MEMS for automotive and consumer electronics
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1 MEMS for automotive and consumer MEMS for automotive and consumer electronics Dr. Jiri Marek Senior Vice President Engineering Sensors Robert Bosch GmbH, Automotive Electronics 1 Automotive Electronics AE/NE4 - Dr. Jiri Marek Feb. 2, 2009 Robert Bosch GmbH All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
2 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 2
3 MEMS MEMS = Micro-Electro-Mechanical System (Systems with mechanical structures in micrometer range and electronic structures, combined on a substrate or chip) ASIC Micromechanical sensor element e.g.: Angular rate sensor 50 μm 3
4 MEMS market CAGR 08 12: 15% Source: Yole Développement
5 MEMS applications 2007 RF MEMS Microfluidics Source: SiTime Source: Debiotech MEMS Market (Mio USD) Micromirror/-display Gyroscope Accelerometer Microphone Pressure sensor Source: TI Source: Bosch Source: Bosch Source: Knowles Source: Bosch Source: Yole Développement 2008 Inkjet head Source: Chipworks 5
6 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 6
7 MEMS technology Bulk micromachining Structure definition by selective etching of bulk wafer Structures are monocrystalline Contamination risks (potassium, natrium, ) 1 mm Surface micromachining Structures are made on top of wafer by deposition and selective etching Structures are of poly silicon and silicon dioxide Few contamination risks 20 μm 7
8 MEMS technology: surface micromachining Thick epitaxy ( epi-poly ) DRIE ( Bosch-process ) Sacrifical etching of oxide 8
9 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 9
10 Challenges of MEMS (1/2) Dedicated processes and equipment HF vapor etch DRIE Source: Semitool Source: Tegal Processes with contamination risks to ICs Source: EVG 1 mm Anodic wafer bonding Anisotropic etching (KOH) Combined design and control of mechanical and electrical parameters 20 μm Frequency Damping Sensitivity Capacitance 10
11 Challenges of MEMS (2/2) Controlling the influence of mechanical stress of package Testing of physical parameters Robustness and media compability (e.g. for pressure or flow sensors) air mass sensor pressure sensor 11
12 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 12
13 Market drivers for MEMS sensors Automotive applications 1. high functional requirements (high accuracy, selftest, advanced safety concepts) 2. high reliability/quality (15 years, < 1 ppm, extreme environmental conditions) 3. low price (< 3 EUR) Consumer applications 1. small size (~ 3 x 3 x 0,9 mm3) 2. ultra-low power consumption ( 200 μa) 3. low price (< 1 2 EUR) 13
14 Evolution of MEMS requirements: pressure sensor packages
15 Evolution of MEMS requirements: pressure sensor technology (1/2) vacuum cavity Si Glass Bulk micromachining è Monocrystalline Si membranes è Wafer bonding è Long etching times (full wafer thickness!) è Vacuum reference by metal package è Large package Bulk micromachining è Monocrystalline Si membranes è Wafer bonding è Long etching times (full wafer thickness!) è reduction of package size 15
16 Evolution of MEMS requirements: pressure sensor technology (2/2) Si Glass vacuum cavity Si Bulk micromachining è Monocrystalline Si membranes è Wafer bonding è Long etching times (full wafer thickness!) New: surface micromachining è Monocrystalline Si membranes è Fabrication of cavity with porous Si (APSM process) è CMOS-compatible è No wafer bonding, all silicon 16
17 Evolution of MEMS requirements: acceleration sensor packages PLCC28 (Automotive) 1996 SOIC16w (Automotive) 2002 SOIC14n (Automotive) x4 QFN (CE) x3 QFN (CE)
18 Evolution of MEMS requirements: acceleration sensor footprint 140 Package footprint (mm2) Automotive CE
19 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 19
20 Bosch the micromechanics pioneer Bosch is a micromechanics pioneer with more than 20 years of experience First product in 1993: pressure sensor for automotive applications 1 billion MEMS sensors produced 20
21 DRIE The BOSCH process Deep RIE of silicon trenches Alternating etch- (SF 6 ) and passivation cycles (C 4 F 8 ) High aspect ratio (>> 10:1), high anisotropy and high etch rate Licensed to many companies worldwide European Inventor of the Year 2007 for Andrea Urban and Dr. Franz Lärmer 21
22 Bosch-Team wins German Future Prize of the Federal President Smart Sensors for Consumer Electronics, Industrial and Medical Technologies 22
23 Bosch leading the market in MEMS sensors Sales volume 2007 (mio $) Bosch Freescale Analog Devices Systron Donner Denso GE Sensing Honeywell Infineon STMicroelectronics Delphi Source: YOLE estimation 6/2008 TOP 30 MEMS Manufacturer 23
24 1 billion MEMS sensors produced 1000 Accumulated production volume (mio.)
25 MEMS sensors automotive applications Airbag Systems Acceleration sensors for occupant protection Angular rate sensors for rollover sensing Engine Management Pressure sensors for efficient and clean engine management concepts Vehicle Dynamics Control Acceleration and angular rate sensors for ESP Driver Information and Climate Control Angular rate sensor for navigation systems CCS climate control sensor 25
26 200mm fab in Reutlingen (near Stuttgart) Clean room class 1: 4500 m2 Capacity: up to 800 wafers/day Structure size: 0,18 μm 200mm fab 150mm fab 26
27 The approach to CE: Bosch Sensortec Founded in 2005 Provides Bosch MEMS technology to consumer electronics market Combines the experience of the MEMS pioneer Bosch with the flexibility of a team focusing on consumer applications. Bosch Sensortec head office, Reutlingen Bosch Sensortec locations 27
28 MEMS sensors the senses for mobile devices Mobile phones, PDAs Intuitive menu input through motion and position change Gaming and toys New gaming experience through motion interaction Mobile computing Data protection by free-fall detection Sports and fitness Monitoring through step-counting and altimetry 28
29 Use cases for MEMS sensors in mobile phones User Interface Tap control Gaming input Menu navigation Position Detection Upside down Portrait / landscape Free speech profile Pedestrian navigation Speed & distance estimation Altitude detection Location based services Motion Detection Step counting Activity monitoring Power management 29
30 Agenda MEMS market and applications MEMS technology Challenges of MEMS Evolution of MEMS requirements Bosch Future of MEMS Summary 30
31 Future of MEMS New applications are arising MEMS autofocus Energy Harvester Source: Siimpel Source: IMEC Micro Fuel Cell Micromirror for microprojection systems Source: STM, CEA Source: Microvision 31
32 Summary Automotive MEMS is main driver for sensor development Permanent enhancements of MEMS technology enables miniaturization of components and new functions Continous development of new device generations Consumer electronics MEMS is enabling technology for new functions in CE Key factors: size, power consumption, price In future large variety of new applications in many areas 32
33 MEMS for automotive and consumer Thank you for your attention! 33 Automotive Electronics AE/NE4 - Dr. Jiri Marek Feb. 2, 2009 Robert Bosch GmbH All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
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