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1 21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) info@systemplus.fr - website : April Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 1

2 Table of Contents Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. STMicroelectronics Company Profile 7 ST Profile ST MEMS Gyroscopes Portfolio L3G4IS Characteristics ST Business Model 3. Nokia Lumia 920 Teardown 19 Nokia Lumia 920 Specs Nokia Lumia 920 Teardown 4. L3G4IS Physical Analysis 23 Physical Analysis Methodology Package Package Characteristics & Markings Package Pin-Out Package Opening Main Parts Package Opening Wire Bonding Process Package Opening PCB Layout Package Cross-Section ASIC ASIC Dimensions & Markings ASIC Pinout ASIC Cross-Section ASIC Characteristics MEMS MEMS Dimensions & Markings MEMS bonding pads MEMS Cap Opening MEMS Cap Getter MEMS Sensing Area MEMS Cross-section MEMS Characteristics MEMS Gold-Gold Bonding Version Shrinked MEMS die Modified THELMA Process 5. Manufacturing Process Flow 79 Global Overview ASIC Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Process Overview MEMS Sensor Process Flow MEMS Cap Process Flow MEMS Wafer Bonding Process Flow Description of the MEMS Wafer Fabrication Unit Packaging Process Flow 6. Cost Analysis 97 Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses ASIC Front-End Cost ASIC Back-End 0 : Probe Test, Backgrinding & Dicing ASIC Die Cost MEMS Front-End Cost MEMS Front-End Cost per Process Steps MEMS Front-End : Equipment Cost per Family MEMS Front-End : Material Cost per Family MEMS Back-End 0 : Probe Test & Dicing MEMS Die Cost (Front End + Back End 0) Back-End : Packaging Cost Back-End : Final test & Calibration Cost L3G4IS Component Cost (FE + BE 0 + BE 1) 7. Estimated Price Analysis 122 Definition of Prices Manufacturer Financial Ratios L3G4IS Estimated Manufacturer Price L3G4IS Estimated Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 2

3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics L3G4IS component. The L3G4IS is the first two-in-one three-axis MEMS gyroscope that can simultaneously handle usermotion recognition and camera image stabilization, allowing cost and board space savings. The L3G4IS features a 16-pin 4x4x1mm LGA package and provides accurate output across full-scale ranges up to ±2000dps (UI) and ±65dps (OIS). It is targeted for mobile applications: Gaming and virtual reality input devices, Optical image stabilization, Motion control and gesture recognition, GPS navigation systems by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 3

4 What's Surprising in this Device? Two versions of the L3G4IS are studied in this report. One was extracted from the Nokia Lumia 920 smartphone and the other was sourced as a single component. The version of the L3G4IS inside the Nokia Lumia 920 integrates a MEMS die using a glass-frit wafer bonding process for the capping of the sensor. The sensor is manufactured with the well known THELMA process. The other version of the L3G4IS integrates a MEMS die featuring a Gold-Gold thermocompression wafer bonding process which allows for a smaller sealing frame width and thus shrink the MEMS die size of 30%. Moreover, the MEMS sensor of this version is manufactured with a modified version of the THELMA process. This "new" THELMA process uses a stack of three materials for the buried polysilicon interconnect layer by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 4

5 Nokia Lumia 920 Teardown 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 5

6 Synthesis of the Physical Analysis 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 6

7 Package Cross-Section 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 7

8 ASIC Markings ASIC Die Markings The die markings include the logo of STMicroelectronics and: 2012 V729B This lead us to suppose that the mask set origin is by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 8

9 MEMS Bond Pads (Glass-Frit Version) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 9

10 MEMS - Cross-Section (Glass-Frit Version) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 10

11 MEMS Bond Pads (Gold-Gold Version) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 11

12 MEMS - Sensor Process Flow 1/ by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 12

13 Main steps of economic analysis Front-End ASIC Front-End Cost MEMS Front-End Cost Back-End 0 Probe Test Cost Backgrinding & Dicing Cost Probe Test Cost Dicing Cost Back-End 1 Packaging Cost Final Test & Calibration Cost Component Cost L3G4IS We perform the economic analysis of the ASIC with the IC Price+ software. We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 13

14 ASIC Die Cost (Front-End + Back-End 0) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 14

15 MEMS Front-End Cost 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 15

16 MEMS FE Cost per Process Steps (1/3) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 16

17 MEMS Front-End : Equipment Cost per Family 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 17

18 L3G4IS Component Cost (FE+BE 0+BE 1) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 18

19 L3G4IS Estimated Selling Price (Medium Yield) 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS Dual-Core 3-Axis MEMS Gyroscope 19

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

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