& Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards
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1 A A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards Jae-Ha Lee Byung-Ho Jo Dr Phicom Corporation May 12,
2 Probe Card Comparison Criteria 1. MEMS PROBE CARD 2. Pin Force 3. Probe Planarity 4. Scrub Mark Width/Depth 5. Probe X,Y Alignment 6. Path Resistance 7. Life Time (Number of touchdowns) 8. Bandwidth 9. Specification May 12,
3 1. MEMS PROBE CARD Manufactured by MEMS Technology Vertical Micro Probe High Multi-DUT Optional Tip Structure May 12,
4 MEMS Probe Card View Planarization Mechanism Probe Head MEMS Probe Card - Manufactured by MEMS technology PCB Micro Probes MEMS Probe Card side view Planarization Mechanism Micro Probe Head Interface Pin Decoupling Capacitor Micro Probe PCB May 12,
5 Micro Probe Tips of MEMS 35~45µm 54µm 125µm 42µm 12µm MEMS PT1 Type MEMS PT2 Type May 12,
6 2. Pin Force - Overdrive Vs Contact Force O.D Value MEMS P/C Needle P/C -Graph 1.5mil mil mil mil mil (Unit:gf/mil) (Unit:gf/mil) 4 mil May 12,
7 3. Probe Planarity (MEMS P/C 64 DUT) The planarity after 29,600 touchdowns T/D is real contact number on production line After TDS (Unit:um) Before TDS May 12,
8 Probe Planarity (NEEDLE TYPE P/C) The Planarity after 29,600 Touchdowns Touchdown Test in EG 4090 Prober System without Signal After TDS (Unit:um) Before TDS May 12,
9 Probe Planarity (PRVX) - Touchdowns Vs Planarity (Max.-Min.). TDS Measure the Pin Planarity after touchdowns TD of MEMS P/C is real contact number on production line TD of Needle P/C is internal test data on EG 4090 Prober MEMS P/C Needle P/C K K (Unit:um) 29.6K May 12,
10 4. Scrub Mark Width/Depth PT1 Tip Scrub Mark Width/Depth PT2 Tip Scrub Mark Width/Depth Needle Scrub Mark Width/Depth May 12,
11 PT1 Tip Scrub Mark Width (SEM) O.D:2.5 mil O.D:3.0 mil O.D:3.5 mil O.D:4.0 mil May 12,
12 PT2 Tip Scrub Mark Width (SEM) O.D:2.5 mil O.D:3.0 mil O.D:3.5 mil O.D:4.0 mil May 12,
13 Needle Scrub Mark Width (SEM) O.D:2.5 mil O.D:3.0 mil O.D:3.5 mil O.D:4.0 mil May 12,
14 Scrub Length & Area (all types are compared) Scrub Mark X trend Scrub Mark X*Y trend May 12,
15 Scrub Mark Depth Measurement Equipment Model: SIS-1200 Interscan System Z-Resolution : EPSI 1nm PSI 0.1nm Lateral Resolution :MAX0.64um Lens : 50X L/R:0.64um Field of View : 0.14 x 0.10mm May 12,
16 PT1 Tip Scrub Depth O.D:2.5 mil O.D:3.0 mil May 12,
17 PT1 TIP Scrub Depth O.D:3.5 mil O.D:4.0 mil May 12,
18 PT1 Tip Scrub Depth O.D:4.5 mil PT1 Tip Scrub Depth Trend PT1 Tip Scrub Depth (Å) Over Drive(mil) May 12,
19 PT2 Tip Scrub Depth O.D:2.5 mil O.D:3.0 mil May 12,
20 PT2 Tip Scrub Depth O.D:3.5 mil O.D:4.0 mil May 12,
21 PT2 Tip Scrub Depth O.D:4.5 mil PT2 Tip Scrub Depth Trend PT2 Tip Scrub Depth (Å) Over Drive(mil) May 12,
22 Needle Scrub Depth O.D:2.5 mil O.D:3.0 mil May 12,
23 Needle Scrub Depth O.D:3.5 mil O.D:4.0 mil May 12,
24 Needle Scrub Depth O.D:4.5 mil Needle Tip Scrub Depth Trend Needle Scrub Depth(Å) (Å) Over Drive(mil) May 12,
25 Scrub Depth (all types are compared) Scrub Depth (All type) 6000 (Å) Depth PT1 PT2 Needle Over Drive May 12,
26 5. Probe X,Y Alignment (MEMS) Before TDS After TDS Real contact number on production line May 12,
27 6. Path Resistance - Touchdown Vs Path Resistance (Average) TDS MEMS P/C Needle P/C K K (Unit:Ohm) 29.6K Graph May 12,
28 MEMS P/C Path Resistance Trend Before TDS After TDS without Cleaning Real contact number on production line May 12,
29 Needle P/C Path Resistance Trend Before TDS After TDS without Cleaning Phicom Test Data May 12,
30 7. Probe Life Time - Life Time (Number of Touchdowns) 32,000TDS 64,000TDS 120,000TDS May 12,
31 - Cleaning Period Initial 30000TDS Cleaning Mean Time Between Cleaning (April 03') Days M01 M02 M03 M04 M05 M06 M07 M08 M09 M10 MEMS P/C (64 DUT) Serial number May 12,
32 8. MEMS Probe Card Bandwidth Insertion Loss (S21) db GHz May 12,
33 Planarity Measurement Items Spe cification System Value Unit 3D 15 ~ 20 um 25 ~ 30 um Leakage <5 na Co nta ct Re sista nce <5 Ohm Vxerr 80 overlay % PRVX Vyerr 80 overlay % Scrub 10 um Tscrub 25 um Diameter <18 um Tip Diameter (Changeable) SEM < 13 um Scrub Area (Based on O.D 75um) <13x24 um2 O.D. 9. MEMS Probe Card Specification No rmal 75 um Maximum 110 um Impedance Polar 50 (±10%) Ohm Max Current 600 ma Pin Force 2.5(±20%) gf/mil Probe Depth 8.8 mm Cleaning Period > 15,000 TDs Life Time Probe r 1 Million TDs May 12,
34 Summary - Enough Pin Force to penetrate Al2O3 - Stable Planarity - Stable X.Y Alignment Status - Low Pad Damage With Enough Scrub Mark - Constant Path Resistance - Long Cleaning Period - Long Life Time - Uniform Probe Tip Shape May 12,
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