Single-Axis Analog Yaw Rate Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Package 2.2 Inside the Package 2.3 ASIC Die 2.4 MEMS Cavity Gases 2.5 GK02A Lid and Die 3 Control ASIC Basic Process Analysis 3.1 Overview 3.2 General Structure and P-Well 3.3 STI and Poly and Transistors 3.4 Metallization, Contacts, and MIM Capacitor 3.5 Dielectrics 4 GK02A MEMS Lid and Die Assembly 4.1 Device Structure 4.2 Bond Pads 4.3 Lid Attach 5 GK02A MEMS Process Analysis 5.1 General Device Structure 5.2 Dielectrics 5.3 Polysilicon and Metal 5.4 Polysilicon Anchors and Contacts 6 GK02A MEMS Architectural Analysis 6.1 GK02A Architectural Overview
MEMS Process Review 7 Critical Dimensions 7.1 Critical Dimensions 7.2 GK02A Lid and Die Critical Dimensions 7.3 ASIC Critical Dimensions 8 References 9 Statement of Measurement Uncertainty and Scope Variation Report Evaluation
Overview 1-1 1 Overview 1.1 List of Figures 2 Device Overview 2.1.1 Top Package View 2.1.2 Bottom Package View 2.1.3 Plan-View Package X-Ray 2.1.4 Side-View Package X-Ray 2.1.5 Composite Package Cross Section 2.1.6 Package PCB Detail 2.2.1 GK02A MEMS Gyroscope Die and ASIC Plan View 2.2.2 GK02A Lid Cut-Out Tilt View 2.2.3 GK02A Lid Cut-Out Detailed Tilt View 2.2.4 MEMS Ball Bond Optical Cross Section 2.2.5 MEMS Ball Bonds SEM Tilt View 2.3.1 ASIC Die Photograph 2.3.2 ASIC Die Markings 2.3.3 ASIC Die Corner 2.3.4 ASIC Minimum Pitch Bond Pads 2.3.5 ASIC Bipolar Transistors 2.5.1 Underside of Lid SEM Tilt View 2.5.2 Underside of GK02A Lid Optical 2.5.3 GK02A MEMS Die Photograph 2.5.4 GK02A MEMS Die at Substrate 2.5.5 GK02A Functional Layout 2.5.6 GK02A Die Marking A 2.5.7 GK02A Die Marking B 2.5.8 GK02A Minimum Pitch Bond Pads 3 Control ASIC Basic Process Analysis 3.2.1 General Structure and P-Well 3.3.1 STI and Poly 3.3.2 Minimum NMOS Transistor 3.3.3 Minimum Pitch Poly 3.4.1 Metal 1 and Metal 2 3.4.2 Metal 3 3.4.3 Metal 4 3.4.4 MIM Capacitor 3.4.5 Via 1 and Minimum Pitch Contacts 3.5.1 PMD, IMD, and Passivation Layers
Overview 1-2 4 GK02A MEMS Lid and Die Assembly 4.1.1 Annotated Device Cross-Sectional Planes 4.1.2 GK02A MEMS Device Optical (S6) 4.1.3 Left Edge of GK02A MEMS Device (S5) 4.1.4 Right Edge of GK02A MEMS Device (S5) 4.1.5 GK02A MEMS Cavity Detail (S5) 4.1.6 GK02A Cross Section SCM 4.2.1 GK02A Bond Pad Optical (S10) 4.2.2 GK02A Au Ball on Al Bond Pad (S9) 4.3.1 Pb Glass Frit Hermetic Lid Seal Detail (S4) 5 GK02A MEMS Process Analysis 5.1.1 MEMS Annotated Die Photograph 5.1.2 GK02A MEMS General Structure (S10) 5.1.3 GK02A MEMS General Structure (S8) 5.1.4 Right Die Edge and Substrate Ground Contact (S6) 5.2.1 Oxide 1 (S10) 5.2.2 Nitride 1 and Oxide 2 (S10) 5.2.3 Nitride 2 and Trench Bottom (S9) 5.2.4 Nitride 3 and Trench Top (S9) 5.3.1 Minimum Pitch Poly 1 Plan View 5.3.2 Poly 2 (S9) 5.3.3 Drive Electrodes Plan View 5.3.4 Minimum Width Poly 2 (S8) 5.3.5 Metal (S4) 5.3.6 Minimum Width Metal Plan View 5.4.1 Minimum Width Anchor (S8) 5.4.2 Substrate Ground Contact (S4) 6 GK02A MEMS Architectural Analysis 6.1.1 GK02A MEMS Device Plan View 6.1.2 GK02A MEMS Spring-Mass Structure Plan View 6.1.3 GK02A MEMS Spring-Mass Structure Tilt View 6.1.4 GK02A MEMS Spring-Mass Structure Upper Left Tilt View 6.1.5 GK02A MEMS Outer Suspension Spring Tilt View 6.1.6 GK02A MEMS Detection Mass Suspension Spring Plan View 6.1.7 GK02A MEMS Air Bridge Tilt View
Overview 1-3 1.2 List of Tables 1 Overview 1.4.1 Angular Rate Sensor Specification 1.5.1 Device Summary 1.5.2 MEMS Gyroscope 1.5.3 Control ASIC 1.6.1 MEMS Gyroscope Die 1.6.2 MEMS Lid 1.6.3 Control ASIC Die 2 Device Overview 2.3.1 ASIC Die Dimensions 2.5.1 GK02A Lid and Die Dimensions 3 Control ASIC Basic Process Analysis 3.1.1 Observed ASIC Critical Dimensions 5 GK02A MEMS Process Analysis 5.2.1 Dielectric Layer Thickness 5.3.1 Aluminum and Polysilicon Dimensions 5.4.1 Via and Contact Dimensions 7 Critical Dimensions 7.1.1 Dimensions 7.2.1 GK02A Lid and Die Horizontal Dimensions 7.2.2 Dielectric Layer Thickness 7.2.3 Aluminum and Polysilicon Dimensions 7.2.4 Via and Contact Dimensions 7.3.1 ASIC Die Dimensions 7.3.2 Observed ASIC Critical Dimensions
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