Archive 2017 BiTS Workshop- Image: Easyturn/iStock

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Archive September 6-7, 2017 InterContinental Shanghai Pudong Hotel - Shanghai, China Archive 2017 BiTS Workshop- Image: Easyturn/iStock September 6-7, 2017

Archive COPYRIGHT NOTICE This multimedia file is copyright 2017 by BiTS Workshop. All rights reserved. It may not be duplicated or distributed in any form without prior written approval. The content of this presentation is the work and opinion of the author(s) and is reproduced here as presented at the 2017 BiTS China Workshop. The BiTS logo, BiTS China logo, and Burn-in & Test Strategies Workshop are trademarks of BiTS Workshop. September 6-7, 2017

Deterministic Contact Resistance of BGA Contact Pins Praveen kumar Ramamoorthy, Terry Wang, Yusman Sugianto Infineon Technologies Conference Ready mm/dd/2014 BiTS China Workshop Shanghai

Contents Introduction Force & CRes measurements Repeatability Check CRes spread at various touchdowns Pin force comparison at 0 & 85 K Pin tip wear and tear comparison Pin height observations Pin Stroke Vs CRes for fresh pin Conclusion & Next steps 2

Introduction Force and contact resistance (CRes) of 3 sockets at varying touchdowns from 0 K to 85 K were taken from production and measured through Okins socket analyser Data analysis was performed to understand the Force & CRes behaviour of the socket with respect to number of touchdowns Note: CRes measurements are through gold plated probe tip and not solder ball 3

Force & CRes Measurements Socket # CRes (mohms) No. of Touchdowns Median Force (gf) Median Resistance (mohms) 11 0 36.8 50 32 67109 32.1 310 126 85683 29.9 460 500 400 300 200 100 40 35 30 25 20 15 10 0 0 0 50 100 Number of touchdowns (in thousands) 5 Pin Force (gf) 4

Repeatability Check 3 repeated runs were performed on each socket and the data was statistically compared for gauge repeatability & reproducibility (R&R) 12 zero resistance measurements were due to hole on the base plate as it was designed to accommodate many sockets Fresh pins 85k pins 5

CRes at Various Touchdowns 700 600 500 Cres (mohms) 400 300 200 Resistance - Fresh socket Resistance - 67k Resistance - 85.5k 100 0 0 100 200 300 400 Number of Pins 6

Pin Force Comparison at 0k & 85k Median Pin force of ~ 34.5 gf was observed at 0 K and ~31.5 gf at 85 K Spec for fresh pin is 35 + 1.5 gf ~10 15% reduction in pin force was observed for End of Life pin Note: 12 Lesser force measurements were due to hole on the base plate as it was designed to accommodate many sockets 7

Pin Tip Wear and Tear Comparison Fresh pin 85 K pin 8

Pin Height Observations 20 40 µm reduction in pin height was observed With pin stroke until 0.55 mm this reduction in pin height is not significant to increase the CRes or affect the yield Pin Number Height Reference @ 0k (um) Tip 1 Tip 2 Tip 3 Tip 4 Average Pin Number Height Reference @ 85k (um) Tip 1 Tip 2 Tip 3 Tip 4 Average 3 283 283 271 282 279 4 293 291 285 284 288 5 290 298 294 295 294 9 290 284 281 286 285 15 283 283 271 282 279 16 279 262 278 282 275 17 298 294 280 298 292 18 287 284 279 284 283 19 273 265 273 276 271 At 0 K touchdowns 3 264 249 229 253 249 4 221 222 241 237 230 5 243 226 237 258 241 9 246 237 227 244 238 15 241 230 242 254 242 16 244 233 229 243 237 17 252 232 256 264 251 18 255 244 233 258 247 19 238 225 239 253 239 After 85 K touchdowns 9

Pin Stroke Vs CRes on Fresh Pin CRes (mohms) 250 200 150 100 50 40 35 30 25 20 15 10 5 Pin Force (gf) Pin Stroke (mm) Median Cres (um) Median Pin Force (gf) 0.1 208.5 20.4 0.2 171.5 23.3 0.3 149 28.45 0.4 128 32.5 0 0.1 0.2 0.3 0.4 0.55 Pin Stroke (mm) 0 0.55 95 34.5 Cres reduced with increase in Pin stroke It was observed to be due to increase in contact area of the pin and probe tip Pin force increased with increase in Pin stroke which was due to the compression of the spring 10

Conclusion & Next Steps Data acquired provided insights such as CRes increased with respect to number of touchdowns while Pin force reduced and also that the CRes reduces with increase in deflection for a fresh pin The study also pointed out further direction for improvement: - Higher force pin for reduced Cres, better yield & prolonged lifespan - Improved pin tip design for increased contact between pin and solder ball 11