Bosch IMU in iphone X IMU Sensor

Transcription

1 Bosch IMU in iphone X IMU Sensor MEMS report by Audrey LAHRACH January rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr IMU Bosch in iphone X 1

2 Table of Contents 3 o Executive Summary o Reverse Costing Methodology Company Profile 6 o Bosch Sensortec o Apple iphone X, iphone 8, and Watch Series 3 Teardown 16 o Synthesis of the 17 o Package 19 View & Dimensions Opening Wire Bonding Process Cross-Section o ASIC Die 32 ASIC Die View & Dimensions ASIC Delayering & Main Blocs ASIC Die Process ASIC Die Cross-Section ASIC Die Process Characteristic o MEMS Accelerometer Die 47 MEMS Die View & Dimensions MEMS Die Cross-Section MEMS Accelerometer Process MEMS Accelerometer Characteristics o MEMS Gyroscope Die 83 MEMS Die View & Dimensions MEMS Die Cross-Section MEMS Gyroscope Process MEMS Gyroscope Characteristics o Physical Comparison 115 Bosch IMU Sensor Evolution Comparison with InvenSense and STMicroelectronics 6-Axis IMUs Sensor Manufacturing Process 118 o ASIC Die Front-End Process & Fabrication Unit o MEMS Accelerometer Process & Fabrication Unit o MEMS Gyroscope Process & Fabrication Unit o Final Test & Packaging Fabrication unit 142 o Synthesis of the cost analysis 143 o Yields Explanation & Hypotheses 145 o ASIC Component 147 Die Front-End Cost/Probe Test, Thinning & Dicing ASIC Component Cost o MEMS Accelerometer Die 151 Die Front-End Cost/Probe Test, Thinning & Dicing Sensor Die Cost o MEMS Gyroscope Die 159 Die Front-End Cost/Probe Test, Thinning & Dicing Sensor Die Cost o LGA Packaged Component 167 LGA Packaging Cost Back End: Final Test Component Cost Selling Price 172 Company services 177 IMU Bosch in iphone X 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Bosch Accelerometer. This new Bosch Sensortec component is likely a custom 6-axis IMU made specifically for Apple. It is exactly the same component found inside the iphone 8, iphone X, and Apple Watch Series 3. One major improvement is the incredibly thin profile achieved by Bosch, with a total thickness of only 0.6mm compared to 0.9mm for the industry standard. This thickness was probably an Apple request in order to fit with the small form factor of the Apple Watch Series 3 s cellular functionality. To achieve this low profile, Bosch changed the packaging structure used for its preceding product, the BMI160. On the design side, Bosch Sensortec made significant changes - particularly for the accelerometer, where the old single-mass structure was abandoned for a new structure achieving better sensing properties. The micromachining manufacturing process, unchanged by Bosch Sensortec for many years, was also revised, with a new process for both accelerometer and gyroscope. Finally, a new ASIC die was designed to fuse the data from the accelerometer and gyroscope, and probably to deliver even lower current consumption and other functionalities. This report includes a detailed physical analysis, with process description and manufacturing cost analysis. A complete comparison with Bosch Sensortec s BMI160 is also provided, along with a comparison with InvenSense and STMicroelectronics latest 6-axis IMUs. IMU Bosch in iphone X 3

4 iphone X Teardown o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison 1 iphone X Main Board (Front Side) (2 PCB Assembled) 2 IMU 6-Axis Bosch iphone X Main Board (Disassembly) IMU Bosch in iphone X 4

5 0.6 mm 3.0 mm o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison Package Views & Dimensions Package: o Type: 16-pin LGA o Dimensions: 3.0 x 3.0 x 0.6mm o Pitch: 0.5mm 3.0 mm Marking: (Watch 3) (iphone 8) (iphone X).FY.FY.FY LEH LEF LEE E3E ETJ EEX Package Top View (Watch 3, iphone 8, iphone X) Package Bottom View Package Side View IMU Bosch in iphone X 5

6 o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison Package Opening o Wire Bonding number: xx o Material: xxxxx o Diameter: xxµm o Wire Bonding number: xx (xxxx) Bonding nb between ASIC & Package: xx Bonding nb between ASIC & MEMS Gyro xx Bonding nb between ASIC & MEMS Accelero xx Package Opening Overview SEM View IMU Bosch in iphone X 6

7 Package Cross-Section Accelerometer Overview o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison Cross-Section Plane Package total thickness: xxx mm o Package Molding thickness above MEMS: o MEMS Accelerometer thickness (with adhesive): o ASIC thickness (with adhesive): o PCB Substrate thickness: xxxx mm xxxx mm xxxx mm xxxx mm Wire Bonding xxxµm MEMS (Accelerometer sensor) ASIC PCB Substrate (xxx) Package Cross-Section Overview SEM View IMU Bosch in iphone X 7

8 xxxmm ASIC View & Dimensions xxxmm o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison o Die Area: xxx mm² (xxx x xxxmm) o Nb of PGDW per x-inch wafer: xxx o Pad number: xx o Connected: xx ASIC Die Overview - Optical View IMU Bosch in iphone X 8

9 ASIC Process Technology Node o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison ASIC Die Main Blocks xxxµm CMOS Transistors - SEM View o o The process uses CMOS transistors MOS transistor gate length: xxxµm o Technology node: xxxµm MOS Gate Length Measurement - SEM View IMU Bosch in iphone X 9

10 xxxmm o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Accelerometer View & Dimensions xxxmm o Die Area: xxxmm² (xxx x xxxmm) o Nb of PGDW per x-inch wafer: xxxxx o Pad number: x - Connected: x MEMS Die Overview Optical View IMU Bosch in iphone X 10

11 MEMS Accelerometer Cap Removed o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Cap Cap Removed Optical View IMU Bosch in iphone X 11

12 MEMS Accelerometer Sensing Area Proof mass o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Sensing Area Overview Fixed Electrode Movable Electrodes Proof mass Movable Electrodes MEMS Sensing Area Details Overview Fixed Electrode MEMS Sensing Area Details Overview IMU Bosch in iphone X 12

13 xxxmm o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Gyroscope View & Dimensions xxxmm o Die Area: xxxmm² (xxx x xxxmm) o Nb of PGDW per x-inch wafer: xxxx o Pad number: xx - Connected: xx MEMS Die Overview Optical View IMU Bosch in iphone X 13

14 MEMS Gyroscope Cap Removed o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Cap MEMS Sensor Cavity Cap Removed SEM View IMU Bosch in iphone X 14

15 MEMS Gyroscope Cross-Section o Synthesis o Package o Package Cross-Section o ASIC o MEMS Accelerometer o MEMS Gyro o MEMS Comparison MEMS Cross-Section Overview MEMS Cap The sealant between MEMS cap and sensor is an xxxxxxx. Cavity xxxx Xxxx xxxx xxxxxxx xxxµm MEMS Sensor MEMS Cap Cross-Section Overview Optical View IMU Bosch in iphone X 15

16 MEMS Accelerometer Sensor Process Flow (1/3) o Overview o ASIC Process o MEMS Accelero Process o MEMS Gyro Process o Packaging Process IMU Bosch in iphone X 16

17 ASIC Front-End Cost o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The unprobed wafer cost is estimated at $xxx for medium yield hypothesis. The main part of the wafer cost is due to the xxxxx with xx%. IMU Bosch in iphone X 17

18 ASIC Die Cost Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The number of good dies per wafer is estimated to ranges from xxxx to xxxx according to yield variations, which results in a die cost of $xxxx for medium yield. IMU Bosch in iphone X 18

19 MEMS Accelerometer FE Cost per Process Steps (MEMS Sensor 1/2) o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost IMU Bosch in iphone X 19

20 MEMS Accelerometer Die Cost Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The number of good dies per wafer is estimated to ranges from xxxxx to xxxxx according to yield variations, which results in a die cost ranging from $xxxx to $xxxx according to yield variations. IMU Bosch in iphone X 20

21 MEMS Gyroscope Front-End Cost o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The front-end cost for the MEMS Gyroscope ranges from $xxx to $xxx according to yield variations. The largest portion of the manufacturing cost is due to the xxxxxx at xx%. IMU Bosch in iphone X 21

22 MEMS Gyroscope Die Cost Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The number of good dies per wafer is estimated to ranges from xxxx to xxxx according to yield variations, which results in a die cost ranging from $xxxx to $xxx according to yield variations. IMU Bosch in iphone X 22

23 Package Cost o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The packaging cost is estimated to $xxxx according to yield variations. The largest portion of the manufacturing cost is due to xxxxxxx cost at xx%. IMU Bosch in iphone X 23

24 Bosch IMU Component Cost o Summary o Supply o Yields o ASIC Die Cost o MEMS Accelero Die Cost o MEMS Gyro Die Cost o Packaging Cost o Back-end Cost o Component Cost The component cost ranges from $xxx to $xxx according to yield variations. The ASIC die manufacturing represents xx% of the module cost. The MEMS Accelerometer die represents xx% of the module cost. The MEMS Gyroscope die represents xx% of the module cost. The package assembly represent xx% of the module cost. Final test and yield losses account for xx% of the module cost. IMU Bosch in iphone X 24

25 Bosch IMU Estimated Selling Price Evolution Low Yield Medium YieldHigh Yield #REF! #REF! Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown Component cost $0.544 $0.534 $0.525 Bosch Gross Profit $ % $ % $ % Component price $0.906 $0.891 $0.876 o Definitions of Price o Manufacturer Financial Ratios o Manufacturer Price We estimate that Bosch Sensortec realizes a gross margin of xx% on the component, which results in a final component price ranging from $xxxx to $xxxx. This corresponds to the selling price for large volume to OEMs. IMU Bosch in iphone X 25

26 Related Reports o Company services o Related reports o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEMS & SENSORS InvenSense ICM MEMS Packaging: Reverse Technology Review STMicroelectronics LSM6DSM 6-Axis IMU InvenSense 6-Axis OIS IMU InvenSense ICM Axis Sensor Hub Bosch Sensortec BMF055 9-Axis Sensor Hub Fairchild FIS1100 STMicroelectronics LSM6DS3 6-Axis IMU Bosch Sensortec BMI160 6-Axis IMU MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMS & SENSORS Status of the MEMS Industry 2017 MEMS Packaging 2017 IMU Bosch in iphone X 26

27 COMPANY SERVICES IMU Bosch in iphone X 27

28 Business Models Fields of Expertise o Company services o Related reports o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings IMU Bosch in iphone X 28

29 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ KOREA YOLE TOKYO YOLE KK o Company services o Related reports o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA (310) laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr IMU Bosch in iphone X 29

30 ORDER FORM Please process my order for Bosch s 6-Axis IMU in the Apple iphone X Report Ref.: SP18382 Full Reverse Costing report: EUR 3,490* Annual Subscription (including this report as the first of the year): o 3 reports EUR 8 400* o 5 reports EUR * o 7 reports EUR * o 10 reports EUR * o 15 reports EUR * *For price in dollars please use the day s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT *Our prices are subject to change. Please check our new releases and price changes on The present document is valid 6 months after its publishing date: January 2018 SHIP TO Name (Mr/Ms/Dr/Pr):... Job Title:... Company:... Address:... City: State:... Postcode/Zip:... Country:... VAT ID Number for EU members:... Tel: Date:... Signature:... BILLING CONTACT First Name:... Last Name: Phone:... PAYMENT DELIVERY on receipt of payment: By credit card: Number: Expiration date: / Card Verification Value: By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charron St Herblain France BIC code: CCFRFRPP In EUR Bank code : Branch code : Account : IBAN: FR In USD Bank code : Branch code : Account : IBAN: FR Return order by: FAX: MAIL: SYSTEM PLUS CONSULTING 21 rue La Nouë Bras de Fer Nantes France Contact: sales@systemplus.fr TEL: ABOUT SYSTEM PLUS CONSULTING System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available. Our services: TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS - sales@systemplus.fr Performed by

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