ThunderClad 3. TU-933 Super Low Loss Material. Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials

Similar documents
PSR-4000 LDI (US) (UL Name: PSR-4000 JA / CA-40 JA)

(TRCM) Wire Wound RF SMD Inductor

Flex and Rigid-Flex Boards

PSR-4000 HFX Series (UL Name: PSR-4000DE / CA-40HF)

PSR-4000BN Series (UL Name: PSR-4000BN / CA-40 BN)

1mm Pitch SMT Board-to-Board Connectors(Standard Interface Connector Compliant with VESA FPDI-1)

PSR-4000BN DI Colors (UL Name: PSR-4000BN / CA-40 BN)

PRODUCT SPECIFICATION

Newport 301 Product Data Sheet

About ABB Micafil Facts

Product Specification Spring Finger

Thermal Profiling the Reflow Process

Implementing High Temperature Coplanarity Requirements for Components and PWBs. Proposed 1

BOURNS INDUCTIVE COMPONENTS

3M Thermally Conductive Epoxy Adhesive TC-2810

RF Chip Inductors. Wire-Wound , 0603, 0805, 1008, Pulse Electronics - leading supplier of magnetics for consumer applications

Product Technical Bulletin #48

Thin-Film Technology. Accu-F / Accu-P Thin-Film RF/Microwave Capacitors.

REFERENCE SPECIFICATION

SMB Series. SMB Series. Specifications. Interface Dimensions. Available in 50 Ohm and 75 Ohm versions. Snap-on interface reduces installation time.

CHANGE RECORDS TABLE OF CONTENTS

Cleaning Medical Electronics

PSR-4000 MP (UL Name: PSR-4000MP / CA-40MP)

Preliminary Datasheet

NON-CATALOG. Features excellent image rejection, 27 db typ. low conversion loss, 7.0 db typ. aqueous washable J-leads for strain relief

TECHNICAL DATA SHEET

Type 715P/717P, Orange Drop, High Voltage, Polypropylene Film/Foil

Surf Clear EVO Epoxy system for surfboards

TECHNICAL DATASHEET CARAPACE EMP110 W- LED

1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1)

Profile Design Recommendations

Type 715P/717P, Orange Drop, High Voltage, Polypropylene Film/Foil

*NOTE: 75 OHM SERIES CONNECTORS ARE NOT INTERMATEABLE WITH THE 50 OHM SERIES.

MIL-STD-883H METHOD EXTERNAL VISUAL

Impact of Process Control in Pb-Free to SnPb Reballing Techniques

PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701

PolySwitch Radial-leaded Resettable Devices

Amphenol RF. Type N. Type N Connectors. Type N. Description. Features/Benefits. Applications

High Curent Inductor / MPSZ Type

SOLDER PASTE APPLICATIONS POSSIBLE CAUSES AND PROCESSING CONSIDERATIONS

BNC 50 Ohm. BNC - 50 Ohm. Aviel Electronics 3060 East Post Road, Suite 100, Las Vegas NV 89120

CERAMIC CHIP/CAPACITORS

Surface Mount NTC Thermistors. Link: RT Tables. NST Series

Outer contact 1.0 milliohm max.

PSR-9000 FXT Series (UL Name: PSR-9000AC/CA-90AC)

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding

PRODUCT SPECIFICATION FOR APPROVAL

RESISTORS, HEATERS, FLEXIBLE, SINGLE AND DOUBLE LAYER. ESCC Detail Specification No. 4009/002

SPECIFICATION FOR APPROVAL

APPLICATIONS ROV & AUV SEISMIC PRODUCTION SYSTEMS DOWNHOLE JUMPER & CABLE SYSTEMS DRILLING CONTROL

Surface Mount Specialty Polymer Solid Aluminum Electrolytic Capacitors

ibridge and ibridge Ultra

Barrier Development and Evaluation Methodology. D.S. Musgrave 1 1 Thermal Visions, Inc., Granville, USA

DRS25 PROCESS DEVELOPMENT GUIDE.

CIA-EA Technical Data Sheet

DRIVEN BY PERFORMANCE. PERFORMANCE THROUGH INNOVATION.

Let It Rip ///// 2018 BRAND BOOK Kellogg Ave. Carlsbad, CA (800) aldila.com. Part No. ALD-BB _V07

TenCate TC275-1 PRODUCT DATA SHEET DESCRIPTION FEATURES NEAT RESIN PROPERTIES PRODUCT TYPE TYPICAL APPLICATIONS SHELF LIFE

TenCate TC410 PRODUCT DATA SHEET

CERAMIC CHIP CAPACITORS

CERAMIC CHIP CAPACITORS

SOLAR ENERGY. solutions. adhesives, sealants, and Potting encapsulants For solar energy applications

JSP. MKT Series J S P -

TURQUOISE SWITCHES ABJ (BJ) SWITCHES

Ceramic Disc Capacitors Safety Standard Approved Disc Capacitor

FAST 2K Fence Post Backfill

INDIUM CORPORATION TECHNICAL PAPER. Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue.

Features hermetic shielded case very small phase variation

Thermo Scientific Chromatography Well Plates

Thermo Scientific Chromatography Well Plates

Small Form-factor Pluggable Connector

GENERAL APPLICATION NOTES

HONMA BERES S/IS-06/U-06 Left-handed Model Debut!

K&B Vault and Riser Closures

R / WOUND technology from pitch 10 to 27.5mm (Rated Voltage from 63 to 1000Vdc) PRODUCT CODE SYSTEM

ASPHALT PLANT LEVEL 1

MWR - MWF Metallized polyester film capacitor MKT - High performance

Fibreglass, Resin, 5min Araldite, flock. The Strobe mounting point may have to be moved forward.

Surfboard Repairs Chapter 7

Series AM3T-VZ 3 Watt DC-DC Converter

Type 160 Metallized Polyester Radial Lead Capacitors

Reballed Ball Grid Array Reliability Under Shock and Vibration Joelle Arnold Dr. Nathan Blattau

POP UP ANCHOR. Part Number Spectrum Lane ~ Missoula MT ~

BME280 Combined humidity and pressure sensor

R60. MKT Series R 6 0 -

MULTILAYER CERAMIC CHIP CAPACITORS

WHEEL PASSPORT RC23 >

High Frequency Chip Ceramic Inductor

RMANCE ROCKPANEL. System 1. inorganic finish. english. - vs01. Konstruktieweg. Tel. Fax. Notified. Body: 1. Unique. 4. System as set.

Use suitable respiratory protection Contains acrylic resins, xylene and other ingredients. When mixed, it also contains isocyanates.

CERAMIC CHIP/CAPACITORS

TVS Diodes Axial Leaded 30 kw > 30KPA-HRA series. Features. 30 kw 8.0 W 400 A. -55 to 175 C. Notes: 8.0 C/W

NEWS RELEASE. HONMA BERES S-06 series/u-06 Debut! January, 2018

EASILY SELECT THE RIGHT SKI

X-29 Canard Jet. A Simple Depron Foam Build.

Typical Performance 1. LTE 20M ACLR dbm. 2 OIP3 _ measured on two tones with a output power 5dBm/ tone, F2 F1 = 1 MHz.

Time Pressure Dispensing

PRESENTS. Solder & Oven Profiles Critical Process Variables

Ducted Reverse Cycle Air Conditioning of Distinction

Differential pressure switch / Lube oil protection control MP 54 and MP 55

Transcription:

ThunderClad 3 TU-933 Super Low Loss Material Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials

TUC Product Roadmap 2 ULVP VLP HCF Ultra Low Void Prepreg Very Low Profile Copper Foil Heavy Cu foil (max. 12 oz) LDP Laser Drillable Prepreg UTC Ultra-Thin Core (1mil) ZBC Buried Capacitance D+9 DS within +/-100 ppm New Products Super Low Loss CCL / ThunderClad 3 HF Low Loss CCL / ThunderClad 1 --- Df 0.008 @ 1GHz / Low Signal Loss Board HF Mid-Tg Low Dk / TU-787 LK --- Dk 3.4, Df 0.0025@10GHz / High Speed / RF HF Very Low Loss / ThunderClad 2 --- Df 0.0050 @ 10GHz / Excellent Signal Integrity --- Dk 3.2 ; Df < 0.010 / Anylayer HF High Reliability CCL / TU-865 --- Hi-Tg Low CTE / Harsh Environment High Thermal Reliability Green Materials Low Loss Lead Free Process Compatibility 10 cycles 6 cycles TU-768/768 F (Tg180) TU-662/668 (Tg150) --- high Layer Count/ High density Multi-layer Board TU-722 (Tg180) ---High Layer Count/ High Density Multi-layer Board TU-862 HF (Tg180) TU-84P NF --- Rigid-Flex TU-747 LK (Tg150) TU-747 HF (Tg150) --- Mid-Loss --- Low Dk / Any-layer ---Consumer / HP / NB High Speed / Low Dk/Df TU-872 SLK / SLK Sp Low Dk/Df Laminate TU-872 LK ---High Speed /Low Signal Loss Board IMS Insulated Metal Substrate TU-322 / TU-362 / TU-351 --- 2 W/mK / 1 W/mK

ThunderClad 3 Features : 3 Non-epoxy resin system For high speed digital / RF application Thermal robust for fine pitch design Flat Dk / Df varied with frequency & temperature Dk = 3.4 @ 10GHz ( split post cavity method ) Df = 0.0025 @ 10GHz ( split post cavity method ) Tg = 170 o C/220 o C ( TMA / DMA ) Status : alpha site internal evaluation

ThunderClad 3 4 Type Performance ThunderClad 3 (TU-933) TU-872 SLK 4350B* Tg, (DMA), C 220 220 - Tg, (TMA), C 170 190 - Td, (TGA, 5%wt loss) C 390 340 390 Z-axis Expansion, (50-260 C), % 2.7 2.3 1.1 Dk @ 10GHz ( SPC method ) 3.4 3.8 3.48 Df @ 10GHz ( SPC method ) 0.0025 0.0090 0.0037 Flammability, UL94 94-V0 94-V0 94-V0 Peel strength (1oz), lb/in 4~6 5~7 5 T-260, min >60 60 >60 T-288, min >60 20 >60 T-300, min >60 - - PCT/1hr/Dip (288 C), sec >120 >120 - * Data is base on public datasheet information

ThunderClad 3 - Rheology 5 1.E+06 TU933 Heat Rise Rate : 2.0 degc/min Viscosity ( Pa.s ) 1.E+05 1.E+04 1.E+03 1.E+02 80 100 120 140 160 180 Temperature ( degc )

ThunderClad 3 - Dk 6 4.5 4.0 3.5 Dk 3.0 1 GHz 10 GHz 2.5 2.0 40 45 50 55 60 65 70 75 80 RC% * Base on Split post Cavity Method

ThunderClad 3 - Df 7 0.004 0.003 0.002 Df 0.001 10 GHz 1 GHz 0.000 40 45 50 55 60 65 70 75 80 RC% * Base on Split post Cavity Method

ThunderClad 3 Propagation Constant 8 4.0 3.8 Cu H oz 2116 x 1 H oz 2116x1 Cu H oz T3 + MLS T3 + VSP 3.6 Dk 3.4 3.2 3.0 0 4 8 12 16 20 Frequency [GHz]

ThunderClad 3 Insertion Loss 9 Loss per inch [db] 0-0.2-0.4-0.6-0.8-1 -1.2-1.4-1.6 0 2 4 6 8 10 12 14 16 18 20 TU-872 SLK MLS TU-872 SLK VSP Competitor MLS Competitor HVLP T3 VSP T3 MLS Cu H oz 2116 x 1 H oz 2116x1 Cu H oz -1.8 Frequency [GHz]

ThunderClad 3 Dk vs Temperature 3.5 3.4 3.3 Dk 1 GHz 5 GHz 10 GHz 20 GHz 3.2 3.1 3.0 Cu H oz 2116 x 1 H oz RTF 2116x1 Cu H oz -50-30 -10 10 30 50 70 90 degc

ThunderClad 3 Loss vs Temperature 0.0-0.3-0.6 Loss db/in -0.9-50 -30-10 10 30 50 70 90 1.0 GHz 5.0 GHz 10.0 GHz 12.5 GHz -1.2-1.5 Cu H oz 2116 x 1 H oz RTF 2116x1 Cu H oz degc 20.0 GHz

ThunderClad 3 Case Study 12 Material : ThunderClad 3 Layer count : 26 layer Board Thickness : 3.2 mm 2 oz copper foil : x 4 layers Pitch design : 0.65, 0.8 & 1.0 mm Drilling hole size : 0.3 mm Pattern design : x 4 types Test criteria : 260 o C reflow 10X 288 o C Solder 6x

ThunderClad 3 Case Study L1 H oz PP 2116 HRC 1 L2/3 3mil 1/1 PP 2116 HRC 1 L4/5 3mil 1/1 PP 2116 HRC 1 L6/7 3mil 1/1 PP 2116 HRC 1 L8/9 3mil 1/1 PP 2116 HRC 1 L10/11 3mil 1/1 PP 106 HRC 2 L12/13 6mil 2/2 (2ply) PP 106 HRC 3 L14/15 6mil 2/2 (2ply) PP 106 HRC 2 L16/17 3mil 1/1 PP 2116 HRC 1 L18/19 3mil 1/1 PP 2116 HRC 1 L20/21 3mil 1/1 PP 2116 HRC 1 L22/23 3mil 1/1 PP 2116 HRC 1 L24/25 3mil 1/1 PP 2116 HRC 1 L26 H oz 13 13

ThunderClad 3 0.8 mm / solder 6x Solder 6x 14 D2 design D3 design

ThunderClad 3 0.65 mm / solder 6x Solder 6x 15 D2 design D3 design

ThunderClad 3 1.0 mm / reflow 10x 16 Reflow 10x Reflow 10x Pitch 1.0 mm Pitch 1.0 mm

ThunderClad 3 0.8 mm / reflow 10x 17 Reflow 10x Reflow 10x Pitch 0.8 mm Pitch 0.8 mm

ThunderClad 3 0.65 mm / reflow 10x 18 Reflow 10x Reflow 10x Pitch 0.65 mm Pitch 0.65 mm

ThunderClad 3 Case Study 19 Design / Thermal Pitch 1.0 mm Pitch 0.8 mm Pitch 0.65 mm D1 D2 D3 D4 D1 D2 D3 D4 D1 D2 D3 D4 Solder 6x Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Reflow 10X Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No delamination No crack No ICD No Pad Lifting

20 Q & A