nearfield High-Throughput Atomic Force Microscopy for semiconductor metrology applications I N S T R U M E N T S

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Barrie Hopkins
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1 nearfield I N S T R U M E N T S High-Throughput Atomic Force Microscopy for semiconductor metrology applications Roland van Vliet (CEO) roland.vanvliet@nearfieldinstruments.com Tel

Chip Industry keeps Pushing Limits Etch Deposit Pattern Each step requires process control metrology Defect Discovery Pattern Fidelity Total Market 2015: 4.

2 Chip Industry keeps Pushing Limits Etch Deposit Pattern Each step requires process control metrology Defect Discovery Pattern Fidelity Total Market 2015: 4.9 B$ Industry workhorses run into limits Electron Beam metrology Damaging to electron sensitive materials Very limited 3D information Economic necessity Running ahead of commodity market Requires implementation of full 3D structures, novel (soft) materials, even smaller lines (<7 nm) Optical metrology Limited by the diffraction of light (only returns average values at nm scale) Height sensitivity is process dependent Alternative/complementary metrology technology required 2

Atomic Force Microscopy (AFM) AFM could fullfill several of next-node metrology

materials Today, customers scrap 20 M$/month in fab process control More than only

However, current AFM systems Are very slow (extremely low wafer throughput) Have no

3 Atomic Force Microscopy (AFM) AFM could fullfill several of next-node metrology requirements Atomic resolution 3D capability Suitable for fragile/sensitive (soft) materials Today, customers scrap 20 M$/month in fab process control More than only topography measurements: mechanical, electrical, magnetic, thermal, sub-surface However, current AFM systems Are very slow (extremely low wafer throughput) Have no true control of probe-sample interaction Nearfield Instruments introduces: High-Throughput Atomic Force Microscopy 3

Scaling advantage Scale-up path to UHT tool In-line applications viable

4 HT-AFM: Multiple, Parallel Mini-AFMs Measure multiple dies per wafer at the speed of measuring a single die Up to 44 sites in parallel (patented) Modular platform Scaling advantage Scale-up path to UHT tool In-line applications viable Independent operation True die-to-die comparison Simultaneous multiple parameter measurement 4

5 Proof-of-Concept realized Wafer stage Parallel positioning arms Mini AFM Positioning arm Probe exchange unit Parallel AFM 4-arm demonstrator High-speed mini-afm Source: NFI Copyright 2016 Nearfield Instruments B.V.

6 Nearfield Instruments 80,0 60,0 40,0 20,0 0,0-20,0 Cumulative cash position Base case NFI has -40,0 Independent, multiple parallel AFM scan head architecture (10+ patent portfolio) Up to 750x thoughput increase compared to current commercial AFM systems Enables many simultaneous and varied measurements across wafer at industrial throughput NFI will Enter the market as OEM at 7-nm node (2020) in CD and Defect Review metrology sub-markets Grow to 2025 revenue of 415 M$ (15% TAM, differentiated over 9 use cases) NFI is A Seed-funded start-up (TNO spin-off), located in Delft Working together with potential customers (top-tier IDMs) on application development Establishing manufacturing supply chain (outsourced production, final NFI) Raising EUR 11 million in equity to finance alpha-tool development (at launching customer Q2/2018) Looking for experienced, enthusiastic application specialists, system engineers, AFM experimentalists R&D tools Number of tools. Base case. Mass production tools

7 nearfield I N S T R U M E N T S Get closer. roland.vanvliet@nearfieldinstruments.com

March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 5

March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 5 2017 BiTS Workshop Image: tonda / istock Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings