulder Width Cerami Pkg. Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Overall Row Saig e Widow iameter W * Cotrollig Parameter Sigifiat Charateristi JC quivalet: MO-03 rawig No. C04-04 MIN.85.55.030.595.54.040.35.008.050.06.60.340 INCHS* NOM 40.00.05.60.045.600.50.050.40.0.053.00.660.350 MX.5.65.060.65.56.060.45.04.055.03.70.360 MIIMTRS MIN NOM 40.54 4.70 5. 3.94 4.06 0.76.4 5. 5.4 3.06 3. 5.8 5.07 3.43 3.56 0.0 0.8.7.33 0.4 0.5 5.49 6.76 8.64 8.89 MX 5.7 4.9.5 5.88 3.36 5.3 3.68 0.36.40 0.58 8.03 9.4 006 Mirohi Tehology I. S00049F-age 9

Pakagig iagrams ad Parameters NOTS: S00049F-age 0 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 68-ead Cerami eaded (C) Chi Carrier with Widow Square (CRQU) #leads= W C R.00 MIN. R.00 MIN. R CH x 45 3 TI TI 45 3 3 Uits INCHS* imesio imits MIN NOM MX Number of Pis 68 Pis eah side 7 Pith.050 Overall Height.55.7.90 Pakage Thikess.3 RF ead Height.090.00.0 Side Oe Chamfer im. 3.030.035.040 Corer Chamfer () CH.030.040.050 Corer Radius (Others) R.00.05.030 Overall Pakage Width.985.990.995 Overall Pakage egth.985.990.995 Cerami Pakage Width.930.950.965 Cerami Pakage egth.930.950.965 Overall ead Ceters 3.800 RF Overall ead Ceters 3.800 RF Footrit.880.90.940 Footrit.880.90.940 ead egth.006 - - ead Thikess C.006.007.00 Uer ead Width.06.09.03 ower ead Width.07.09.0 Widow iameter W.370.380.390 * Cotrollig Parameter RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC quivalet: MO-087 rawig No. C04-097 MIIMTRS MIN NOM MX 68 7.7 3.94 4.37 4.83 3.35 RF.9.54 3.05 0.76 0.89.0 0.76.0.7 0.5 0.64 0.76 5.0 5.5 5.7 5.0 5.5 5.7 3.6 4.3 4.5 3.6 4.3 4.5 0.3 RF 0.3 RF.35 3. 3.88.35 3. 3.88 0.5 - - 0.5 0.8 0.5 0.66 0.74 0.8 0.43 0.48 0.53 9.40 9.65 9.9 Revised 07--05 006 Mirohi Tehology I. S00049F-age

Pakagig iagrams ad Parameters 84-ead Cerami eaded (C) Chi Carrier with Widow Square (CRQU) #leads= W C R.00 MIN. R.00 MIN. R CH x 45 3 45 TI TI 3 3 Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM Number of Pis 84 84 Pis eah side Pith.050.7 Overall Height.55.7.90 3.94 4.37 Pakage Thikess ead Height Side Oe Chamfer im. Corer Chamfer () Corer Radius (others) Overall Pakage Width Overall Pakage egth Cerami Pakage Width Cerami Pakage egth Footrit Footrit 3 CH R.090.0.030.035.040 0.76 0.89.0.040 RF.0 RF -.85 -.90.05.95-30.0-30.3 0.64 30.35.85.30.3 RF.00.90.50.95.65.30.50.65.080.0.40.080.0.40 30.0 8.70 8.70 3.35 RF.54 Overall ead Ceters 3.00 RF 5.40 RF Overall ead Ceters 3.00 RF 5.40 RF 30.3 9. 9.3 ead egth.006 - - 0.5 - - ead Thikess ower ead Width C.006.07.007.09.00.0 0.5 0.43 0.8 0.48 0.5 0.53 Uer ead Width.06.09.03 0.66 0.74 0.8 Widow iameter W.395.400.405 0.03 0.6 0.9 * Cotrollig Parameter RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC quivalet: MO-087 Revised 07--05 rawig No. C04-.9 7.43 7.43 8.9 8.9 MX 4.83 3.05 30.35 9.59 9.59 8.96 8.96 S00049F-age 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 3-ead Plasti Trasistor Outlie (TO) (TO-9) 3 R Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 3 3 Pith.050.7 ottom to Pakage Flat.30.43.55 3.30 3.6 3.94 Overall Width.75.86.95 4.45 4.7 4.95 Overall egth.70.83.95 4.3 4.64 4.95 Molded Pakage Radius R.085.090.095.6.9.4 Ti to Seatig Plae.500.555.60.70 4.0 5.49 ead Thikess.04.07.00 0.36 0.43 0.5 ead Width.06.09.0 0.4 0.48 0.56 Mold raft gle To 4 5 6 4 5 6 Mold raft gle ottom 3 4 3 4 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: TO-9 rawig No. C04-0 006 Mirohi Tehology I. S00049F-age 3

Pakagig iagrams ad Parameters 3-ead Plasti Small Outlie Trasistor Header (M) (SOT-89) H 3 R C Pith Outside ead Pith Overall Height Overall Width Molded Pakage Width at To Overall egth Tab egth ead Thikess ead Width imesio imits Uits H MIN INCHS.059 SC.8 SC.055.55.084.73.064.04.07 MX.063.67.090.8.07.09.0 MIIMTRS* MIN.50 SC 3.00 SC Molded Pakage Width at ase.090.0.9.60 Tab Corer Radii R.00 0.54 Foot egth.035.047 0.89.0 eads & 3 Width.04.09 0.36 0.48 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M JC quivalet: TO-43 rawig No. C04-09.40 3.94.3 4.40.6 0.35 0.43 MX Revised 09-9-03.60 4.5.9 4.60.83 0.48 0.56 S00049F-age 4 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 5-ead Plasti Small Outlie Trasistor Header (MT) (SOT-89) 4 3 5 H Pith Outside lead ith (basi) Overall Height Overall Width Overall egth Tab Width Foot egth.03-0.80 ead Thikess.05.07 0.37 ead Width imesio imits Uits H C MIN INCHS.059 SC.8 SC.055.73.055.06 MX.063 -.77 -.8.07.0 MIIMTRS* MIN.50 SC 3.00 SC Molded Pakage Width.090.0.9.60 eads,3, 4 & 5 Width.04.09 0.36 0.48 Tab ead Width.03.09 0.3 0.48 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC quivalet TO-43 rawig No. C04-030.40 4.40.40 0.4 MX.60 4.50 4.60.80 0.44-0.53 006 Mirohi Tehology I. S00049F-age 5

Pakagig iagrams ad Parameters 5-ead Plasti Trasistor Outlie () (TO-0) H Q e e3 e JCTOR PIN ØP (5 ) C J F ead Pith Overall Height Overall Width ead egth ead Thikess ead Width Mold raft gle imesio imits Uits e C MIN.060 Overall ead Ceters e.63 Overall egth INCHS*.60.90 4.06.385.560.540.04.05.560 3.7 MIIMTRS.0 0.36 0.56 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54 mm) er side. JC equivalet: TO-0 rawig No. C04-036 Revised 08-0-05 MX.040 MIN 0.64 MX.07.5.83.73 6.68 6.93 Sae etwee eads e3.030.040 0.76.0 4.83.45 9.78 0.54.590 4. 4.99 Flag egth H.34.58 5.94 6.55 Flag Thikess F.045.055.4.40 Through Hole Ceter Q.03.3.6.87 Through Hole iameter P.46.56 3.7 3.96 4. ase to ottom of ead J.090.5.9.9.0 3 7 3 7 S00049F-age 6 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 5-ead Thi Small Outlie Trasistor (OS) (TSOT) φ Uits INCHS MIIMTRS* imesio imits MIN NOM MX MIN NOM MX Number of Pis 5 5 Pith.037 SC. 0.95 SC. Outside lead ith.075 SC..90 SC. Overall Height.039.00 Molded Pakage Thikess.033.034.035 0.84 0.87 0.90 Stadoff.000.00.004 0.0 0.05 0.0 Overall Width.0.0.8.60.80 3.00 Molded Pakage Width.063.60 Overall egth.4.90 Foot egth.0.06.00 0.30 0.40 0.50 Foot gle φ 0 4 8 0 4 8 ead Thikess.004.006.008 0.09 0.5 0.0 ead Width.0.08 0.30 0.45 Mold raft gle To 4 0 4 0 Mold raft gle ottom 4 0 4 0 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M rawig No. C04-8 Revised 9-4-05 006 Mirohi Tehology I. S00049F-age 7

Pakagig iagrams ad Parameters 3-ead Plasti Small Outlie Trasistor (TT) (SOT-3) φ Number of Pis Pith Outside lead ith (basi) Overall Height Molded Pakage Thikess Stadoff Overall Width Molded Pakage Width Overall egth Foot egth Foot gle ead Thikess ead Width Mold raft gle To Mold raft gle ottom * Cotrollig Parameter Uits imesio imits φ MIN.035.035.000.083.047.0.04.004.05 0 0 0 INCHS* NOM.038.076.040.037.00.093.05.5.08.006.07 3 5 5 5 MX.044.040.004.04.055.0.0 0.007.00 0 0 MIN 0.89 0.88 0.0.0.0.80 0.35 0.09 0.37 0 0 0 MIIMTRS imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side SC: asi imesio. Theoretially exat. value show without toleraes. See SM Y4.5M RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC quivalet: TO-36 rawig No. C04-04 Revised 07-9-05 NOM 0.96.9.0 0.95 0.06.37.30.9 0.45 0.4 0.44 3 5 5 5 MX..0 0.0.64.40 3.04 0.55 0 0.8 0.5 0 0 S00049F-age 8 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 3-ead Plasti Small Outlie Trasistor (C) (SOT-3) φ Number of Pis Pith Outside lead ith (basi) Overall Height Molded Pakage Thikess Stadoff Overall Width Molded Pakage Width Overall egth Foot egth Foot gle ead Thikess ead Width * Cotrollig Parameter imesio imits Uits φ MIN.035.035.000.098.055.06.04.004.0 INCHS NOM.037 SC.075 SC 3 MX.055.05.006.8.07..0.04.09 MIN 0.90 0.90 0.00.50.40.70 0.35 0.0 0.30 MIIMTRS* 0.95 SC.90 SC imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M IJ quivalet: SC-59 rawig No. C04-30 0 0 0 NOM 3 Revised 09-4-05 MX.40.30 0.5 3.00.80 3.0 0.55 0 0.35 0.50 006 Mirohi Tehology I. S00049F-age 9

Pakagig iagrams ad Parameters 3-ead Plasti Small Outlie Trasistor () (SOT-3) b e e φ b Uits INCHS MIIMTRS* imesio imits MIN NOM MX MIN NOM MX Pith e.09 SC.30 SC Outside lead ith (basi) e.8 SC 4.60 SC Overall Height.07.80 Stadoff.00.004 0.0 0.0 Molded Pakage Height.06.063.065.55.60.65 Overall Width.64.76.87 6.70 7.00 7.30 Molded Pakage Width.30.38.46 3.30 3.50 3.70 Overall egth.48.56.64 6.30 6.50 6.70 ead Thikess.009.0.04 0.3 0.30 0.35 ead Width b.06.030.033 0.65 0.76 0.85 Tab ead Width b.4.8.4.90 3.00 3.5 Foot egth.035 0.90 ead gle φ 0 0 0.37 0 Mold raft gle, To 0 6 0 6 Mold raft gle, ottom 0 6 0 6 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M JC quivalet TO-6 Revised 09-3-05 rawig No. C04-03 S00049F-age 30 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 4-ead Plasti Small Outlie Trasistor (RC) (SOT-43) e/ e 4 3 e Φ b (3X) b () Uits INCHS MIIMTRS* imesio imits MIN NOM MX MIN NOM Number of Pis 4 4 Pith e.076 SC.9 SC Pi Offset e.008 SC 0.0 SC Overall Height.03.048 0.80 Molded Pakage Thikess.030.035.04 0.75 0.90 Stadoff.00.006 0.05 Overall Width.083.04.0 Molded Pakage Width.047.05.055.0.30 Overall egth.0.4.0.80.90 Foot egth.06.00.04 0.40 0.50 Footrit Foot gle () Φ 0.063 RF 8 0.60 RF ead Thikess.003.008 0.08 ead Width b.030.035 0.76 0.89 eads, 3 & 4 Width * Cotrollig Parameter Sigifiat Charateristi b.0 imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. JC equivalet: TO-53 rawig No. C04-03 Revised 08--05.00 0.30 MX..07 0.5.64.40 3.04 0.60 8 0.0 0.50 006 Mirohi Tehology I. S00049F-age 3

Pakagig iagrams ad Parameters 5-ead Plasti Small Outlie Trasistor (OT) (SOT-3) φ Number of Pis Pith Outside lead ith (basi) Overall Height Molded Pakage Thikess Stadoff Overall Width Molded Pakage Width Overall egth Foot egth Foot gle ead Thikess imesio imits Uits f MIN.035.035.000.0.059.0.04.004 0 INCHS* ead Width.04.07.00 0.35 0.43 0.50 Mold raft gle To a 0 5 0 0 5 0 Mold raft gle ottom b 0 5 0 0 5 0 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. IJ quivalet: SC-74 rawig No. C04-09 Revised 09--05 NOM.038.075.046.043.003.0.064.6.08.006 5 5 MX.057.05.006.8.069..0 0.008 MIN 0.90 0.90 0.00.60.50.80 0.35 0.09 0 MIIMTRS NOM 0.95.90.8.0 0.08.80.63.95 0.45 0.5 5 5 MX.45.30 0.5 3.00.75 3.0 0.55 0 0.0 S00049F-age 3 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 6-ead Plasti Small Outlie Trasistor (CH or OT) (SOT-3) φ Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 6 6 Pith.038 SC 0.95 SC Outside lead ith.075 SC.90 SC Overall Height.035.046.057 0.90.8.45 Molded Pakage Thikess.035.043.05 0.90.0.30 Stadoff.000.003.006 0.00 0.08 0.5 Overall Width.0.0.8.60.80 3.00 Molded Pakage Width.059.064.069.50.63.75 Overall egth.0.6..80.95 3.0 Foot egth.04.08.0 0.35 0.45 0.55 Foot gle φ 0 5 0 0 5 0 ead Thikess.004.006.008 0.09 0.5 0.0 ead Width.04.07.00 0.35 0.43 0.50 Mold raft gle To 0 5 0 0 5 0 Mold raft gle ottom 0 5 0 0 5 0 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M JIT (formerly IJ) equivalet: SC-74 rawig No. C04-0 Revised 09--05 006 Mirohi Tehology I. S00049F-age 33

Pakagig iagrams ad Parameters 3-ead Plasti Small Outlie Trasistor () (SC-70) b 3 Uits INCHS MIIMTRS* imesio imits MIN MX MIN MX Number of Pis 3 3 Pith.06 SC 0.65 SC Outside lead ith.05 SC.30 SC Overall Height.03.043 0.80.0 Molded Pakage Thikess.03.039 0.80.00 Stadoff.000.0004 0.00.00 Overall Width.07.094.80.40 Molded Pakage Width.045.053.5.35 Overall egth.07.089.80.5 Foot egth.008.08 0. 0.46 ead Thikess.003.00 0.08 0.5 ead Width b.006.06 0.5 0.40 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M JIT (IJ) quivalet: SC70 rawig No. C04-060 Udated 0-07-05 S00049F-age 34 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 5-ead Plasti Small Outlie Trasistor (T) (SC-70) Q Uits INCHS MIIMTRS* imesio imits MIN NOM MX MIN NOM MX Number of Pis 5 5 Pith.06 (SC) 0.65 (SC) Overall Height.03.043 0.80.0 Molded Pakage Thikess.03.039 0.80.00 Stadoff.000.004 0.00 0.0 Overall Width.07.094.80.40 Molded Pakage Width.045.053.5.35 Overall egth.07.087.80.0 Foot egth.004.0 0.0 0.30 To of Molded Pkg to ead Shoulder Q.004.06 0.0 0.40 ead Thikess.004.007 0.0 0.8 ead Width.006.0 0.5 0.30 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.005" (0.7mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M JIT (IJ) Stadard: SC-70 rawig No. C04-06 Revised 07-9-05 006 Mirohi Tehology I. S00049F-age 35

Pakagig iagrams ad Parameters eadless Wedge Module Plasti Small Outlie Trasistor (WM) (SOT-385) CH x 45 F J CH x 45 TYP. TYP. Uits INCHS MIIMTRS* imesio imits MIN NOM MX MIN NOM MX Overall Height.4.8.0.90 3.00 3.05 ottom of Pakage to Chamfer.075.079.083.90.00.0 Overall Width.36.40.44 6.00 6.0 6.0 Overall egth.47.476.480.00.0.0 Width at Taered d J.73.77.8 4.40 4.50 4.60 egth of Flat F.93.97.00 4.90 5.00 5.0 Chamfer istae, Horizotal CH.039.043.047.00.0.0 Chamfer istae, Vertial CH.039.043.047.00.0.0 Mold raft gle To 4 6 8 4 6 8 Mold raft gle ottom 4 6 8 4 6 8 * Cotrollig Parameter imesios,, F ad J do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. rawig No. C04-09 S00049F-age 36 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 3-ead Plasti () (PK) 3 b e OTTOM VIW b TOP VIW (5X) φ Number of Pis Pith Overall Height Stadoff Overall Width xosed Pad Width Molded Pakage egth Overall egth Uer ead Width Uits imesio imits e.70.000 INCHS*.00 SC.56 RF Foot gle φ -- -- 8 Mold raft gle 3 -- 7 MIN NOM * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. SC: asi imesio. Theoretially, exat value show without toleraes. See SM Y4.5M RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC equivalet: TO-5 Revised 07-9-05 rawig No. C04-0 3 MX.83 MIN MIIMTRS NOM.54 SC 4.50.005.00 0.00 0.3 6.50 RF Foot egth.068 --.0.73 --.79.77 4.3 3 MX 4.65 0.5.385.398.40 9.78 0. 0.4.330.350.370 8.38 8.89 9.40.549.577.605 3.94 4.66 5.37 xosed Pad egth.303 RF 7.70 RF ead Thikess.04.00.06 0.36 0.5 0.66 Pad Thikess.045 --.055.4 --.40 ower ead Width b.06.03.037 0.66 0.8 0.94 b.049.050.05.4.7.30 Pad egth 3.045 --.067.4 --.70 -- 3 -- -- 8 7 006 Mirohi Tehology I. S00049F-age 37

Pakagig iagrams ad Parameters 5-ead Plasti (T) (PK) 3 b e TOP VIW OTTOM VIW (5X) Φ Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 5 5 Pith e.067 SC.70 SC Overall Height.70.77.83 4.3 4.50 4.65 Stadoff.000.005.00 0.00 0.3 0.5 Overall Width.385.398.40 9.78 0. 0.4 xosed Pad Width.56 RF 6.50 RF Molded Pakage egth.330.350.370 8.38 8.89 9.40 Overall egth.549.577.605 3.94 4.66 5.37 xosed Pad egth.303 RF 7.75 RF ead Thikess.04.00.06 0.36 0.5 0.66 Pad Thikess.045 --.055.4 --.40 ead Width b.06.03.037 0.66 0.8 0.94 Foot egth.068.089.0.73.6.79 Pad egth 3.045 --.067.4 --.70 Foot gle Φ -- -- 8 -- -- 8 Mold raft gle 3 -- 7 3 -- 7 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC equivalet: TO-5 rawig No. C04-0 Revised 07-9-05 S00049F-age 38 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 7-ead Plasti (K) (PK) 3 b e OTTOM VIW TOP VIW (5X) Φ Number of Pis Pith Overall Height Stadoff Overall Width xosed Pad Width Molded Pakage egth.330.350.370 8.38 8.89 9.40 Overall egth.549.577.605 3.94 4.66 5.37 Foot gle Φ -- -- 8 Mold raft gle 3 -- 7 * Cotrollig Parameter Sigifiat Charateristi Uits imesio imits e MIN.70.000 INCHS*.050 SC imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. SC: asi imesio. Theoretially exat value show without toleraes. See SM Y4.5M RF: Referee imesio, usually without tolerae, for iformatio uroses oly. See SM Y4.5M JC equivalet: TO-5 rawig No. C04-05 NOM 5 MX.83 MIN MIIMTRS NOM.7 SC 4.50.005.00 0.00 0.3 MX.385.398.40 9.78 0. 0.4.56 RF 6.50 RF xosed Pad egth.303 RF 7.75 RF ead Thikess.04.00.06 0.36 0.5 0.66 Pad Thikess.045 --.055.4 --.40 ead Width b.06.03.037 0.66 0.8 0.94 Foot egth.068.089.0.73.6.79 Pad egth.77 4.3 -- 3 -- -- 5 4.65 0.5 3.045 --.067.4 --.70 8 7 006 Mirohi Tehology I. S00049F-age 39

Pakagig iagrams ad Parameters NOTS: S00049F-age 40 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Plasti ual I-lie (P) 300 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 8 8 Pith.00.54 To to Seatig Plae.40.55.70 3.56 3.94 4.3 Molded Pakage Thikess.5.30.45.9 3.30 3.68 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.300.33.35 7.6 7.94 8.6 Molded Pakage Width.40.50.60 6.0 6.35 6.60 Overall egth.360.373.385 9.4 9.46 9.78 Ti to Seatig Plae.5.30.35 3.8 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.045.058.070.4.46.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MS-00 rawig No. C04-08 006 Mirohi Tehology I. S00049F-age 4

Pakagig iagrams ad Parameters 4-ead Plasti ual I-lie (P) 300 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 4 4 Pith.00.54 To to Seatig Plae.40.55.70 3.56 3.94 4.3 Molded Pakage Thikess.5.30.45.9 3.30 3.68 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.300.33.35 7.6 7.94 8.6 Molded Pakage Width.40.50.60 6.0 6.35 6.60 Overall egth.740.750.760 8.80 9.05 9.30 Ti to Seatig Plae.5.30.35 3.8 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.045.058.070.4.46.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom * Cotrollig Parameter Sigifiat Charateristi 5 0 5 5 0 5 imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MS-00 rawig No. C04-005 S00049F-age 4 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 6-ead Plasti ual I-lie (P) 300 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 6 6 Pith.00.54 To to Seatig Plae.40.55.70 3.56 3.94 4.3 Molded Pakage Thikess.5.30.45.9 3.30 3.68 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.300.33.35 7.6 7.94 8.6 Molded Pakage Width.40.50.60 6.0 6.35 6.60 Overall egth.740.750.760 8.80 9.05 9.30 Ti to Seatig Plae.5.30.35 3.8 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.045.058.070.4.46.78 ower ead Width.04.08.0.036 0.46 0.56 Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. JC quivalet: MS-00 rawig No. C04-07 Revised 07--05 006 Mirohi Tehology I. S00049F-age 43

Pakagig iagrams ad Parameters 8-ead Plasti ual I-lie (P) 300 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 8 8 Pith.00.54 To to Seatig Plae.40.55.70 3.56 3.94 4.3 Molded Pakage Thikess.5.30.45.9 3.30 3.68 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.300.33.35 7.6 7.94 8.6 Molded Pakage Width.40.50.60 6.0 6.35 6.60 Overall egth.890.898.905.6.80.99 Ti to Seatig Plae.5.30.35 3.8 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.045.058.070.4.46.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MS-00 rawig No. C04-007 S00049F-age 44 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 0-ead Plasti ual I-lie (P) 300 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 0 0 Pith.00.54 To to Seatig Plae.40.55.70 3.56 3.94 4.3 Molded Pakage Thikess.5.30.45.9 3.30 3.68 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.95.30.35 7.49 7.87 8.6 Molded Pakage Width.40.50.60 6.0 6.35 6.60 Overall egth.05.033.040 6.04 6.4 6.4 Ti to Seatig Plae.0.30.40 3.05 3.30 3.56 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.055.060.065.40.5.65 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MS-00 rawig No. C04-09 006 Mirohi Tehology I. S00049F-age 45

Pakagig iagrams ad Parameters 4-ead Plasti ual I-lie (P) 600 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 4 4 Pith.00.54 To to Seatig Plae.60.75.90 4.06 4.45 4.83 Molded Pakage Thikess.40.50.60 3.56 3.8 4.06 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.595.600.65 5. 5.4 5.88 Molded Pakage Width.530.545.560 3.46 3.84 4. Overall egth.45.50.55 3.6 3.75 3.88 Ti to Seatig Plae.0.30.35 3.05 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.030.050.070 0.76.7.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.60.650.680 5.75 6.5 7.7 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MS-0 rawig No. C04-08 S00049F-age 46 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 4-ead Skiy Plasti ual I-lie (SP) 300 mil ody (PIP) e Number of Pis Pith To to Seatig Plae ase to Seatig Plae Molded Pakage Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width imesio imits Molded Pakage Thikess Shoulder to Shoulder Width Uits MIN.40.5.05.95.40.45.0.008.045.04 INCHS* Overall Row Saig e.30.370.430 7.87 9.40 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00" (0.54mm) er side. JC quivalet: MS-00 F rawig No. C04-043 Revised 09-4-05 NOM 4.00.50.30.30.50.50.5.0.053.08 MX.60.45.35.60.55.30.05.060.0 MIN 3.56.9 0.38 7.49 6.0 3.6 3.05 0.0.4 0.36 MIIMTRS NOM 4.54 3.8 3.30 7.87 6.35 3.75 3.8 0.9.33 0.46 MX 4.06 3.68 8.6 6.60 3.88 3.30 0.38.5 0.56 006 Mirohi Tehology I. S00049F-age 47

Pakagig iagrams ad Parameters 8-ead Skiy Plasti ual I-lie (SP) 300 mil ody (PIP) e Number of Pis Pith To to Seatig Plae Molded Pakage Thikess ase to Seatig Plae Shoulder to Shoulder Width Molded Pakage Width Overall egth Ti to Seatig Plae ead Thikess Uer ead Width ower ead Width Uits imesio imits MIN.40.5.05.300.75.345.5.008.040.06 INCHS* Overall Row Saig e.30.350.430 8.3 8.89 0.9 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesio ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MO-095 rawig No. C04-070 NOM 8.00.50.30.30.85.365.30.0.053.09 MX.60.35.35.95.385.35.05.065.0 MIN 3.56 3.8 0.38 7.6 6.99 34.6 3.8 0.0.0 0.4 MIIMTRS NOM 8.54 3.8 3.30 7.87 7.4 34.67 3.30 0.9.33 0.48 MX 4.06 3.43 8.6 7.49 35.8 3.43 0.38.65 0.56 S00049F-age 48 006 Mirohi Tehology I.

Pakagig iagrams ad Parameters 8-ead Plasti ual I-lie (P) 600 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 8 8 Pith.00.54 To to Seatig Plae.60.75.90 4.06 4.45 4.83 Molded Pakage Thikess.40.50.60 3.56 3.8 4.06 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.595.600.65 5. 5.4 5.88 Molded Pakage Width.505.545.560.83 3.84 4. Overall egth.395.430.465 35.43 36.3 37. Ti to Seatig Plae.0.30.35 3.05 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.030.050.070 0.76.7.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.60.650.680 5.75 6.5 7.7 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MO-0 rawig No. C04-079 006 Mirohi Tehology I. S00049F-age 49

Pakagig iagrams ad Parameters 40-ead Plasti ual I-lie (P) 600 mil ody (PIP) e Uits INCHS* MIIMTRS imesio imits MIN NOM MX MIN NOM MX Number of Pis 40 40 Pith.00.54 To to Seatig Plae.60.75.90 4.06 4.45 4.83 Molded Pakage Thikess.40.50.60 3.56 3.8 4.06 ase to Seatig Plae.05 0.38 Shoulder to Shoulder Width.595.600.65 5. 5.4 5.88 Molded Pakage Width.530.545.560 3.46 3.84 4. Overall egth.045.058.065 5.94 5.6 5.45 Ti to Seatig Plae.0.30.35 3.05 3.30 3.43 ead Thikess.008.0.05 0.0 0.9 0.38 Uer ead Width.030.050.070 0.76.7.78 ower ead Width.04.08.0 0.36 0.46 0.56 Overall Row Saig e.60.650.680 5.75 6.5 7.7 Mold raft gle To 5 0 5 5 0 5 Mold raft gle ottom 5 0 5 5 0 5 * Cotrollig Parameter Sigifiat Charateristi imesios ad do ot ilude mold flash or rotrusios. Mold flash or rotrusios shall ot exeed.00 (0.54mm) er side. JC quivalet: MO-0 rawig No. C04-06 S00049F-age 50 006 Mirohi Tehology I.