Title: Heat Pulse 610 Operating Procedure Page 1 of 7 Table of Contents 1.0 Purpose/Scope... 2 2.0 Reference Documents... 2 2.1 Heat Pulse Operations Manual... 2 2.2 Solaris software Operations Manual... 2 3.0 Equipment/Supplies/Material... 2 3.1 Plastic or Teflon-coated tweezers... 2 3.2 Susceptor... 2 4.0 Safety... 2 4.1 Follow all safety procedures outlined in the CSSER Rules and Procedures Handbook. The handbook can be found at http://www.fulton.asu.edu/fulton/csser/safety.php... 2 5.0 Set Up Procedures... 2 5.1 Log Book... 2 5.2 Chiller Start Up... 2 5.3 Front panel switches... 2 5.4 Purge Gas Selection... 3 5.5 Launch Heat Pulse software.... 3 5.6 Create a new recipe.... 3 6.0 Procedures... 4 6.1 Pre Anneal... 4 6.2 Anneal Sample... 5 6.3 Shut Down... 5 7.0 Tables... 6 7.1 Heat Pulse Log Sheet... 6 7.2 Calibration Files... 7 8.0 Figures... 7 8.1 None... 7
Title: Heat Pulse 610 Operating Procedure Page 2 of 7 1.0 Purpose/Scope 1.1 This document covers the procedure that should be followed for normal operation of the AGA Heat Pulse RTP. This tool is only used with III-V semiconductors such as Gallium Nitride (GaN) and Gallium Arsenide (GaAs). 2.0 Reference Documents 2.1 Heat Pulse Operations Manual 2.2 Solaris software Operations Manual 3.0 Equipment/Supplies/Material 3.1 Plastic or Teflon-coated tweezers 3.2 Susceptor 4.0 Safety 4.1 Follow all safety procedures outlined in the CSSER Rules and Procedures Handbook. The handbook can be found at http://www.fulton.asu.edu/fulton/csser/safety.php 5.0 Set Up Procedures 5.1 Log Book 5.1.1 Fill in date, name, and time. 5.2 Chiller Start Up 5.2.1 Verify that the white Neslab chiller is ON by verifying that the green LED on the front panel is on. Verify the thermometer is 15 ± 1 degrees C. Verify that water level is between two horizontal markings inside the reservoir. 5.2.2 Toggle the dark blue Neslab chiller to ON and push START button on the front panel. The minimum water level is one inch from the top. 5.2.3 Use DI water from any solvent sink to fill the chiller reservoirs when needed. 5.3 Front panel switches CAUTION: Power Switch = ON Emissivity Dial = 50 Meter Select Knob = Temp Temp Mon Switch = Pyro Lamp Control Switch = Auto Manual Lamp Intensity Knobs (inner and outer) = fully counter-clockwise Purge Flow Meter = 2.0 Excessive flow can cause an explosive failure. DO NOT EXCEED 2.0 ON FLOW METER.
Title: Heat Pulse 610 Operating Procedure Page 3 of 7 5.4 Purge Gas Selection 5.4.1 When the system is idle, the chamber is being purged with nitrogen. When a recipe is started, the system switches to a user selected gas. The purge gas choices are argon, forming gas or nitrogen. 5.4.2 Verify that the Process Gas Inlet valve is open and the Process Gas Bypass valves are closed. These valves are located on the front panel below the tool. 5.4.3 Argon Purge: Turn valve #1 to the ENABLE VALVE #2 position. Turn valve #2 to the ARGON position. 5.4.4 Forming Gas Purge: Turn valve #1 to the ENABLE VALVE #2 position. Turn valve #2 to the FORMING GAS position. 5.4.5 Nitrogen purge: Turn valve #1 to NITROGEN position. The position of valve #2 does not matter. 5.5 Launch Heat Pulse software. 5.5.1 Ensure computer is turned on. 5.5.2 Double click on the HEAT PULSE icon. 5.5.3 Click on RTP CONTROL PAGES button. 5.5.4 If a new recipe is desired, then jump to paragraph 5.6 5.5.5 Click on RUN PROCESS button. 5.5.6 Select the appropriate recipe from the SELECT RECIPE NAME menu. 5.5.7 Select the appropriate file from the PYROMETER CALIBRATION FILE menu. Refer to table 7.2 for the guidelines on which file to use. 5.5.8 Ensure that PYRO is selected under the CONTROL TEMPERATURE button. 5.5.9 The graph display has scales that are variable. The minimum and maximum limits for time and temperature can be selected by the user. 5.5.10 Enter a value into the OVERTEMP SET POINT box. That value is typically 200º above the highest set point in the recipe used. Example: if recipe = 500º than the Over Temp set point = 700º. 5.5.11 Proceed to paragraph 6.1 5.6 Create a new recipe. 5.6.1 From SOLARIS RTP CONTROLLER MENU PAGE select the EDIT RECIPES button. 5.6.2 Select the YES button. 5.6.3 Select the CREATE NEW FILE button. 5.6.4 Enter a file name and click on ACCEPT button. Example=JTE_500 5.6.5 No password needed, just click on the OK button. 5.6.6 The RTP RECIPE EDITING PAGE will come up. NOTE: Maximum temperature=800 C, Maximum hold time=120 seconds. If your process needs require a higher temperature or longer time, contact CSSER staff for approval.
Title: Heat Pulse 610 Operating Procedure Page 4 of 7 6.0 Procedures 6.1 Pre Anneal 5.6.6.1 Step 0 is a step that is not used. Select PYROMETER from CONTROL DEVICE drop down menu. Ensure that there is no other information entered into this step. 5.6.6.2 Step 1 needs to be a purge step. Enter 1 into the STEP # box. Select PURGE from the OPERATION TYPE drop down menu. Enter 10; a value of 10 will give you a purge time of 10 seconds. Any value can be used, into the STEP TIME FOR HOLD STEP box. Residual atmosphere in the chamber could cause problems with oxidations, especially at higher temps. To remedy that, use longer purge times. Select PYROMETER from CONTROL DEVICE drop down menu. 5.6.6.3 Step 2 is a ramp up step. Enter 2 into the STEP # box. Select RAMP UP from the OPERATION TYPE drop down menu. Enter desired temperature into the CONTROL TEMPERATUE. Enter desired ramp rate into the RAMP RATE FOR RAMP STEP box. Select PYROMETER from CONTROL DEVICE drop down menu. 5.6.6.4 Step 3 is a hold step. Enter 3 into the STEP # box. Select HOLD from the OPERATION TYPE drop down menu. Enter desired temperature into the CONTROL TEMPERATUE. Enter desired time (in seconds) into the STEP TIME FOR HOLD STEP box. Select PYROMETER from CONTROL DEVICE drop down menu. 5.6.6.5 Step 4 is a mandatory cool down step. Enter 4 into the STEP # box. Select RAMP DOWN from the OPERATION TYPE drop down menu. Enter 275 into the CONTROL TEMPERATURE. Enter a ramp rate of 100 for the fastest cool down time. A lower value can be entered to control ramp down as needed. Select PYROMETER from CONTROL DEVICE drop down menu. 5.6.6.6 Step 5 is typically an end step. Enter 5 into the STEP # box. Select FINISH from the OPERATION TYPE drop down menu. Enter 0 into the CONTROL TEMPERATURE box and STEP TIME FOR HOLD STEP. Select PYROMETER from CONTROL DEVICE drop down menu. 5.6.6.7 After the recipe is complete, click on the STORE RECIPE button. 5.6.6.8 Jump to paragraph 5.5.5 6.1.1 Ensure controller is displaying the RTP PROCESS PAGE. 6.1.2 Verify that the pyrometer display value is 250 +/- 20. If the value is out of range, there is a problem. Stop processing and contact a CSSER staff member for assistance. The pyrometer reading at room temperature is approximately 250 6.1.3 Turn the nitrogen cooling to 8 SCFM on the flow meter. This flow meter is located on the front panel below the oven. Adjust the valve so that the bottom edge of the float is on 8 SCFM.
Title: Heat Pulse 610 Operating Procedure Page 5 of 7 NOTE: The chamber will be at room temperature and will need a warm-up run before any sample is loaded into the chamber. 6.1.4 Click the INITIAL LEARN ON button to turn the learn mode on. NOTE: The learn mode needs to be turned ON for a new recipe. Also, if the temperature set point is changed. The recipe cannot control the temperature correctly without running the learn mode ON. 6.1.5 Click on the START button. 6.1.6 Ensure that the cooling water flow is a minimum of 2.0 GPM. If the water flow is too low then immediately click the STOP button. Contact a CSSER staff member for assistance. 6.1.7 The recipe will start a cycle. If some issue arises, the STOP button can be clicked at any time. When the STOP button is pushed, the recipe is halted and the lamps are turned off. 6.1.8 When the recipe is finished, a window opens up and states NEXT WAFER or STORE DATA. 6.1.9 If you click on NEXT WAFER, the software will go to the RUN PROCESS page. 6.1.10 If you click on STORE DATA, the software will let you save the graph data in a separate file. 6.1.11 Before opening the chamber, check that the pyrometer display is around 250 and the right side of the oven is cool to the touch. 6.2 Anneal Sample NOTE: It is helpful to place the spare susceptor on the top cover of the oven. This provides a place to put the susceptor lid while loading samples into the susceptor. 6.2.1 Carefully open the chamber door. 6.2.2 Use the vacuum wand and remove the susceptor lid. 6.2.3 Place the sample on the susceptor using plastic tweezers. 6.2.4 Replace the lid and carefully close the chamber door. 6.2.5 Process each sample by repeating steps 6.1.4 to 6.1.10. 6.2.6 Continue to process all samples. It is suggested to run one sample and inspect it before continuing processing. 6.3 Shut Down 6.3.1 Ensure that the cooling N2 and the dark blue chiller are powered off. 6.3.2 Enter the lamp hours, end time and number of process runs into the log book. 6.3.3 Exit the Solaris software by clicking on RETURN TO MENU, EXIT TO START PAGE and EXIT CONTROLLER.
Title: Heat Pulse 610 Operating Procedure Page 6 of 7 7.0 Tables 7.1 Heat Pulse Log Sheet Name Date Time in Time Out Temp/Time Material Lamp Hours
Title: Heat Pulse 610 Operating Procedure Page 7 of 7 7.2 Calibration Files Susceptor Temperature Calibration file yes 350-1000 2-Piece Lid yes 350-1000 4 Susceptor no 400-500 Wafer Cal_400-500 no 501-1000 Wafer Cal_501-1000 8.0 Figures 8.1 None Effective Date Originator DESCRIPTION OF REVISION Issue Todd Eller Original Release O Todd Eller Update after vendor calibration was complete. A 11/05/07 Todd Eller Updated minor procedure errors B 9/03/08 Todd Eller Updated minor procedures C 1/07/09 Todd Eller Added procedure to process without susceptor D 8/4/11 Todd Eller Added warning notes E