REPORT, RE0813, MIL, ENV, 810G, TEMP, IN HOUSE, , PASS

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1 REPORT, RE0813, MIL, ENV, 810G, TEMP, IN HOUSE, TST REV. A Crystal Group Inc 850 Kacena Rd., Hiawatha, IA Phone: Fax: /23/2014

2 Revision History REV Date Approved Description ECN A 09/23/2014 A.McCarville Initial release The contents of this document are proprietary to Crystal Group, Inc. Unauthorized distribution or disclosure is prohibited. 1 of 7

3 Contents Purpose... 3 Test Description... 3 System Configuration... 3 Test Results... 3 Test Results Summary... 4 Test Equipment Photos... 6 Figures Figure 1: RE0813 front I/O Figure 2: RE0813 rear I/O. Note: The I/O plate is covering two of the network ports as shown Tables Table 1: Equipment under test performance results of 7

4 Crystal Group In House Thermal Testing for RE0813 Purpose This document has been created to provide an overview of the test results for the RE0813 that Crystal Group completed in house thermal testing on. Test Description The test sample was placed in the Thermotron Industries Model S 16 (Serial # 698/15317RF). Supplementary equipment necessary to operate and/or monitor the test sample (e.g., computer monitor, keyboard, and mouse) was placed on a table nearby the environmental test chamber and connected to the test sample. Refer to MIL STD 810G for recommended ramp rates. System Configuration CPU MODEL: MBS 00044: MB, BGA1023, MINI-ITX, I7-3555LE, 4 LAN1000, VGA, 1 PCI-E X16, IPMI, 4 SATA2, 2 SATA3, SUPERMICRO, MBD-X9SPV-LN4F-3LE TJ Max: 105 C GPU MODEL: N/A RAM SIZE/QTY: MEM 00049: DDR3 SO DIMM, 8GB, 204 PIN, PC , 1600MHZ, ECC, NON REG, APPROVED MEMORY AMC8GB/64807, QTY: 2 HARD DRIVE MODEL/SIZE: HDD 00120: SSD, SATA, 480GB, 2.5 IN, MLC, AES-256, MICRON M500 Test Results Refer to Table 1 for detailed data. Operating EUT DID NOT experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) or operational issues observed during the performance of the Operating Temperature or upon the completion of the Operating Temperature Test. EUT DID experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) or operational issues observed during the performance of the Operating Temperature or upon the completion of the Operating Temperature Test. 3 of 7

5 Note: Non Operating tests were not performed. Non Operating EUT DID NOT experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) prior to the performance of the Non Operating Temperature or upon the completion of the Operating Temperature Test. EUT DID experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) prior to the performance of the Non Operating Temperature or upon the completion of the Operating Temperature Test. Why did the system fail? What didn t work? The system remained operational during all tests. Pass Criteria is as follows: Unit performs without thermal throttling or degradation of performance due to temperature extremes. Video integrity maintained throughout testing profile. EUT remains fully operable throughout test profile. Failure Criteria is as follow: Unit does not perform without thermal throttling or degradation of performance due to temperature extremes. Video integrity is not maintained throughout testing profile. EUT does not remain fully operable throughout testing profile. Test Results Summary Thermal Testing EUT MODEL #: RE0813 EUT SERIAL #: PASS/FAIL: PASS Storage Temp Results Hot Temp: N/A Cold Temp: N/A Pass/Fail: Not tested Pass/Fail: Not tested Summary: 4 of 7

6 Test 1: For hot testing, the unit under test (UUT) was placed inside of the Thermotron and chamber temperature was brought up to +55 C. Once the chamber reached +55 C the UUT soaked at that temperature for 30 minutes. Next, the UUT was powered on. The UUT was fully operational at +55 C. Prime95, Core Temp and FurMark applications were started. The UUT was stress tested for 30 minutes at +55 C. The clock speed was adequate so the temperature was not lowered to achieve maximum clock speed. UUT throttling did not occur during the +55 C test. See Table 1 for details. Test 2: For hot testing, the unit under test (UUT) was placed inside of the Thermotron and chamber temperature was brought up to +65 C. Once the chamber reached +65 C the UUT soaked at that temperature for 30 minutes. Next, the UUT was powered on. The UUT was fully operational at +65 C. Prime95, Core Temp and FurMark applications were started. The UUT was stress tested for 30 minutes at +65 C. The clock speed was adequate so the temperature was not lowered to achieve maximum clock speed. UUT throttling did not occur during the +65 C test. See Table 1 for details. Additional Notes: Result data was captured for the UUT during the +65 C stress test at 30 minutes, and at 1 hour and 40 minutes. See Table 1 for details. The RE0813 was tested while using the following constants: All PWM functions were disabled. Operating system used was Windows 7 SP1 x64. Additional software used was: Prime95, Core Temp and FurMark. 5 of 7

7 Test Equipment Photos Figure 1: RE0813 front I/O. Figure 2: RE0813 rear I/O. Note: The I/O plate is covering two of the network ports as shown. 6 of 7

8 Thermal Testing DATE: PRODUCT: RE0813 CPU # STRESS TEST DURATION CHAMBER TEMP CURRENT (A) VOLTAGE (V) CPU USAGE (%) RAID CARD TEMP DISTANCE TO TJMAX FULLY OPERABLE? 0 30 minutes 55 C N/A N/A 100 N/A 18 C 15 C N/A N/A N/A N/A N/A N/A N/A N/A Y N 0 30 minutes 65 C N/A N/A 100 N/A 8 C 6 C N/A N/A N/A N/A N/A N/A N/A N/A Y N 0 1 hour 40 N/A 65 C N/A N/A C 6 C N/A N/A N/A N/A N/A N/A N/A N/A minutes Y N Table 1: Equipment under test performance results. 7 of 7

P500/700/900 Part Number. P510/710/910 Part Number N/A N/A SBB0K65455 N/A N/A N/A SBB0K65456 N/A N/A N/A SBB0K65457 N/A N/A N/A SBB0K65521 N/A

P500/700/900 Part Number. P510/710/910 Part Number N/A N/A SBB0K65455 N/A N/A N/A SBB0K65456 N/A N/A N/A SBB0K65457 N/A N/A N/A SBB0K65521 N/A PDF Version: 2.0, April 6, 2016 MAINSTREAM SYSTEMS SBB P410 Part Number P500/700/900 Part Number P510/710/910 Part Number Option Part Number P410 P500 P510 Processors Xeon E5 2600 s Broadwell Intel Xeon