Materials, Reliability and Process Optimization. Lead Free Soldering. Department of Mechanical Engineering University of Massachusetts, Lowell
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1 Department of Mechanical Engineering University of Massachusetts, Lowell Lead Free Soldering Materials, Reliability and Process Optimization Dr. Sammy Shina May 20, 2002
2 Project Team UMASS Lowell-Industry Lead Free Consortium n Dept. of Mechanical Engineering, University of Massachusetts, Lowell. n L. Harriman, C. Pace, TURI/CEAM n K. Walters, BTU International, North Billerica, MA. n Roberto Pilotto, Hadco Corporation, Ward Hill, MA. n D. Pinsky, Raytheon Corporation, Lexington, MA. n George Wilkish, and Anderson, Richard, Tyco Electronics, MA/COM, Lowell MA n D. Abbott, Texas Instruments, Attleboro, MA. n Richard McCann, Analog devices, Wilmington MA n Indium Solders, Air Products and Aim Solder.
3 Project Team UMASS Lowell-Industry Lead Free Consortium
4 Project Accomplishments 2000 Form the team and plan the project Manufacture Lead Free PWB s with Pb Baseline Perform Visual Tests to determine best Combo Perform Reliability tests to determine Best Combo
5 SnAgCu SnBi SnAg OSP ENIG OSP N Air N Soak Linear Linear Pb OSP Pb ENIG Pull Test Before and After 2000 Thermal Cycles (NiPd ( Lead Finish) Solder PWB Finish Environment TAL Soak Baseline
6 Project Accomplishments n Pb-Free soldering can be performed with zero defects n Sn/Ag/Cu and Sn/Ag, Pb-Free solder joints have equal to or greater strength than Sn/Pb joints after 2000 thermal cycles reliability testing n " This is the most systematic approach to lead free electronics assembly, that I have come across. Work initiated by UMass Lowell team is a positive step towards lead free process optimization." Alan Rae, Director of Technology, Cookson Electronics
7 Project Plan 2002 Form the 2nd phase team and plan the project Welcome Schneider, Tyco Electronics, Analog Devices and Air Products Leverage NEMI research results Lead free solder composition Reflow Temperatures Expand material selection Build on results from 1st phase Consortium Project "Manufacturing environments "Material Selection
8 Project Plan 2002 New Finishes (5 PWB s, BGA Solder balls) New Devices (BGA s) New Manufacturing processes (Nitrogen Conc.) Perform Visual Tests to determine zero defects boundaries for all finishes Perform Reliability to determine any deviations within material or process selection
9 Test Vehicle: ( Lead free components) Phase II 2002 Layout by Tyco Electronics Manufacture by Sanmina with 5 finsihes Components to be supplied by: TI components (NiPdAu finish). Components are daisychained: 3 x QFP 176 and 3 x SOIC 20 MACOM components: 45 mm BGA. Tin and some Tin lead finish as baseline Analog Components, Tin finish, 3 x SOIC caps and resistors each 0603 Palladium from Schneider
10 Test Vehicle: ( Lead free components) Phase II
11 Visual Effect of Nitrogen n n n Air Nitrogen improves uniformity and hence, the reflow process window. Nitrogen reduced the clear flux residue and thus will reduce faults in circuit test. We will experiment with several concentrations of N from Air Products Nitrogen
12 Experimental Matrix - 1 PWB Finish Solder paste Reflow Components.SMOBC/HASL AIM Air Lead Free.SMOBC/HASL AIM Nitrogen Lead Free.SMOBC/HASL Indium Air Lead Free.SMOBC/HASL Indium Nitrogen Lead Free.SMOBC/HASL Loctite Air Lead Free.SMOBC/HASL Loctite Nitrogen Lead Free.SMOBC/HASL Leaded Solder Air Leaded Components.OSP AIM Air Lead Free.OSP AIM Nitrogen Lead Free.OSP Indium Air Lead Free.OSP Indium Nitrogen Lead Free.OSP Loctite Air Lead Free.OSP Loctite Nitrogen Lead Free.OSP Leaded Solder Air Leaded Components.
13 Experimental Matrix- 2 PWB Finish Solder paste Reflow Components ENIG AIM Air Lead Free ENIG AIM Nitrogen Lead Free ENIG Indium Air Lead Free ENIG Indium Nitrogen Lead Free ENIG Leaded Solder Air Leaded Components.ENIG Loctite 20 ppm O2-228 C Lead Free.ENIG Loctite 20 ppm O2-240 C Lead Free.ENIG Loctite 5000 ppm O2-228 C Lead Free.ENIG Loctite 5000 ppm O2-240 C Lead Free.ENIG Loctite Air- 228 C Lead Free.ENIG Loctite Air-240 C Lead Free
14 Experimental Matrix- 3 PWB Finish Solder paste Reflow Components.Matte Sn AIM Air Lead Free Matte Sn AIM Nitrogen Lead Free Matte Sn Indium Air Lead Free.Matte Sn Indium Nitrogen Lead Free.Matte Sn Loctite Air Lead Free Matte Sn Loctite Nitrogen Lead Free Matte Sn Leaded Solder Air Leaded Components AG AIM Air Lead Free.AG AIM Nitrogen Lead Free.AG Indium Air Lead Free.AG Indium Nitrogen Lead Free.AG Loctite Air Lead Free.AG Loctite Nitrogen Lead Free.AG Leaded Solder Air Leaded Components
15 Reliability Test n Predict the failures and life of the Process n Depict real time stresses in a Lab by inducing Thermal stresses and cyclic loading n Selection of Thermal cycle Creep: High ramp rate and dwell time Fatigue: Cyclic loading n Thermal Cycle range selected C n Ramp rate 10 C/min n Dwell time 20 minutes on each peak n Raytheon Reliability Analysis Lab utilized for testing
16 2000 Presentations/Publications n Lead Free Electronics Workshop hosted by Lucent Technologies Merrimack Valley Works, North Andover, MA, April 13, n Lead Free Electronics Workshop, Session, C2, Best Western Royal Plaza and Trade Center, Marlborough, April 25 th n State of Massachusetts Legislative committee on education policy, UMASS President Office, Boston, MA, May 4 th, n IMAPS New England, 27 th annual symposium and exhibition,, Boxborough, May 9 th n CEAM /TURI Colloquy University Research in Sustainable Technologies Program, June 2 nd 2000.
17 2000 Presentations/Publications n 2 nd Workshop on Lead-Free Electronics, Technical Issues and Challenges in the Transition To Lead-Free Technologies,, at BTU North Billerica, MA, June 29, n Design Of Experiments For Lead Free Materials, Surface Finishes And Manufacturing Processes Of Printed Wiring Boards, Karen Waters, SMTA International Conference at Rosemount trade center, Chicago, IL, September 2000 n SMTA paper above translated into Chinese for PRC EE Journal.
18 2001 Presentations/Publications n Selecting Material and Process Parameters for Lead Free SMT Soldering Using Design of Experiments Techniques, Apex Conference, San Diego, CA, 1/ n Reliability Testing Techniques For Lead Free SMT Technology, ETRONIX Conference; Anaheim, CA, March n Above paper translated into Japanese Journal ANBE, SMT, Kanagawa, Japan, July 2001 n SMTA Atlanta Conference Atlanta, GA, April 19 th 2001, n IMAPS New England, 28 th annual symposium and exhibition, Holiday Inn Conference Center, Boxborough, May 8 th n Shina Invited to research summary in the Workshop on Modeling and Data Needs for Lead-Free Solders sponsored by NEMI, NIST, NSF, & TMS, 2/2001, New Orleans, LA
19 2001/2002 Presentations/Publications n Process and Material Selection for zero defects and superior adhesion Lead Free SMT soldering, SMTA International Conference, Chicago, IL., September n Shina, Design Of Experiments, chapter 25 to Environment Friendly Electronics: Lead-Free Technology by J. Hwang, Electrochemical Publications Ltd, November, n. Lead Free UMASS Consortium, conference sponsored by the Strategic Envirotechnology Partnership (STEP), Boston MA, November 2 nd, 2001 n Lead Free Electronics Workshop hosted by Schnieder Electric Wilmington, MA, April 10, n TURA Coordinators Conference, Best Western Royal Plaza and Trade Center, Marlborough, April 23 th 2002.
Lead Free Reliability Team Status. John Sohn Lucent Technologies - Bell Labs Reliability Team Leader January 17, 2001
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