SPUTTER STATION STANDARD OPERATING PROCEDURE

Transcription

1 SPUTTER STATION STANDARD OPERATING PROCEDURE Purpose of this Instrument: This instrument is used for deposition of thin metal or oxide films. Source materials supplied by WVU Shared Research Facilities: *All targets are 2 in diameter and can be installed upon request. Aluminum Cobalt Copper Chromium Gold Cobalt Nickel Platinum Tantalum Titanium Zinc Oxide Location: White Hall 414 Cleanroom Primary Staff Contact: Harley Hart (412) (M) (304) (O) Office: White Hall 409 harley.hart@mail.wvu.edu Secondary Staff Contact: The Shared Research Facilities are operated for the benefit of all researchers. If you encounter any problems with this piece of equipment, please contact the staff member listed above immediately. There is never a penalty for asking questions. If the equipment is not behaving exactly the way it should, contact a staff member.

2 INSTRUMENT START UP 1. Reserve the equipment in CORES and login using the CORES kiosk in the cleanroom entry lab. 2. Before entering the cleanroom, check in the Entry Lab that the gas bottle valves are open for the following gases see Figure 1: UHP Nitrogen: used for vented of the loadlock NOTE: This gas bottle should always be open as this gas is required for the PLD turbo pump operation. UHP Argon: Sputtering process gas UHP Oxygen: Sputtering process gas Figure 1: White Hall Cleanroom gas bottles and pressure gauges WARNING: Users are to ONLY open and close the gas bottle valves. Adjustment of the gas line pressures at the regulators can cause damage to the connected cleanroom equipment. WARNING: If a gas bottle pressure is below 500 psi, contact a Shared Research Facilities staff member to change the bottle. Gas used below 500 psi is not ultra-high purity and can contaminate the system. 3. At the tool, record the following parameters in the log book. Name Date Cryopump Temperature: Value should be less than 15K see Figure 2. If the temperature is at or above 15K, contact a Shared Research Facilities staff member so that the cryopump can be regenerated. NOTE: Please note that the regeneration of the cryopump will require the user reservation to be rescheduled. 1

3 System Base Pressure: Pressure value should be below 9x10e-8 see Figure 3. If the base pressure value is above this value, please contact a Shared Research Facilities staff member Target Material(s) to be used. Figure 2: Cryopump temperature gauge Figure 3: Main chamber vacuum gauge 4. Open the following gas valves on the wall manifold behind the tool see Figure 4: UHP Nitrogen: Gas used for venting of the loadlock UHP Argon: Sputtering process gas UHP Oxygen: Sputtering process gas NOTE: Only open the gas valves that are going to be used for processing. Figure 4: Gas manifold with Nitrogen, Argon and Oxygen lines open to the sputter station WARNING: Do not touch the position of the compressed air line as this will cause a change in the target shutter opening speed and could cause damage to the mass flow controllers. If the pressure is incorrect, then contact a Shared Research Facilities staff member. 5. Go behind the tool and check the water flow rates at the flow meters for the following see Figure 5: Sputter Guns: 0.15 gpm Substrate Heater: 0.5 gpm Rf Matching Network: 0.4 gpm NOTE: Open this flow meter valve only if RF sputtering is to be conducted. Cryopump Compressor: 0.8 gpm Turbo Pump: 0.1 gpm Figure 5: Water flow meter manifold on the backside of the sputter station 2

4 SAMPLE PREP 1. Retrieve an Inconel sample carrier from storage box see Figure 6. Figure 6: Sample carrier storage box 2. Using the short end of the allen wrench, loosen the allen screws on sample carrier see Figure 7. Figure 7: Allen wrench being used to loosen sample carrier screws 3. Place sample(s) on sample carrier. Then using the sample holders move clips onto edge of sample(s). Tighten the allen screws using the short end of the allen wrench see Figure 8. Figure 8: Attaching sample to the sample carrier 3

5 NOTE: If multiple samples are to be attached to the sample carrier, retrieve additional clips, washers, and allen screws from the storage box. If you cannot locate these items, please contact a Shared Research Facilities staff member. 4. Once the samples are attached, verify that the sample(s) is secure using the sample holders see Figure 9. Figure 9: Using sample holders to verify sample is secure WARNING: For sputtering, the sample carrier is placed in an upside down orientation during transfer and deposition. Unsecured samples can fall off onto the targets causing possible damage to the tool. Samples that fall off of the substrate carrier will only be retrieved when the main chamber of the tool is brought up to atmosphere for service. If your sample falls off during deposition, please contact a Shared Facilities staff member immediately. SAMPLE LOADING 1. Verify that the gate valve between the main chamber and loadlock is closed by rotating the gate valve positioning knob in a counterclockwise direction see Figure 10. Figure 10: Location of the gate valve between the loadlock and main chamber 4

6 WARNING: Venting the loadlock with the gate valve open will cause the cryopump to warm-up and a twelve hour regeneration cycle will be required to restart the cryopump. 2. Verify that the loadlock turbo gate valve is OPEN by turning the positioning knob counterclockwise see Figure 11. Figure 11: Location of turbo gate valve 3. Turn off the ion gauge filament by pressing the ION button on the loadlock ion gauge controller see Figure 12 Figure 12: Loadlock ion gauge controller and ion button 4. Turn off the turbo pump and by pressing the PUMPING UNIT button on the turbo controller see Figure 13. The green PUMPING UNIT light will turn off. Figure 13: Loadlock turbo pump controller 5

7 5. Close the roughing pump to the turbo pump by turning the valve counter-clockwise see Figure 14. Figure 14: Location of the loadlock roughing pump valve 6. Set the timer and allow the turbo pump to spin down for 10 minutes before introducing UHP nitrogen vent gas. WARNING: Venting the loadlock with the turbo pump spinning at full speed will cause severe damage to the turbo pump as this will force the turbo pump to spin-down rapidly. 7. After 10 minutes, open the green nitrogen valve on the loadlock by turning the valve counter-clockwise. This will introduce nitrogen into the loadlock and bring the loadlock up to atmospheric pressure. Once the loadlock has reached atmospheric pressure, the hissing of nitrogen gas can be heard escaping around the loadlock lid. Close the green nitrogen valve by turning the valve clockwise see Figure 15. Figure 15: Location of the loadlock nitrogen vent valve 6

8 8. Once vented, open the loadlock lid on top of load lock and swing it backwards see Figure 16. Figure 16: Opening of loadlock lid 9. Verify that the loading arm is in the proper position with 3 centering pins on the sample arm facing upwards see Figure Attach the propeller style sample carrier insertion rod to the back of the sample carrier see Figure 18. Lower the sample carrier on to the transfer rod loading arm so that the centering pins are seated within the three notches of the sample carrier. Then look through loadlock viewport and verify that the sample carrier is seated flush on the loading arm. Figure 17: Sample transfer arm in loading orientation Figure 18: Sample carrier insertion rod inserted into the back of the sample carrier WARNING: Failure to properly insert the sample carrier onto the transfer arm can result in a failure to transfer samples and a loss of samples inside the tool. If this occurs, please contact a Shared Facilities staff member. 7

9 11. Remove the propeller style sample carrier insertion rod from the back of the sample carrier. 12. Using an alpha wipe and IPA, wipe down the o- ring and verify that it is properly seated within the groove of the loadlock lid see Figure 19. Figure 19: Wiping down of loadlock o-ring with Isopropanol WARNING: Failure to check that the o-ring can result in damage to the o-ring during closure. As a result the loadlock will not pump down and the o-ring will need to be replaced. 13. Close the loadlock lid by pulling it forward. 14. Open the loadlock roughing pump valve by manually turning the black valve counterclockwise until it stops moving. 8

10 15. Monitor the loadlock vacuum gauge. Once the gauge reaches 50 mtorr see Figure 20. Turn on the turbo pump by pressing pumping on button on JCP300 controller. Figure 20: Loadlock vacuum gauge at 50 mtorr 16. Monitor the loadlock vacuum gauge. Once the pressure reaches 0 mtorr, turn on the loadlock Ion Gauge by pressing the ION button on the loadlock Ion Gauge Controller. The ion gauge on the loadlock will illuminate. 17. Monitor this pressure until the loadlock pressure reaches 5x10e-6 which is the required pressure for transfer. Once this transfer pressure is reached, close the turbo gate valve by turning the valve clockwise until it is fully closed see Figure 21. Figure 21: Loadlock ion gauge controller at transfer pressure 18. Open the gate valve between the loadlock and the main chamber by turning the positioning know clockwise until it stops see Figure 22. Figure 22: Location of loadlock/main chamber gate valve positioning knob 9

11 19. Place the Heater Manipulator Controller into RUN mode. This will allow use of the joystick during transfer of the sample carrier. On the Heater Manipulator Controller, push the joystick upwards to allow clearance for the transfer arm to slide beneath see Figure 23. Figure 23: Heater manipulation controller NOTE: It will be necessary to use the flashlight located by the tool for the following transfer steps. 20. Slide the manual transfer arm into the main chamber. Visually check that the sample carrier is centered underneath the propeller style holder on the manipulator. 21. Rotate the manipulator rod so that the propeller end is roughly in same orientation as the propeller style cut-out on the back of the sample carrier. Then using the joystick, bring the propeller end of the manipulator rod downward so that it slides into propeller style cut-out on the back of the sample carrier and it sits flush into the sample carrier. The sample may need to be rotated to allow the screw to slide into the cut-out of the sample carrier on the transfer arm. WARNING: Do not over drive the manipulator rod downward to the point that deflection of the transfer arm is observed this can severely damage the transfer arm. 22. Push the joystick to the left (IN) to rotate the manipulator rod. This needs to turn approximately ½-inch to ¾-inch to ensure the manipulator end properly inserted into the back of the sample carrier. This can be monitored by watching the movement of the manipulator rod motor on top of the Heater Manipulator Assembly see Figure

12 Figure 24: Z-Manipulator WARNING: If the manipulator rod turns only ¼-inch then the sample carrier is not properly attached and it may become detached during deposition. As a result damage to the tool can occur and the main chamber will need to be vented. 23. Next, push the joystick upwards to remove the sample carrier from the transfer arm. Monitor that the sample carrier is removed properly through the front viewport. 24. Slide the loading arm slowly out of the main chamber. 25. Close the gate valve between the main chamber and the loadlock by turning the valve counter-clockwise until it stops. 26. Open the loadlock turbo gate valve to allow the loadlock to remain under vacuum during processing. HEATER OPERATION 1. Turn on the Heater Controller see Figure Using the control panel set the heater to the desired setting up to 800 C see Figure 25. Set the ramp rate to a maximum of 15 C/s. Allow the system to reach temperature prior to conducting deposition. Figure 25: Heater Controller and the control panel DC SPUTTER DEPOSITION 11

13 1. Set the sample rotation to the desired setting value 1-10 on the manipulator controller and set the controller mode to JOG see Figure 26. Then record this information in the log book. Figure 26: Z-manipulation controller 2. Set the sample carrier height by moving the stage downward until the two manipulator platforms are 3.3 apart. see Figure 27. Figure 27: Stage measuring points 3. On the pressure controller, set the desired deposition pressure value on the pressure controller. This is done by pressing the up arrow once and using the knob to change to SETPOINT A to the desired value. Then press the DOWN arrow once to go back to the home screen see Figure On the gas controller, zero out the Argon and/or Oxygen set-points by turning the channel knob to the channel one for Argon and channel two for Oxygen. Then turn the zeroadjustment screw under the appropriate gas Figure 28: Main Chamber Pressure Controller Figure 29: Gas Controller showing z-adjustment screw and channel knob positions 12

14 until the output on the display reads zero using a screwdriver - see Figure 29. White Hall Sputter Station WARNING: Do not rotate the z-adjustment screw more than ten turns in either direction as the adjustment screw will become disengaged. If the display value fails to increase or decrease while turning the z-adjustment screw, contact a Shared Facilities staff member. 5. On the gas controller, check the Argon and/or Oxygen set-points by turning the channel knob to the channel one for Argon and channel two for Oxygen. Then hold the desired gas set-point toggle switch in the up position as seen in the figure below and change the set-point to the desired set-point value using the screwdriver. If you are going to use a ratio, contact a SRF staff member see Figure 30. Figure 30: Gas controller showing set-point toggle switch and adjustment screw position WARNING: Do not rotate the set-point adjustment screw more than ten turns in either direction as the adjustment screw will become disengaged. If the display value fails to increase or decrease while turning the set-point adjustment screw, contact a Shared Facilities staff member. 6. Turn on the power of the DC power supply and set the control selector to POWER. Press the set-point button on the power supply and rotate the power knob to change the power to the desired set-point see Figure 31. Figure 31: DC Power Supply NOTE: Each sputter gun cable is color coded. Select the DC power supply that corresponds to the cable that is connected to the desired sputter target. 13

15 7. Verify that the sample shutter is between the sample and the sputter targets. This is done by using the sample shutter adjustment knob as seen in Figure 32. WARNING: Do not lift upwards on the positioning knob or the shutter knob will fail to turn the shutter as the positioning of magnets in the knob will not be properly aligned. This will create a need to vent the main chamber to correct the issue and lead to tool downtime. Figure 32: Sample shutter positioning knob 8. In the Sputter Deposition software, enter the following parameters see Figure 33: Stack - This is for having the software loop the entered sequence. A minimum of 1 is required. Target Shutter - Shutter to be opened Time - The length of time the desired target shutter will be opened. 14

16 Figure 33: Sputter deposition software screenshot 9. Turn the filament switch of the main chamber Ion Gauge to the OFF position on the Ion Gauge Controller see Figure 34. The display will show five dashes and the ION button will be off. 10. Move the toggle switch(s) of the Argon and/or Oxygen on the gas controller to the ON position(s) see Figure 35. The display will show the flow value. Figure 34: Main chamber ion gauge controller button Figure 35: Gas Controller indicating On/Off toggle switches of the Argon & Oxygen with the Argon Gas ON. 11. Press SETPOINT A on the Pressure Controller to activate the throttle valve. Allow the pressure to stabilize before proceeding see Figure

17 Figure 36: Pressure Controller in operation 12. Once the pressure has stabilized, press the ON button on the DC power supply and verify that a plasma is lit inside the chamber above the desired target. Verify that the plasma is stable and allow the target to burn-in to remove any contaminants for at least one minute see Figure 37a and Figure 37b. Figure 37a: DC Power Supply in the ON position Figure 37b: Plasma ignited in chamber above desired target 13. Move the substrate shutter counter clockwise prior to starting the process. 14. Press the white arrow icon on the Sputters Station deposition software to open the target shutter and start the deposition. Verify the shutter is open and then close the viewport shutters 15. Record the following parameters in the logbook: Power Voltage Time Gases Used Gas Flow Rates Deposition Pressure Deposition Rate (If this is a calibration samples, measure samples on the XRD or profilometer prior to recording in the logbook.) Total Thickness Deposited (If this is a calibration samples, measure samples on the XRD or profilometer prior to recording in the logbook.) 16

18 Heater Temperature White Hall Sputter Station 16. Once the deposition is complete, the target shutter(s) will close. 17. Manually close the substrate shutter so that it is between the targets and the sample. 18. Press the OFF button on the DC power supply to turn off the plasma and then press the OFF button on the power supply to turn OFF the power supply. see the Figure 38. Figure 38: DC Power Supply 19. Move the gas toggle switch (es) on the gas controller to the OFF position(s). 20. Press the OPEN button on the pressure controller to fully open the throttle valve and pump the chamber back down to base pressure. 21. Press the ION button on the Ion Gauge Controller to power on the main chamber Ion Gauge. Wait for the system to reach base pressure before removing the sample carrier. NOTE: If the heater was used, then begin to ramp down the heater. The sample cannot be removed until the chamber is at 40 C. WARNING: Removing the sample before it has properly cooled, can cause personal injury as was as damage to the system pumping equipment. RF SPUTTER DEPOSITION WARNING: Failure to turn set the water flow rate on the water manifold for the automatching network can result in severe damage to the tool. 17

19 1. Set the sample rotation to the desired setting from 1-10 on the manipulator controller and set the controller mode to JOG see Figure 39. Figure 39: Z-manipulation controller 2. Set the sample carrier height by moving the stage downward until the two manipulator platforms are 3.3 apart see Figure 40. Figure 40: Stage measuring points 3. On the pressure controller, set the desired deposition pressure value on the pressure controller. This is done by pressing the up arrow once and using the knob to change to SETPOINT A to the desired value. Then press the DOWN arrow once to go back to the home screen see Figure On the gas controller, zero out the Argon and/or Oxygen set-points by turning the channel knob to the channel one for Argon and channel two for Oxygen. Then turn the zeroadjustment screw under the appropriate gas Figure 41: Main chamber pressure controller Figure 42: Gas controller showing z-adjustment screw and channel knob positions 18

20 until the output on the display reads zero using a screwdriver see Figure 42. White Hall Sputter Station WARNING: Do not rotate the z-adjustment screw more than ten turns in either direction as the adjustment screw will become disengaged. If the display value fails to increase or decrease while turning the z-adjustment screw, contact a Shared Facilities staff member. 5. On the gas controller, check the Argon and/or Oxygen set-points by turning the channel knob to the channel one for Argon and channel two for Oxygen. Then hold the desired gas toggle switch in the up position as seen in the figure below and change the set-point to the desired set-point value using a screwdriver see Figure 43. If you are going to use a ratio, contact a Shared Research Facilities staff member. Figure 43: Gas controller showing set-point toggle switch and adjustment screw positions WARNING: Do not rotate the set-point adjustment screw more than ten turns in either direction as the adjustment screw will become disengaged. If the display value fails to increase or decrease while turning the set-point adjustment screw, contact a Shared Facilities staff member. 6. Turn on the power to the Auto Matching network and set the tuning toggle switches to AUTO see Figure 44. Figure 44: Auto-matching network 7. Turn on the power of the RF power supply by pressing the white button on the RF power supply. Adjust the FWD power to a value between 30-50W see Figure 45. Figure 45: RF Power Supply power button 19

21 8. Verify that the sample shutter is between the sample and the sputter targets. This is done by using the sample shutter adjustment knob as seen in Figure 46. Figure 46: Sample shutter positioning knob 9. In the Sputter Deposition software, enter the following parameters see Figure 47: Stack - This is for having the software loop the entered sequence. A minimum of 1 is required. Target Shutter - Shutter to be opened Time - The length of time the desired target shutter will be opened. Figure 47: Sputter deposition software screenshot 20

22 10. Turn the filament switch of the main chamber Ion Gauge to the OFF position on the Ion Gauge Controller see Figure 48. The display will show five dashes and the ION button will be off. Figure 48: Main chamber Ion Gauge controller button 11. Move the toggle switch(s) of the Argon and/or Oxygen on the gas controller to the ON position(s) see Figure 49. The display will show the flow value. Figure 49: Gas controller indicating ON/OFF toggle switches of the Argon and Oxygen with Argon gas ON 12. Press SETPOINT A on the Pressure Controller to activate the throttle valve. Allow the pressure to stabilize before proceeding see Figure 50. Figure 50: Pressure controller in operation 13. Once the pressure has stabilized, press the RF ON button on the RF power supply and verify that at a plasma is ignited inside the chamber above the desired target. Verify that the plasma is stable and the RF reflective power is near zero as seen in the readout display of the RF power supply. Allow the target to burn-in to remove any contaminants for at least one minute see Figure 51. Figure 51: RF Power Supply NOTE: Target burn-in times will vary among target materials 14. On the RF power supply slowly ramp the power to the desired setting by pressing the WHITE UP Arrow until the desired setting is reached. 21

23 NOTE: Maximum power settings are material dependent. WARNING: Increasing the power to rapidly or above the recommended material setting can lead to cracking of the target and sever damage to the sputtering gun. 15. Move the substrate shutter counter clockwise prior to starting the process. 16. Press the white arrow icon on the Sputters Station deposition software to open the target shutter and start the deposition. Verify the shutter and open and then close the viewports windows shutters. 17. Record the following parameters in the logbook: Power Voltage Time Gases Used Gas Flow Rates Deposition Pressure Deposition Rate (If this is a calibration samples, measure samples on the XRD or profilometer prior to recording in the logbook.) Total Thickness Deposited (If this is a calibration samples, measure samples on the XRD or profilometer prior to recording in the logbook.) Heater Temperature 18. Once the deposition is complete, the target shutter(s) will close. 19. Manually close the sample shutter. 20. Press the red Rf ON/OFF button on the RF power supply to turn off the plasma and then the white power supply ON/OFF button on the power supply to turn OFF the power supply. 21. Move the toggle switch on the Auto Matching Network to the OFF position. 22

24 22. Move all the toggle switches on the gas controller to the OFF position(s). The gas flow on the readout display should go to zero for each gas. 23. Press the OPEN button on the pressure controller to fully open the throttle valve and pump the chamber back down to base pressure. 24. Press the ION button on the Ion Gauge Controller to power on the main chamber Ion Gauge. Wait for the system to reach base pressure before removing the sample carrier. NOTE: If the heater was used, then begin to ramp down the heater. The sample cannot be removed until the chamber is at 40 C. WARNING: Removing the sample before it has properly cooled, can cause personal injury as was as damage to the system pumping equipment. SAMPLE REMOVAL 1. Close the loadlock turbo gate valve. 2. Open the gate valve between the loadlock and the main chamber by turning the valve clockwise until it stops. 3. With the end of the transfer arm still in the loadlock, rotate the transfer arm defector so that the pins are pointing downwards. Slide the manual transfer arm into the main chamber. Visually check that the sample carrier is centered underneath the propeller style holder on the manipulator. 4. Using the joystick, bring the propeller of the manipulator rod downward so that the sample carrier sits flush onto the transfer arm. The sample may need to be rotated to allow the screw to slide into the cutouts of the substrate holder on the transfer arm. 23

25 5. Push the joystick right (TAKE OUT) to rotate the manipulator rod. This needs to turn approximately ½-inch - ¾-inch to be properly inserted. This can be monitored by watching the movement of the manipulator rod motor on top of the Heater Manipulator Assembly. WARNING: If the manipulator rod turns only ¼ then the sample carrier is not properly attached and it may cause the holder to not be centered on the transfer arm. As a result the sample will not be able to be removed from the tool without venting the main chamber. 6. Next push the joystick, upwards to remove the manipulator rod from the sample carrier. 7. Slide the loading arm and sample carrier slowly out of the main chamber. 8. Close the gate valve between the main chamber and the loadlock by turning the valve counter-clockwise until it stops. 9. Verify that the loadlock turbo gate valve is OPEN by turning the positioning knob counter-clockwise. 10. Turn off the ion gauge filament by pressing the ION button on the loadlock ion gauge controller. 11. Turn off the turbo pump and by pressing the PUMPING UNIT button on the turbo controller. The green PUMPING UNIT light will turn off. 12. Close the roughing pump valve to the turbo pump by turning the valve counterclockwise. 13. Set the timer and allow the turbo pump to spin down for 10 minutes before introducing UHP nitrogen vent gas. WARNING: Venting the loadlock with the turbo pump spinning at full will cause severe damage to the turbo pump as this will force the turbo pump to spin-down rapidly. 24

26 14. After 10 minutes, open the green nitrogen valve on the loadlock by turning the valve counter-clockwise. This will introduce nitrogen into the loadlock and bring the loadlock up to atmospheric pressure. Once the loadlock has reached atmospheric pressure, the hissing of nitrogen gas can be heard escaping around the loadlock lid. Close the green nitrogen valve by turning the valve clockwise. 15. Once vented, open the loadlock lid on top of load lock and swing it backwards. 16. Attach the propeller style sample carrier insertion rod to the back of the sample carrier. Remove the sample carrier from the transfer rod loading arm. 17. Verify that the loading arm is in the proper position with 3 centering pins on the sample arm facing upwards. 18. Using an alpha wipe and IPA, wipe down the o-ring and verify that it is properly seated within the groove of the loadlock lid. WARNING: Failure to check that the o-ring can result in damage to the o-ring during closure. As a result the loadlock will not pump down and the o-ring will need to be replaced. 19. Close the loadlock lid by pulling the loadlock lid forward. 20. Open the loadlock roughing pump valve by manually turning the black valve counterclockwise until it stops moving. 21. Monitor the loadlock vacuum gauge. Once the gauge reaches 50 mtorr, close the loadlock roughing pump valve and open the loadlock turbo gate valve. 22. Monitor the loadlock vacuum gauge. Once the pressure reaches 0 mtorr on vacuum gauge below, turn on the Ion Gauge by pressing the ION button on the loadlock Ion Gauge Controller. The ion gauge on the loadlock will illuminate. Monitor this pressure until the loadlock pressure reaches 5x10-6 Torr. Once this pressure is reached press the ION button on the Ion Gauge Controller to turn OFF the ion gauge. 23. OWN 25

27 TURNING OFF THE SYSTEM 1. Check the following on the system: Heater breaker switch is in the OFF position. Loadlock Ion Gauge filament is OFF. Pressure Controller Valve is set to OPEN. Auto Matching Network controller is OFF. NOTE: This should only be ON if the RF power supply was used. Target power supplies are OFF. On the Gas Channel Controller, the gas toggle switches are set to OFF. Cathode controller filament is ON and the pressure is in the 10-8 range. RGA power is ON 2. If the RF power supply was used, close the water flow meter valve on the water manifold on the back of the tool. 3. Close the gas valves on the gas manifold behind the tool. 4. Clean-up the work area by doing the following: Place all used wipes in the white USED WIPES disposal container located on the Sample Prep table. Place sample carrier and tools back into the proper storage containers. 5. Sign out of the CORES system using the barcode scanner in the entry lab. 6. Upon exit close the following gas bottles in the Entry Lab: UHP Argon: Sputtering process gas. UHP Oxygen: Sputtering process gas. NOTE: Leave the UHP Nitrogen gas valve OPEN as this gas is used for the PLD turbo pump. 26

28 EMERGENCY SHUT-DOWN PROCEDURES If, at any time, the user needs to contact someone for help, call or locate the following staff of the Shared Research Facility (SRF): Primary Staff Contact: Harley Hart (412) (M) (304) (O) Office: White Hall 409 Secondary Staff Contact: Dr. Kolin Brown (304) (304) (O) Office: ESB G75D If no one is available and the instrument is not acting as expected, the user should do the following: Press the STOP button on the process screen. Turn off all sputter gun power supplies. Turn off the heater power supply. Press OPEN on the pressure controller. Turn off all gases gas controller. CLOSE all gas valves on the wall behind the tool. Go into the Sample Prep lab and CLOSE all process gas bottles. Then, if possible, the user should stay by the instrument while trying to contact a Shared Facilities staff member. If it becomes necessary to leave the instrument then the user should leave a large, legible note on the SPUTTER STATION stating: The problem (describe what happened and steps taken) When it occurred (date and time) User name and phone number If it becomes necessary to leave the instrument then the user should leave a large, legible note at the SPUTTER STATION stating the instrument is DOWN. If a dangerous situation is evident (smoke, fire, sparks, etc.), or if the sound of shattering glass is heard emitting from the lamp housing, ONLY if it is safe to do so, the user should turn off system, lamp controller, and vacuum pump or unplug the instrument and leave the cleanroom immediately. The user should notify all other cleanroom persons within the cleanroom to evacuate. The user should then contact proper emergency personnel. The contact numbers can be found posted outside of the cleanroom or on the cover of the instrument log book. 27