Extreme High Vacuum: The Need, Production, and Measurement

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Extreme High Vacuum: The Need, Production, and Measurement, Philip Adderley, Matt Poelker (Jefferson Lab) Polarized Electron Gun Group Newport News, Virginia Run by JSA for the US DOE

What is XHV Extreme High Vacuum P < 1x10-10 Pa = 1x10-12 mbar = 7.5x10-13 Torr Baked, metal systems, low outgassing, coatings to reduce outgassing Combinations of pumping Ion, Getter, Cryo, Titanium Sublimation, Turbo Measurement: Ionization gauges

Ultimate P.A. Redhead Vacuum 53 (1999) 137 Vacuum Steady decrease interrupted by gauge limitations 1920-1950 Bayard-Alpert gauge introduced in 1950 Plateau ~1x10-14 Torr for nearly 3 decades again Ultimate Vacuum (Torr) 10-6 10-8 10-10 10-12 10-14

Who needs XHV Storage Rings CERN ISR: beam lifetimes > 10 hours, pressure < 1x10-12 Torr Vacuum in interaction region in the 10-14 Torr range Large Detector Systems KATRIN (later in this session) Surface Science applications Alkali metals on surfaces surface contaminates within ~1 hour Surface X-ray diffraction at synchrotrons, He scattering low signal, long collection times Dynamical surface analysis High current polarized photo-electron guns CERN aerial view Surface Imaging (LEED)

Jefferson Lab CEBAF: Nuclear physics electron accelerator laboratory and Free Electron Laser (FEL) User community of 2000+ physicists GaAs Photoelectron gun (100 kv, 200 µa, 85% polarization) delivers beam simultaneously to three experimental halls Nuclear physics gun on up to 310 days/year, 24 hours/day CEBAF pressures ~1.2x10-11 Torr Guns pumped with combination of NEG and ion pumps FEL gun operates 350 kv, 9 ma unpolarized electron gun AVS 53rd International Symposium

Photocathode Lifetime Laser spots ~2.5E-11 Torr ~5.0E-11 Torr >15.0E-11 Torr Quantum Efficiency (yield) of GaAs photocathode decays Lifetime of inversely proportional to vacuum conditions Residual gas ionized Ion backbombardment damages Crystal structure Surface chemistry Lifetime very good: ~200 Coulombs, 85% polarization Future applications: higher currents Electron/ion colliders: >1 ma polarized Novel light sources: 100 ma unpolarized Electron cooling applications: 1 A+, unpolarized RF photoguns GaAs photocathodes

Materials and Preparation Low outgassing Stainless Steel Titanium alloys Aluminum OFHC Copper, Cu/Be alloys 300 series austenitic steels (304L, 316L, 316LN) low carbon, 316 series adds Mo for strength Coatings to reduce outgassing Coatings to add pumping

Calder & Lewin 1967 calculate time and temperature to reduce stainless steel outgassing Hydrogen reduction through heating Fick s law governs diffusion of hydrogen from bulk metal Initial concentration Time Temperature Wall thickness Surface recombination

Outgassing Rates for SS Q = 10-12 10-16 mbar L/s cm 2 Y. Ishikawa, V. Nemanič Vacuum 69 (2003) 501 } P. Marin Virgo, Vacuum1998 } M. Bernardini Virgo, JVSTA 1998 }H. Hseuh Brookhaven JVSTA 1998 }G. Messer, 1977 } V. Nemanič thin walls JVSTA 1999 } V. Nemanič JVSTA 2000 Other exceptional outgassing rates (in Torr L/s cm 2 ) BeCu alloy: 4x10-16 F. Watanabe JVSTA 22 (2004) 181, 22(2004) 739. Ti/steel alloy: 7.5x10-15 H. Kurisu et al. JVSTA 21 (2003) L10. JLab: 1x10-12 Torr L/s cm 2

JLab Preparation 304 SS vacuum chambers Untreated Electropolished and vacuum fired 900 C 4 hours Baking 30 hours, 250 C Unfired chamber 1x10-12 Torr L/s cm 2 ~13 bakes Vacuum fired chamber 8.9x10-13 Torr L/s cm 2 3 bakes Outgassing Rate (Torr L/s cm 2 ) 5E-12 4E-12 3E-12 2E-12 1E-12 0 0 5 10 15 Bake number Untreated: 250 C bake EP: 150 C bake EP: 250 C bake M.L. Stutzman et al. submitted to NIM 2006 Achieve modest outgassing rate for 304SS Lower rates possible with better grade steel Add heat treatment after final welding

XHV surface coatings TiN, SiO2, Chromium oxide Diffusion barrier for hydrogen Affect surface recombination Can also reduce beam induced pressure rise in storage rings See session VT-WeM TiN P.He, H.C.Hseuh, M.Mapes, R.Todd, N.Hilleret Outgassing for SNS ring material with and without TiN coatings (mbar L/s cm 2 ) 10-11 10-12 10-13 10-14 TiN K. Saito et al JVSTA 13 (1995) 556 10-15 10-16

SiO 2 Coatings SiO 2 coated 304 SS (Restek prototype) SiO 2 coating applied to inside and outside, chemically stripped Accumulation method with spinning rotor gauge Outgassing no better with SiO 2 coating Prototype coatings Chemical stripping process Increased surface roughness Outgassing (Torr_L/s_cm 2 ) 2.5E-12 2.0E-12 1.5E-12 1.0E-12 Outgassing: SiO 2 coated 304 SS thin in/out thick in/out thick outside thick inside SiO2 coatings Thin: 3 um Thick: 6-12 um uncoated JLab: Y. Prilepskiy, G.R.Myneni, P.A. Adderley, M.L.Stutzman

Cr 2 O 3 Surface passivation 304L Surface passivation Vacuum fire 450 C, 24 hours 1x10-9 Torr O2 partial pressure 5x10-7 Torr total pressure Cr2O3 is one component of air fired, low outgassing materials (VIRGO, LIGO) K.R. Kim et al Proceedings of APAC 2004 Gyeongju, Korea

Distributed beamline pumping Beamlines coated with getter material (Ti/Zr/V) activated through bakeout temperature ~200 C No conductance limitation Reduces beam induced pressure rise RIKEN from SAES literature ESRF insertion device 20 mm 30 mm Distributed Ion pump: Y.Li et al., JVSTA 15 (1997) 2493.

JLab s NEG coating Ti/Zr/V NEG coating Sputtering without magnetron enhancement Beamline exiting CEBAF electron guns NEG coated since 1999 Enhanced photocathode lifetime: now achieving lifetime ~200 Coulombs High voltage chamber for new load locked gun coated 25% Ti 50% V 25% Zr EDS analysis of getter coating composition

Load Locked Electron Gun NEG coated HV chamber Vacuum measured: ~1.2x10-11 Torr Lifetime doubled 5-10 ma, 100 kev electron beam NEG pipe NEG coated high voltage chamber NEW OLD AVS 53rd International Symposium

Pumps for XHV Ion pumps Ion pump performance vs. voltage Ion pump current monitor at UHV pressures Getter coating ion pumps NEG Great pumping for hydrogen, also pumps CO, N2 Don t pump methane, noble gasses Question about pump speed at base pressure Ti Sublimation Cryo pumps Turbo pumps cascaded pumps

Ion pump limitations Varian Ion pump speed decreases at lower pressures Lower na/torr at lower pressures Re-emission of gasses Outgassing from pump body Adding NEG pumping to ion pumping decreases hydrogen Pd coated NEG films on inside of ion pumps reduced ultimate pressure to 2-6x10-11 mbar Maruo Audi, 45 th IUVSTA

JLab UHV ion pump current monitoring Ion pumps current varies linearly with pressure as low as 1x10-11 Torr Real time monitoring of UHV vacuum Studying optimal voltage for pumping at low pressures Ion pump current (A) Current vs. Pressure 1E-2 1E-3 1E-4 1E-5 1E-6 1E-7 our data manufacturer 1E-8 1E-9 1E-12 1E-11 1E-10 1E-09 1E-08 1E-07 1E-06 1E-05 Extractor Gauge Pressure (Torr) Current (10-10 A) ~10-10 Torr Full Scale Discharge event in beamline

Base pressure in CEBAF guns Why isn t our chamber pressure as low as calculated? Is outgassing much higher? Is pump speed much lower? Are we unable to measure lower pressures? First measured outgassing rate from chamber 1x10-12 Torr L/s cm 2 Typical value for baked 304SS Log Pressure (Torr) (Torr) Measured and predicted pressure for 304 SS chambers and ST707 SAES getter modules 1E-10 1E-11-12 1E-12 measured predicted Test chambers CEBAF guns 0 0.2 0.4 0.6 0.8 1 1.2 Getter Surface Area (m area 2 ) (m 2 )

Pump speed measurements Measured pump speed vs. pressure from base pressure of chamber to 2x10-10 Torr Throughput method conductance limiting orifice RGAs to measure H 2 pressure Ultimate pressure method Gas sources: outgassing from walls and gauge Measure with extractor gauge Found very good pump speed at higher pressures 500 L/s with bakeout 1150 L/s activated (430 L/s quoted) Found drop in pump speed as function of pressure: WHY? Speed per module (L/s) 1400 1200 1000 800 600 400 200 0 C * S = resistive activation passive activation 0 5.0E-11 1.0E-10 1.5E-10 2.0E-10 Pressure (Torr) ' ' [( P! P )! ( P! P )] orf orf main P main main + Q wall + Q gauge

Alternate analysis of pump speed measurement Q=S*P Plot Q instead of S vs. P Linear fit indicates constant pump speed throughout range Discrepancy: Problem with throughput vs. pump speed at low pressures? Problem with accurately measuring low pressures? Throughput (Torr L/s) 2.5E-07 Slope = Pump Speed = 1150 L/s 2.0E-07 1.5E-07 1.0E-07 5.0E-08 Throughput Ultimate 0 0 1.0E-10 2.0E-10 Pressure (Torr) M. Stutzman et al. submitted to NIM 2006

XHV Pressure Measurement Ionization Gauges Hot Cathode: Extractor, Improved Helmer, Axtran, Modulated BA, spectroscopy and bent beam gauges Cold Cathode: Magnetron, inverted magnetron, double inverted magnetron Laser ionization gauges X-ray limits Electron stimulated desorption limits Gauge outgassing

X-ray limit +V Ionized gas molecules collected, proportional to gas pressure + Electrons strike grid, generate x-rays X-rays striking collector photoemit filament collector A Collector current is sum of ionized gas and photoemitted electrons Bayard-Alpert gauge 1950 s led to UHV measurements smaller collector modulation techniques Extractor gauge geometry reduces measurement limits to ~XHV range Improved Helmer gauge, Watanabe gauges optimize geometry

Extractor Gauge X-ray limits Extractor collector current vs. voltage 1E-11 Collector Current (A) 1E-12 1E-13 1E-14 Ext A Gun 2 Gun 3 1E-15 0 100 200 300 400 500 600 Fumio Watanabe JVSTA 9 (1991). JLab 2006 Voltage (V) Gauge Watanabe A Watanabe B Watanabe C JLab A JLab Gun 2 JLab Gun 3 X-ray Limit (Torr) 2.1 x 10-12 1.6 x 10-12 1.9 x 10-12 0.63 x 10-12 >2 x 10-12 >2 x 10-12

Extractor gauge comparison Pressure (Torr N2) 1.4E-11 1.2E-11 1E-11 8E-12 6E-12 4E-12 2E-12 0 3 Extractors vs. time 0 24 48 72 96 Hours Ext K Ext A Ext D Three extractor gauges Factor of 8 difference in readings Identical ports Symmetric positions Multiple degas cycles Ext. D Log Pressure Extractor D (Torr) -9 1E-09 1E-10 1E-11 1E-12-13 -13 Extractor A vs. Extractor D -12-11 -10-9 Extractor A Ext. A Log Pressure (Torr) 1E-13 1E-13 1E-12 1E-11 1E-10 1E-09 Divergence in pressure readings below 5x10-11 Torr

Electron Stimulated Desorption ESD ions Have energy higher than gas phase Energy discrimination ESD neutrals Same energy as gas phase Hotter grid: less adsorbed gas Electron bombardment More outgassing Resistive heating ESD and outgassing decoupled Watanabe heated grid gauges: total pressure and residual gas analyzer BeCu walls Low emissivity High thermal conductivity Cold cathode Decouple grid temperature from filament filament +V + + o collector A Ref: Fumio Watanabe JVSTA 17 (1999) 3467, JVSTA 20 (2002) 1222.

Gauge solutions Extractor commercially available X-ray limits can be in the 10-13 Torr range (barely XHV) Reasonable residual current caused by ESD due to geometry Work needed to ensure accuracy over time, between gauges Improved Helmer gauge used at CERN Frequent pressure measurements in 10-14 Torr range quoted Watanabe proposes heated filament gauges Separate ESD, outgassing problems Laser ionization gauge Ionize gas with powerful laser, count ions: direct gauge of low pressures Calibration techniques

Calibration Techniques Careful calibration needed for measurements below 5x10-11 Torr Cross calibration with transfer standards Dynamic or static expansion methods Relatively complex systems Not common in gauge user laboratories Reported XHV pressure measurements should make note of the calibration method C. Meinke and G. Reich JVST 6 (1967) 356. A. Berman and J.K. Fremerey JVSTA 5 (1987) 2436. W. Jitschin et al. JVSTA 10 (1992) 3344. S. Ichimura et al. Vacuum 53 (1999) 291. P. Szwemin et al. Vacuum 73 (2004) 249.

Future work at JLab Get best available material Polish, vacuum fire after welding Optimize and calibrate extractor gauges, or Replace extractor gauges with better XHV gauge UHV ion pump supplies Optimize voltage, geometry for pressure Investigate NEG coatings in ion pumps Use cathode lifetime as a relative gauge OLD NEW Gauge exchange / cross calibration at different facilities

Future of XHV Gauging issues are coming along, but still an art, calibration critical Materials exist many different recipes to get very good outgassing rates NEG, TiN coatings becoming widespread Pumping technologies existing technologies can achieve XHV room for improvement and study When XHV becomes routine, high current electron guns, surface science, accelerators, semiconductor industry, and others will benefit Ultimate Vacuum (Torr) 10-6 10-8 10-10 10-12 10-14