PRESENTS. Solder & Oven Profiles Critical Process Variables
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1 PRESENTS ubga s Solder & Oven Profiles Critical Process Variables Phone: Fax: For Information Please Call or palsrvs@palsrvs.com Member of: PUBLISHED BY Pan Pacific Microelectronics Symposium 2002 Proceedings Surface Mount Technology Association 5200 Willson Road, Suite 215 Edina, Minnesota Copyright 2002
2 ubga Overview Typical Application Are A Wide Range Of Personal Communication And Computer Systems Range of Sphere Size =.010 To.020 Range of Pitch =.020 To.031 PCB Pad Sizes 1:1 With Sphere Size Pin Count = 20 to 144
3 Provides High Package Density
4 Requires Limited PCB Real Estate
5 Product Background 16 MB Single Sided Mini-Card.015 To.020 PCB Thickness Ag/Ni/Cu PCB Final Finish PCB Array Size = 1X6 Intel Strata Flash ubga-56 2 ubga s per Module Solder Sphere Size =.012 Pitch =.031 PCB Pad Geometry = 1:1 Stencil Aperture =.014 Square End Use Of Product Is Internet Routers
6 16MB Mini-Card
7 Product Manufacturing History Assembled Using Standard Type III Water-Soluble Solder Paste Fully Automated SMT Mfg. Line 8-zone Convection Oven No AOI Equipment Solder Paste Ht. Measurement Was Not Possible Due To The Limitations Of Measurement System In Plant.
8 Product Yield History 50% to 80% Yield FA Found Refluxing & Reflowing Using Same Oven Profile Repaired 90% Of Failing Modules Further FA Cross-Sectioning Found An Open Developed Two Fold Theory! Oven Profile TAL Adversely Affected Solder Paste Flux! Stencil Aperture Size VS Type III Solder Paste Adversely Affected Screen Print Developed DOE To Validate OPEN PCB Side ubga Side
9 Solder Paste Comparative Analysis of 3 Different OMG Solder Pastes and PPT VS 2 Different Oven Profiles Solder Pastes Selected Based On The Current Mfg. Processes! P3 Solder Paste - Standard Type III Solder Paste! P3A Solder Paste - Same as P3, But With A More Active Flux! P4 Solder Paste - Type IV Finer Grain Solder Paste! PPT - Patented Solid Solder Deposit By MASK TECHNOLOGY
10 Standard Oven Profile Standard Oven Profile Standard Oven Profile (for product with total mass density of 3.5 to 8.5 g/cm 3)
11 Alternate Oven Profile Alternate Oven Profile Alternate Oven Profile (for product with total mass density less than 3.5 g/cm 3)
12 Standard VS Alternate Oven Profile Temperature Differences Zone 6-8 Temperature Differences 400 Temperature in Celcius Zone 6 Zone 7 Zone 8 Standard Alternate Zone Number & Temperature Setting
13 Standard VS Alternate Oven Profile TAL Differences TAL Differences Time in Minutes /Seconds 01: :00.0 Min TAL Max TAL Standard 01: :21.0 Alternate 00: :02.0 Min/Max TAL
14 Standard VS Alternate Oven Profile TAR Differences TAR Differences Time in Minutes /Seconds 01: :00.0 Min TAR Max TAR Standard 00: :54.5 Alternate 00: :20.0 Min/Max TAR
15 DOE Analysis Outline Purpose: Examine theoretical variables thought to be affecting the manufacturing yield of the ubga 16MB Minicard. Three main factors (PCB Type, Solder Paste Type, Oven Profile) will be controlled in order to determine their relative effect upon test yield. I. Experimental Factors A. PCB Type 1. Regular (existing design for screened solder) 2. PPT (existing design with pre-deposited solid solder) B. Solder Paste Type 1. P4 (Type IV finer grain solder) 2. P3 (Type III existing solder) 3. P3Active (Type III existing solder with a more active flux) 4. None (Tacky flux only on PPT PCB s) C. Oven Profiles 1. "Standard Profile"- Existing oven profile. (TAL = 76 to 81 seconds) 2. Alternate Profile - Cooler (3 Zones) oven profile (TAL = 58 to 62 seconds)
16 DOE Matrix s Experiment Matrix Serial Numbering Matrix Solder PROFILE PCB Lot Std Alternate a p4 30 (A1) 30 (A2) reg b p3 30 (B1) 30 (B2) reg c p3active 30 (C1) 30 (C2) reg d tacky flux 30 (D1) 30 (D2) ppt Total Solder PROFILE PCB Lot Std Alternate a p4 a1-a30 a31-a60 reg b p3 b1-b30 b31-b60 reg c p3active c1-c30 c31-c60 reg d tacky flux d1-d30 d31-d60 ppt
17 DOE Procedure Samples Will Be Run By Lot Oven Profile Will Be Checked Using a Calibrated Oven Reflow Analysis System Before Each Run All Samples To Be Built In One Shift, One Line, One Test System. All Sample To Be Tested On Same Day, Same Shift, Same Tester. Samples Pulled From Each Lot And Tested On Router (N=4). Rework Of Samples Performed By Team Members.
18 DOE Data Analysis Record Pass/Fail (attributes) Data Collected From Test, and Confirmed On Internet Routers Record Test Failure Modes (i.e. device ID fails, man ID fails, erase fails, pattern verification fail, etc.) Failed Units Will Be Opened, Inspected, And Data Recorded Record Induced/Handling Damage And Remove From Count Of Failures Chi-Square Analysis Of Pass/Fail Data Variable Data Not Collected - trace or ball resistance, shear strength, etc - Analysis Can Not Be Done With ANOVA.
19 DOE Results NOTE: Lot d Alternative was reduced to 24 due to mishandling of a 6 up array. The 6 pieces were removed from the analysis.
20 Standard Oven Profile Resulted In 35 Modules Failing In Lot a, b, And c Visual Inspection And X-X Ray Determined Repair Process For 32 Of The 35 Modules Would Be Reflux & Reflow 32 Modules Passed Test After Rework Modules a10, b1, and c2 Randomly Selected for Root Cause Analysis Root Cause Analysis Results To Be Presented In Follow-Up Report DOE Std FA Lot Solder Type Std Fail Qty Reworked & Passing Module Selected for Root Cause Analysis Lot a p a 10 Lot b p b 1 Lot c p 3a 10 9 c 2 Lot d PPT 0 0 N/A Total
21 Alternate Oven Profile Resulted In 5 Modules Failing In Lot b, c, And d Visual Inspection And X-X Ray Determined Repair Process For 2 Of The 5 Modules Would Be Reflux & Reflow, And 1 Module Failing In Lot d Needed Missing Component Placed 3 Modules Passed Test After Rework Modules b60, And c60 Randomly Selected For Root Cause Analysis Root Cause Analysis Results To Be Presented In Follow-Up Report DOE Alt FA Lot Solder Type Alt Fail Qty Reworked & Passing Module Selected for Root Cause Analysis Lot a p N/A Lot b p b 60 Lot c p 3a 3 2 c 60 Lot d PPT 1 1 N/A Total
22 Chi(Kigh)-Squared Analysis Non-Parametric Hypothesis Testing Determines Degree Of Confidence In Accepting Or Rejecting A Hypothesis. Determines Confidence Level That Analysis Is Repeatable. Variables Studied! Solder Type! Oven Profile. Subsets Studied! Solder Type VS Pass/Fail! Oven Profile VS Pass/Fail % Chance Of Achieving Same Results Patterns In Data! PPT Will Have Highest Yield! Alternate Profile Will Have Higher Yields Than Standard Profile
23 Summary of DOE Analysis PPT PCB s Resulted In Better Yields Oven Profile Was Not A Significant Factor For PPT PCB s! More room For Variation Within Oven Profile! Wider Process Window Oven profile Was A Significant Factor With Wet Solders Alternate Profile Resulted In Better Yields Than Standard Profile Alternate profile + P4 Solder Paste Resulted In Better Yields Than Alternate profile + P3 Solder Pastes
24 Conclusion Analysis Validated Hypothesis! Solder Paste And Oven Profile Parameters Impact ubga CCA s First Pass Yields Highest Probability Of Achieving 100% Yield Is PPT PCB s + Alternate Oven Profile. Smaller Package Sizes Require Tighter Controls! Solder Paste Printing Parameters! Oven Profile Parameters Solder Paste Printing Process! 2/3 s Of All Mfg. Defects! Most Difficult Processes to Control PPT Will Allow CCA Manufacturers To Realize Dreams Of Zero Defects.
25 P4 & Standard Profile Module A10
26 P4 & Std Profile Module A10 - Long Side
27 P4 & Std Profile Module A10 - Long Side
28 P4 & Std Profile Module A10 - Long Side
29 P4 & Std Profile Module A10 - Long Side
30 P4 & Std Profile Module A10 - Short Side
31 P4 & Std Profile Module A10 - Short Side
32 P4 & Std Profile Module A10 - Short Side
33 P4 & Std Profile Module A10 - Short Side
34 P4 & Std Profile Module A10 - Short Side
35 P3A & Std Profile Module C2
36 P3A & Alt Profile Module C60
37 P3 & Std Profile Post HALT/HASS Testing
38 P3 & Std Profile Post HALT/HASS Testing
39 P3 & Std Profile Post HALT/HASS Testing
40 P3 & Std Profile Post HALT/HASS Testing
41 P3 & Std Profile Post HALT/HASS Testing
42 PPT & Std Profile Post HALT/HASS Testing
43 PPT & Std Profile Post HALT/HASS Testing
44 PPT & Std Profile Post HALT/HASS Testing
45 PPT & Std Profile Post HALT/HASS Testing
46 PPT & Std Profile Post HALT/HASS Testing
47 PPT & Std Profile Post HALT/HASS Testing
48 PPT & Std Profile Post HALT/HASS Testing
49 PPT & Std Profile Post HALT/HASS Testing
50 PPT & Std Profile Post HALT/HASS Testing
51 PPT & Std Profile Post HALT/HASS Testing
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