Cleaning Medical Electronics
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1 Cleaning Medical Electronics MIKE BIXENMAN KYZEN CORPORATION MARK NORTHRUP DYNAMIC RESEARCH TESTING LAB DALE LEE PLEXUS CORPORATION 9/18/ , Kyzen Corp. 1
2 Discussion Points 1. Introduction 2. Design for Cleaning 3. Test Vehicles 1. Solder Mask Definition 2. Voltage Effects 3. Frequency Effects 4. Conclusions 9/18/ , Kyzen Corp. 2
3 Medical Electronics The challenge for Medical OEMs is to Design reliable electronic hardware Performs reliably for the patient Implantable devices require Increased functionality Small form factor Fast data transfer 9/18/ , Kyzen Corp. 3
4 Patient Information on Demand Trends lead to Electronic component complexity Require faster signal rates Higher transmission frequencies The concern is that Hardware failures will become more prevalent 9/18/ , Kyzen Corp. 4
5 Reliability Reliability concerns challenge OEMs to Look outside the existing design rules Toward application specific field simulations Better understanding of reliability risks 9/18/ , Kyzen Corp. 5
6 Circuit Board Design Plays a role when cleaning is required Component size / standoff height Solder mask definition Solder paste selection Package placement / density Thermal heat to solder components Static solvating rate Dynamic energy rate 9/18/ , Kyzen Corp. 6
7 Test Vehicles 1. Designed to test removal of soils Z-Axis gap height Density Placement 2. Designed to test electrical effects Voltage effects Frequency effects 9/18/ , Kyzen Corp. 7
8 Clean Test Board 9/18/ , Kyzen Corp. 8
9 Solder Mask Options 9/18/ , Kyzen Corp. 9
10 Miniaturization Continues chip cap 0.4mm x 0.2mm Murata introduces new chip capacitor 0.25mm x 0.125mm 9/18/ , Kyzen Corp. 10
11 Smaller Components Tighter standoff heights Capillary forces pull flux under component 9/18/ , Kyzen Corp. 11
12 Solder Mask Defined Solder mask defined pads Solder mask between pads 9/18/ , Kyzen Corp. 12
13 Non Solder Mask Defined Solder mask removed adjacent pads Solder mask between pads 9/18/ , Kyzen Corp. 13
14 No Solder Mask Solder mask removed adjacent pads No Solder mask between pads 9/18/ , Kyzen Corp. 14
15 SMD 0201 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 15
16 NSMD 0201 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 16
17 No Solder Mask 0201 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 17
18 SMD 0402 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 18
19 NSMD 0402 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 19
20 No Solder Mask 0402 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 20
21 SMD 0805 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 21
22 NSMD 0805 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 22
23 No Solder Mask 0805 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 23
24 SMD 1210 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 24
25 NSMD 1210 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 25
26 No Solder Mask 1210 Chip Caps Before Cleaning 9/18/ , Kyzen Corp. 26
27 SMD (QFN/MLF) Before Cleaning 9/18/ , Kyzen Corp. 27
28 NSMD (QFN / MLF) Before Cleaning 9/18/ , Kyzen Corp. 28
29 No Solder Mask (QFN / MLF) Before Cleaning 9/18/ , Kyzen Corp. 29
30 Solder Mask Defined PBGA Before Cleaning Wide Pitch Narrow Pitch 9/18/ , Kyzen Corp. 30
31 Non Solder Mask Defined PBGA Before Cleaning Wide Pitch Narrow Pitch 9/18/ , Kyzen Corp. 31
32 No Solder Mask (PGBA) Before Cleaning Wide Pitch Narrow Pitch 9/18/ , Kyzen Corp. 32
33 Data Findings 9/18/ , Kyzen Corp. 33
34 Chip Caps Main Effects Plot for % Residue under Chip Caps Component Data Means Component Wash Time (min.) Mean Solder Mask Definition NoSM NSMD SMD 9/18/ , Kyzen Corp. 34
35 Ball Grid Arrays Main Effects Plot for % Residue under BGA Components Data Means Component Wash Time (min.) Mean 0.0 BGA360 PBGA324 PBGA676 Solder Mask Definition NoSM NSMD SMD 9/18/ , Kyzen Corp. 35
36 MLF / QFN Main Effects Plot for % Residue under QFN Component Data Means Component Wash Time (min.) Mean 50 MLF88 Solder Mask Definition NoSM NSMD SMD 9/18/ , Kyzen Corp. 36
37 All Component Types Main Effects Plot for % Residue under Component Data Means 80 Component Wash Time (min.) Mean BGA360 MLF88 PBGA324 PBGA Solder Mask Definition NoSM NSMD SMD 9/18/ , Kyzen Corp. 37
38 Voltage Effects 9/18/ , Kyzen Corp. 38
39 Circuit Designs SMT QFN BGA 9/18/ , Kyzen Corp. 39
40 Test Patterns Donut Cross X 9/18/ , Kyzen Corp. 40
41 Electrical Field Miniaturization Lower contamination levels Less metal is dissolved With less metal ions levels Electrical field drives metallic ion forces The electric field will be higher As distance between conductors reduce Minzari et al., , 9/18/2012 Kyzen Corp.
42 Constant Voltage Rises inversely with conductor spacing Traces as small as 48µm (1.98 mils) At 5V ~ electric field = 2.5V At 0.4V/mil to 1.6 V/mil the occurrence of dendrites increased Bumiler & Hillman (2010) , 9/18/2012 Kyzen Corp.
43 Halogen Ions 25 mil comb spacing Withstand higher levels of contamination >20 µg/in mil comb spacing Levels at 5-20 µg/in 2 problematic 6 mil comb spacing Levels of 0-2 µg/in 2 problematic Bumiler & Hillman (2010) 9/18/ , Kyzen Corp. 43
44 Electrical Field High Voltage Data 9/18/ , Kyzen Corp. 44
45 Frequency 9/18/ , Kyzen Corp. 45
46 Controlled Loss Testing Controlled loss testing involves Dissipation factor (Df) of the PCB material Copper surface roughness Uniformity of the PCB conductor etched features Conductor length and impedance mismatches PCB surface finish, solder mask etc. 9/18/ , Kyzen Corp. 46
47 Insertion Loss The PCB alone involves four components of insertion loss which include Dielectric Conductor Leakage and Radiation 9/18/ , Kyzen Corp. 47
48 Current Cleanliness Testing Protocol IPC TM 650 Method Ion Chromatography 75% IPA / 25% DI water 60 minute extraction period Ineffective for High Frequency Foresite C3 Localized extraction Steam extraction using DI water 3 minute extraction period Limited application Progression of Methods IPC (Global) Foresite C3 (Isolated)? New Method (Tighter isolation) 9/18/ , Kyzen Corp. 48
49 Research in Progress Correlate chemical with electrical effects Correlate Ionics on a test board to failure with different frequency levels 1 GHz 10 GHz 20 GHz 40 GHz Set limits that an engineer can use to predict failure and control a process 9/18/ , Kyzen Corp. 49
50 Test Vehicle Test from 1, 10, 20, 40 Giga Hertz Measure interactions What do we measure Parasitic Capacitance Controlled Impedance Controlled Inductance Frequency Shift Gain or Loss Phase Shift or Change Scattering(S) Parameters 9/18/ , Kyzen Corp. 50
51 Proposed Test Vehicle Structures 9/18/ , Kyzen Corp. 51
52 Loss Data Example 9/18/ , Kyzen Corp. 52
53 Concluding Remarks 9/18/ , Kyzen Corp. 53
54 Circuit Board Design Capillary flux action underfills tight gaps Chip caps and QFN devices Removal of solder mask reduces Flux residue under component Increases gap height Easier to clean BGA components Solder mask defined pads were easier to clean NSMD were slightly more difficult to clean over SMD No Solder Mask increased cleaning difficulty 9/18/ , Kyzen Corp. 54
55 Voltage Tighter pitch devices Increases electrical field Less contamination more problematic Lower levels of contamination critical factor 9/18/ , Kyzen Corp. 55
56 Frequency High Frequency More problematic to failure New test method needed to Quantify ionic contamination with electrical Guideline for engineers to know limits for specific voltage, frequency and currents 9/18/ , Kyzen Corp. 56
57 Thank You
58 Authors Mike Bixenman Chief Technology Office Kyzen Corporation Mark Northrup Director of Advanced Technical Operations Dynamic Research Testing Labs (IEC Electronics) Dale Lee Staff DFX Project Engineer Plexus Corporation 9/18/ , Kyzen Corp. 58
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