Electronic Costing & Technology Experts

Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr November 2015 Version 1 - Written by Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1

1. Overview / Introduction 3 Executive Summary Reverse Costing Methodology 2. Physical Analysis (SCC2230-E02) 10 Package 13 Package View & Dimensions Package Opening Package Cross-Section ASIC Die 23 Die View, Dimensions & Marking Die Delayering Die Cross-Section Process Characteristics MEMS Gyroscope Die 36 Die View & Dimensions MEMS Gyro Structure MEMS Gyro Opening MEMS Gyro Sensing Structure MEMS Gyro Electrodes MEMS Gyro Cross-Section Process Characteristics MEMS Accelerometer Die 62 Die View & Dimensions MEMS Accelero Structure MEMS Accelero Opening MEMS Accelero Cross-Section Process Characteristics 3. Physical Analysis (SCC2230-D08) 79 4. Physical Analysis (SCC2130-D08) 81 5. Comparison with 1 st Generation SCC1300 Series 100 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 6. Manufacturing Process Flow 104 Global Overview ASIC Front-End Process ASIC Wafer Fabrication Unit MEMS Gyro Process Flow MEMS Accelerometer Process Flow MEMS Wafer Fabrication Unit Packaging Process Flow Package Assembly Unit 7. Cost Analysis 125 Main steps of economic analysis Yields Hypotheses ASIC Front-End Cost ASIC Back-End 0 : Probe Test & Dicing ASIC Wafer & Die Cost MEMS Gyro Front-End Cost MEMS Gyro Back-End 0 : Probe Test & Dicing MEMS Gyro Front-End Cost per process steps MEMS Gyro Wafer & Die Cost MEMS Accelero Front-End Cost MEMS Accelero Back-End 0 : Dicing MEMS Accelero Front-End Cost per process steps MEMS Accelero Wafer & Die Cost Back-End : Packaging Cost Back-End : Packaging Cost per Process Steps Back-End : Final Test Cost SCC2230 Component Cost 8. Estimated Price Analysis 159 Manufacturer Financial Ratios Estimated Selling Price

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Murata SCC2000 series combo sensors. Murata SCC2000 series are combined accelerometer and gyroscope sensor devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection. The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-soi (c-soi) substrates. A single ASIC produced with an advanced BCD process is used. The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion. The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications. SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems. The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included. 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3

The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured. The die is extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking. Removal of metal layers in order to identify the nature of the transistors and to measure the minimum dimensions. A cross section is realized in order to get the BEOL structure Set up of the manufacturing process. Costing analysis Setup of the manufacturing environment. Cost simulation of the process steps with different year and quantity scenarios. Selling price analysis Supply chain analysis. Analysis of the selling price. 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4

Package: Premolded SOIC 24-Pin Dimensions: 14.9 x 8.4 x 4.1mm Pin pitch: 1.0mm Marking: <Logo Murata> SCC2230-E02 1741506291SCC 14.9mm Measurement Directions 4.1mm 8.4mm Package Top View Package Side View Package Bottom View 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 5

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 16