Lam Rainbow and TCP Product Status Checklist. System Type: Poly Etcher System Model: 4420 D.O.M.:
|
|
|
- Antony Allen
- 5 years ago
- Views:
Transcription
1 System Type: Poly Etcher System Model: 4420 D.O.M.: Serial number: 3943 CTC Number: 1150 Machine Hours: ~29, System Control Software: Classic Envision 2. System Control Software Rev: Envision 1.5 Other 3. System Control Software Rev: Classic Rev H Rev G Other 4. Remote User Interface Yes No 5. CPU EPROM Rev: Rev H Rev G Other 6. System Mount Type: Ballroom Bulkhead a. Tunnel Covers? b. Wall mounting frame? 7. EMO: EMO w/keys Twist-loc Momentary EMO Guards 8. Send Indexer Type: Open Cassette SMIF 9. Send Indexer Model: 38AHine 48RA Hine INX 2200 Asyst SMIF 10. Send Indexer General/Cosmetics Condition: Good Fair Poor 11. Load Station Type: Belt Driven Screw Driven 12. Load Station Shuttle Spatula: Standard SMIF 13. Load Station General/Cosmetics Condition: Good Fair Poor 14. Entrance Loadlock Wafer Holder: Entrance Loadlock Wafer Holder Type: Tight Pocket Non-Tight Pocket 16. Entrance Loadlock Arm Housing: Good Fair Poor 17. Entrance Loadlock Inner/Outer Gates: Good Fair Poor 18. Entrance Loadlock Cover: Good Fair Poor 19. Entrance Loadlock Housing/Body General/Cosmetics Condition: Good Fair Poor 20. Upper Chamber Gap Type: Fix Gap Variable Gap 8/19/05 Page 1 Rev A
2 21. Upper Chamber Fix Gap Type: 3 CM 6 CM 9 CM 22. Upper Chamber Gap Drive/Cosmetics Condition: Good Fair Poor 23. Upper Chamber Match Type: T-Match Mini-Match Good Fair Poor 24. Upper Match Coil Type: 6 8 TCP Coil 25. Upper/Lower RF Power Tuning Mechanism: Dip PCB LoFAT Manual Tune Box 26. RF Power Tuning Mechanism Condition: Good Fair Poor 27. Upper Chamber Electrode Type: Silicon Aluminum Other None 28. Upper Chamber Electrode Type: Ceramic TCP Window Quartz Window 29. Upper Chamber General/Cosmetics Condition: Good Fair Poor 30. Upper Chamber Match Enclosure/Cosmetics Condition: Good Fair Poor 31. Upper Mid Chamber General/Cosmetics Condition: Good Fair Poor 32. Lower Chamber Electrode: Lower Chamber Electrode Type: ESC NON-ESC 34. Lower Chamber Wafer Clamp : BAC TAC Non-clamped 35. Lower Chamber Endpoint: Single 405/520 Channels Dual / Channels 36. Lower Chamber Monochromators: Single Dual Triple 37. Endpoint Window: Heated Non-heated 38. Lower Chamber RGA Port? Yes No 39. Lower Chamber General/Cosmetics Condition: Good Fair Poor 8/19/05 Page 2 Rev A
3 40. Lower Mini Match: VCI Relay NON RELAY Good Fair Poor 41. Lower 4 pin Lifter Type: Bellows Non-Bellows 42. Lower Match Encl General/Cosmetics Condition: Good Fair Poor 43. Chamber Manifolding: Standard Low Pressure 44. Chamber Isolation: HPS Valve Vat Gate Valve 45. Chamber Pressure Control: AC-2 Vat Gate Valve 46. Chamber Onboard pump: Non-Turbo Turbo 47. Chamber Onboard pump Type: Alcatel Seiko-Seiki Other 48. Chamber Onboard pump Size: 200L 1K 1.3K 1.6K 2.2K Other 49. Chamber Onboard pump Controller: 50. Manometers: (Make/Model/Torr) a. Chamber Millipore/CMHT-11S02/10 Torr b. Reference Tylan General/CMHT-11S02/10 Torr c. Backside He Millipore/CMLA-21/100 Torr 51. Exit Loadlock Wafer Holder: Exit Loadlock Arm Housing: Good Fair Poor 53. Exit Loadlock Inner/Outer Gates: Good Fair Poor 8/19/05 Page 3 Rev A
4 54. Exit Loadlock Cover: Good Fair Poor 55. Exit Loadlock Housing/Body General/Cosmetics Condition: Good Fair Poor 56. Receive Indexer Type: Hine SMIF 57. Receive Indexer Model: 38AHine 48RA Hine INX 2200 Asyst SMIF 58. Receive Indexer General/Cosmetics Condition: Good Fair Poor 59. Onboard Envision Computer: 133Mhz 400Mhz 600Mhz Good Fair Poor 60. CRT Enclosure General/Cosmetics Condition: Good Fair Poor 61. Light Tower: 2 light 3 light 4 light 62. Gas Box Configuration: 6-Gas Option 8-Gas Option 63. Gas Box MFC Type: Unit/Celerity Tylan Other STEC 64. Gas Extension Box: STD Other 65. Gas Panel Exhaust: Bottom Rear 66. Gas Weldment Polish: STD [5Ra] Ultra Pure [10Ra] a. STD part #s start with 100 and 10Ra with Gas Box Pressure Sensors: None Transducers Gauge 68. MFC 1 Configuration Gas/Range: Cl2 300sccm Good Fair Poor 69. MFC 2 Configuration Gas/Range: HBr 200sccm Good Fair Poor 70. MFC 3 Configuration Gas/Range: O2 200sccm Good Fair Poor 71. MFC 4 Configuration Gas/Range: C2F6 200sccm Good Fair Poor 72. MFC 5 Configuration Gas/Range: He 500sccm Good Fair Poor 73. MFC 6 Configuration Gas/Range: SF6 200sccm Good Fair Poor 74. MFC 7 Configuration Gas/Range: Unused Good Fair Poor 75. MFC 8 Configuration Gas/Range: Unused Good Fair Poor 76. Helium UPC Configuration Gas/Range: He 50sccm Good Fair Poor 77. Gas Panel General/Cosmetics Condition: Good Fair Poor 78. AC Power Inlet Type: AC Input Box Vertical Rack 79. AC Input/Vertical Rack General/Cosmetics Condition: Good Fair Poor 8/19/05 Page 4 Rev A
5 80. AC/DC Power Box Type: Trip Breakers Fuses Good Fair Poor 81. System RF Power Frequency: 13.5Mhz 460Khz Good Fair Poor 82. System RF Delivery Power Type: Onboard RF Cart Good Fair Poor 83. RF Power Range: 650W 1250W 2200W Good Fair Poor 84. First RF Generator Make: AE ENI Other Functional? 85. First RF Generator Model: RFDS 86. First RF Generator(s) Location: On-board Cart Other 87. Second RF Generator Make: AE ENI Other Functional? 88. Second RF Generator Model: 89. Second RF Generator(s) Location: On-board Cart Other 90. Third RF Generator Make: AE ENI Other Functional? 91. Third RF Generator Model: 92. Third RF Generator(s) Location: On-board Cart Other 8/19/05 Page 5 Rev A
6 93. RF Cart General/Cosmetics Condition: Good Fair Poor 94. TCU Chiller Vendor: Lam M&W Other 95. TCO Chiller Model: 96. TCU Chiller Type: Dual Channel Single Channel 97. TCU Chiller General/Cosmetics Condition: Good Fair Poor a. Functional 98. System Level Frame General/Cosmetics Condition: Excellent Good Fair Poor 99. System Level Skins General/Cosmetics Condition: Excellent Good Fair Poor 100. Off-board Chamber Vacuum Pump Manufacturer: Edwards Ebara Alcatel Other 101. Off-board Chamber Vacuum Pump Model: 102. Off-board Loadlock Vacuum Pump Manufacturer: Edwards Ebara Alcatel Other 103. Off-board Loadlock Vacuum Pump Model: 104. PC Boards: Classic Card Cage PC Boards Assy., PCB, CPU6,68010 Present Missing Assy., PCB, SASI(Mod.) Present Missing Assy, PCB, ADIO-AO 3 (9600 only) Present Missing Assy., PCB, SRAM, 512 Present Missing Assy., PCB, ADIO-AO 5 Present Missing Assy., PCB, ADIO-AO 7 Present Missing Assy., PCB, ADIO-AO 9 Present Missing Assy., PCB, ADIO-AO 11 Present Missing Assy., PCB, ADIO-AO 13 Present Missing C PCB SERIAL I/O-2 Present Missing 8/19/05 Page 6 Rev A
7 Envision Card Cage PC Boards Assy, PCB, CPU,68030 Present Missing Assy, PCB, ADIO-AO 3 (9600 only) Present Missing Assy, PCB, ADIO-AO 5 Present Missing Assy, PCB, ADIO-AO 7 Present Missing Assy, PCB, ADIO-B (8) Present Missing Assy, PCB, ADIO-AO 9 Present Missing Assy, PCB, ADIO-AO 11 Present Missing Assy, PCB, ADIO-AO 13 Present Missing PCB SERIAL I/O-2 Present Missing Assy., PCB, VME ETHERNET ADRS Present Missing Stepper Motor Drive Cage PCB, Stepper Motor Driver, CHP (7x) Present Missing 105. Other Comments: external chamber RGA port, loadloack vent lines disconnected, missing lower match and cover, missing gap drive encoder 8/19/05 Page 7 Rev A
http://www.globalfoundriesusedequipment.com/iinfo.cfm?itemno=178359 Promos Tool ID EE-EWE-06 Serial No 409611 Model AMAT Maker DPS II Metal W Location EA-04-100 Main Body (Front) Main Body (Side) Main
Chapter 2 General description of the system
Chapter 2 General description of the system This system is a high density plasma etching system having a C to C load-lock system and an ISM (Inductive Super Magnetron) plasma source. The system consists
Unaxis ICP/RIE SOP Revision 8 09/30/16 Page 1 of 5. NRF Unaxis ICP/RIE Etch SOP
Page 1 of 5 NRF Unaxis ICP/RIE Etch SOP Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, Al, dielectrics and other commonly used materials.
Indian Institute of Technology Kanpur Samtel Centre for Display Technologies
Fax: + 91-0512-2596620 Phones: + 91-0512-2596622,6088 Indian Institute of Technology Kanpur Samtel Centre for Display Technologies Enquiry number: SCDT/FlexE/2016-17/02 Date:05/05/2016 Sealed Quotations
Edge Isolation Tool. Standard Operating Procedure. Version 1.1. Date: Prepared by, Sandeep S S. Department of Electrical Engineering
Edge Isolation Tool Standard Operating Procedure Version 1.1 Date: 20-9-2012 Prepared by, Sandeep S S Department of Electrical Engineering IIT Bombay This document is meant for internal circulation only
Standard Operating Manual
Standard Operating Manual Oxford Plasmalab 80 Plus Plasma Etcher Page 1 of 24 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Available Etching Materials 2.3 Performance
Nanofabrication Facility: ECR Etcher SOP Rev. 01b, March 06. Standard Operating Procedure for PlasmaQuest ECR II Etching
Standard Operating Procedure for PlasmaQuest ECR II Etching Authors: Rev. 00: Al Schmalz, Vighen Pacradouni and Jeff Young, December 21, 1998 Rev. 01: Dr. Andras G. Pattantyus-Abraham, May 24, 2005 Rev.
Standard Operating Manual
Standard Operating Manual ARC12M Sputter Copyright 11.2015 by Hong Kong University of Science & Technology. All rights reserved. Page 1 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness
AMAT Centura PVD System Config
System with 2 Al PVD Chambers Vintage: mid 1990 s Originally built by AMAT USA Refurbished in 2011 Set up for 200mm substrates De-installed and crated in USA Complete working system Re-install services
NORDSON MARCH PX-1000 PLASMA ASHER STANDARD OPERATING PROCEDURE Version: 1.0 July 2016
NORDSON MARCH PX-1000 PLASMA ASHER STANDARD OPERATING PROCEDURE Version: 1.0 July 2016 UNIVERSITY OF TEXAS AT ARLINGTON Nanotechnology Research Center TABLE OF CONTENTS 1. Introduction..3 1.1 Scope of
Process: Chlorine etch. Item Qty Description Price/Unit Total
To: University of Colorado Issued: November 25, 2015 Dept. of ECEE Expiry date: February 23, 2016 Boulder CO 80309-0425 Sales Contact: Paul Sadlek Attn: USA Won Park Phone: 303-735-3601 Project: Apex SLR
Operating Procedures for the. SAMCO ICP RIE System
Operating Procedures for the SAMCO ICP RIE System General Overview: The purpose of the SAMCO Model 200iP Inductively Coupled Plasma Reactive Ion Etcher (ICP RIE) is to etch III-V compound semiconductors
Notes-PECVD: Chamber 1
plasmatherm (EML) STANDARD OPERATING PROCEDURE CORAL Name: Plasmatherm Model Shuttlelock System VII SLR-770/734 Number: Location: EML What it Deposits the following films via Plasma-Enhanced Chemical Vapor
STS PECVD Instructions
STS PECVD Instructions I. Introduction A PECVD (Plasma Enhanced Chemical Vapor Deposition) reacts gases in a RF- (Radio Frequency) - induced plasma to deposit materials such as SiO 2 and Si X N Y. This
STS DRIE User SOP Location: NRF Cleanroon, Dry Etch Bay
Page 1 of 20 STS DRIE User SOP Location: NRF Cleanroon, Dry Etch Bay Page 2 of 20 STS DRIE SOP The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect
JETFIRST 150 RTA SYSTEM OPERATING MANUAL Version: 2 Feb 2012
JETFIRST 150 RTA SYSTEM OPERATING MANUAL Version: 2 Feb 2012 UNIVERSITY OF TEXAS AT ARLINGTON Nanofabrication Research and Teaching Facility TABLE OF CONTENTS 1. Introduction....2 1.1 Scope of Work.....2
Plasma Cleaner. Yamato Scientific America. Contents. Innovating Science for Over 125 Years. Gas Plasma Dry Cleaner PDC200/210/510 PDC610G.
Yamato Scientific America Innovating Science for Over 125 Years Plasma Cleaner Contents Gas Plasma Dry Cleaner PDC200/210/510 PDC610G Gas Plasma Reactor 145 146 147 149 144 Gas Plasma Dry Cleaner Plasma
Certification Exhibit FCC ID: R7PIWRS4. FCC Rule Part: ACS Report Number: W03.11.A
Certification Exhibit FCC ID: R7PIWRS4 FCC Rule Part: 15.247 ACS Report Number: 09-0412.W03.11.A Manufacturer: Cellnet Technology Inc. Model: Gridstream DCIWR Manual 5015 B.U. Bowman Drive Buford, GA 30518
Arizona State University Center for Solid State Electronic Research. Table of Contents. Issue: C Title: Oxford Plasmalab 80plus (Floey) Page 1 of 8
Title: Oxford Plasmalab 80plus (Floey) Page 1 of 8 Table of Contents 1.0 Purpose/Scope... 2 2.0 Reference Documents... 2 3.0 Equipment/Supplies/Material... 2 4.0 Safety... 2 5.0 Set Up Procedures... 2
R I T. Title: STS ASE Semiconductor & Microsystems Fabrication Laboratory Revision: Original Rev Date: 01/21/ SCOPE 2 REFERENCE DOCUMENTS
Approved by: Process Engineer / / / / Equipment Engineer 1 SCOPE The purpose of this document is to detail the use of the STS ASE. All users are expected to have read and understood this document. It is
Residual Gas Analysis Systems for Industry
HIDEN RC SYSTEMS QUADRUPOLE MASS SPECTROMETERS FOR RGA, GAS ANALYSIS AND PROCESS MONITORING The HAL RC systems are designed for RGA, gas analysis and process monitoring applications including leak detection,
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) SOP OXFORD PLASMALAB SYSTEM 100
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) SOP OXFORD PLASMALAB SYSTEM 100 June 2013 Interface Overview. The Oxford software is divided into 5 main screens. 1) Pump Control page 2) Recipe page 3)
The HumiSys. RH Generator. Operation. Applications. Designed, built, and supported by InstruQuest Inc.
The HumiSys RH Generator Designed, built, and supported by InstruQuest Inc. Versatile Relative Humidity Generation and Multi-Sensor System The new HumiSys with single or dual RH probes capabilities is
HumiSys HF High Flow RH Generator
HumiSys HF High Flow RH Generator Designed, built, and supported by InstruQuest Inc. Versatile Relative Humidity Generation and Multi-Sensor System The HumiSys HF is a high flow version of the previously
Xactix Xenon Difluoride Etcher
Xactix Xenon Difluoride Etcher 1 Introduction This tool is a Xactix e1 series XeF2 (Xenon Difluoride) based vapor phase etch system for isotropic and selective silicon etching. The XeF2 reaction with silicon
Aquavar SOLO 2 Frequently Asked Questions
Aquavar SOLO 2 Frequently Asked Questions How do I size the Aquavar SOLO 2 for the appropriate pump/motor combination? Can I use a 208 Volt motor? Can I run the Aquavar SOLO 2 up to 80HZ? What are the
Marc McMullen. Physics Detector Support Group
Marc McMullen Physics Detector Support Group Hall B Gaseous Detectors 1. Drift Chamber (DC) 2. Low Threshold Cherenkov Counter (LTCC) 3. High Threshold Cherenkov Counter (HTCC) 4. Silicon Vertex Tracker
1)! DO NOT PROCEED BEYOND THIS MARK
Operating Instructions for X-ray Photoelectron Spectrometer: Physical Electronics Model 555 XPS/AES (John H. Thomas, III, Ph.D., Electron Spectroscopy) Sample Insertion: figure 1. Sample insertion rod
INSTRUCTION MANUAL. FLOW CONTROL DRAWERS MANUAL / PLC CONTROL SERIES Model Version Perma Pure LLC Tel:
PERMA PURE INSTRUCTION MANUAL FLOW CONTROL DRAWERS MANUAL / PLC CONTROL SERIES Model 3300 Version 4.06 Perma Pure LLC Tel: 732-244-0010 P.O. Box 2105, 8 Executive Drive Tel: 800-337-3762 (toll free US)
Long term stability tests of INO RPC prototypes
Long term stability tests of INO RPC prototypes While the problem of sudden aging in the glass RPC prototypes is being investigated, a few RPCs of dimension 40 cm 30 cm were fabricated, using glass procured
NNCI ETCH WORKSHOP SI DRIE IN PLASMATHERM DEEP SILICON ETCHER. Usha Raghuram Stanford Nanofabrication Facility Stanford, CA May 25, 2016
NNCI ETCH WORKSHOP SI DRIE IN PLASMATHERM DEEP SILICON ETCHER Usha Raghuram Stanford Nanofabrication Facility Stanford, CA May 25, 2016 PLASMATHERM DEEP SI ETCHER PROCESS PARAMETERS Process Parameters/
Pressure Automated Calibration Equipment
GE Measurement & control Pressure Automated Calibration Equipment Safety Instructions and User Guide - K0447 PACE5000 PACE6000 K0447 Issue No. 9 1 10 1 PACE5000 1 2 3 4 5 PACE6000 2 6 7 8 3 4 5 6 7 8 9
MCQ Gas Blender 100 Series 3 Channels Gas Mixer
Channels Gas Mixer Revision 1.8 October 2016 High Performance Digital Gas flow Gas Dilutor Blender & Gas for Mixing flow Mixing Gases System and Calibration Routines Technical Data Sheet Lab in a box From
Leaks, contamination and closed loop control how RGAs make coating processes more profitable
Leaks, contamination and closed loop control how RGAs make coating processes more profitable Backup: What s an RGA Residual Gas Analyzer An instrument that is measuring the gas composition in a chamber
SHMS. Downstream Beamline. Large SHMS/HMS Angles (Config-1) Large SHMS / Min HMS Angle (Config-2) Dan Young Ext /26/2015 1
SHMS Dan Young Ext 5255 Downstream Beamline Large SHMS/HMS Angles (Config-1) Large SHMS / Min HMS Angle (Config-2) 1/26/2015 1 10 14.5 SHMS Beam Line Large SHMS/HMS Angles (Configuration-1) SHMS minimum
University of MN, Minnesota Nano Center Standard Operating Procedure
Equipment name: STS Etcher Badger name: STS Revision number: 3 Model: 320 Revisionist: Paul Kimani Location: Bay 3 Date: 1 October 2013 A. Description The 320 is a manually loaded batch plasma etching
Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology Issue 01_0D / December 2014 / www.oxford-instruments.com 2014. Oxford Instruments Plasma Technology. All rights reserved. Contents Section Page About this data sheet...
Angstrom Dielectric Sputterer Operation Manual
Angstrom Dielectric Sputterer Operation Manual I. System overview The Angstrom Dielectric Sputterer (ADS) has a similar interface as the Angstrom metal sputterer. It has two screens, the process screen
Oerlikon Sputtering Evaporator SOP
Oerlikon Sputtering Evaporator SOP Short UNT Cleanroom 1. Taking out sample holder from Transport Chamber : Log in FOM to access the software Go to the software and log in with user1 and password user1
High Performance Mass Spectrometers
High Performance Mass Spectrometers For Vacuum and Semiconductor Process Monitoring Detailed product information / introduction MOCVD semiconductor processing Applications: XXCVD/MOCVD XXPECVD XXALD XXSputtering
March Asher Operation
March Asher Operation Roger Robbins 7/31/2006 The University of Texas at Dallas Erik Jonsson Engineering School of Engineering TITLE: March Asher Operation Page 1 of 13 March Asher Operation Roger Robbins
Standard Operating Procedure. For. PVD E-Beam
P a g e 1 Standard Operating Procedure For PVD E-Beam P a g e 2 Introduction The PVD Electron-Beam Evaporator (E-Beam) thin film deposition machine uses a magnetically guided and collimated stream of electrons
Digital Vacuum Regulator
Temperature Control for Research and Industry Digital Vacuum Regulator User s Manual Model DVR-280 INDEX SECTION PAGE 1. QUICK OPERATING INSTRUCTIONS............................. 3 KEM-NET DATA LOGGING
PRad Target. Chris Keith JLab Target Group
PRad Target Chris Keith JLab Target Group Target Overview & Components Target Software Hazard Analysis and Mitigation Target Status, Performance& Remaining Work Installation Schedule Nov. 12, 2015 PRad
The Standard of Excellence in Safety, Quality, and Performance
A Division of APPLIED ENERGY SYSTEMS, INC. The Standard of Excellence in Safety, Quality, and Performance CENTURION SOURCE SYSTEMS CENTURION CONTROLS Centurion source systems are the latest offering from
Approved by Principal Investigator Date: Approved by Super User: Date:
Approved by Principal Investigator Date: Approved by Super User: Date: Standard Operating Procedure BNC Commonwealth Dual Ion Beam Deposition System (CDIBS) Version 2010 February 14 I. Purpose This Standard
Drift-Chamber Gas System Controls Development for the CEBAF Large Acceptance Spectrometer
Drift-Chamber Gas System Controls Development for the CEBAF Large Acceptance Spectrometer M. F. Vineyard, T. J. Carroll, and M. N. Lack Department of Physics University of Richmond, VA 23173 ABSTRACT The
Trion PECVD SOP IMPORTANT: NO PLASTIC, TAPE, RESISTS, OR THERMAL PASTE ARE ALLOWED IN THE CHAMBER
Trion PECVD SOP IMPORTANT: NO PLASTIC, TAPE, RESISTS, OR THERMAL PASTE ARE ALLOWED IN THE CHAMBER CAUTION: THE CHAMBER PLATE GETS EXTREMELY HOT Start Up Procedure 1) Open bottle and regulator for Helium,
MANUAL FOR SPTS APS (DIELECTRICS ETCHER)
MANUAL FOR SPTS APS (DIELECTRICS ETCHER) To be read first: SPTS APS is an etcher dedicated to dielectrics (SiO 2, Si 3 N 4, glass types...). Dielectrics etching in AMS200 is no more CMi standard. AMS200
Slit Valve. XGT Series. Low particle generation. With end lock mechanism. Service life of two million cycles. XLA XL XL Q D- XSA XVD XGT CYV
Slit Valve Series For 00 mm wafer Low particle generation L motion With end lock mechanism Can be held open/close of the gate when emergency stop. Service life of two million cycles. With SMC's life conditions.
PRINTED: 3/29/2016 1:46:12 PM - THIS DOCUMENTATION IS OBSOLETE AFTER: 3/30/2016 1:46 PM
1181377 Rev H.2016.03.14 Force G Parts Book Page 1 of 7 Top End INTED: 3/29/2016 1:46:12 PM - THIS DOCUMENTATION IS OBSOLETE AFTER: 3/30/2016 1:46 PM INTED: 3/29/2016 1:46:12 PM - THIS DOCUMENTATION IS
OXFORD PLASMALAB 80PLUS (CLOEY)
Arizona State University NanoFab OXFORD PLASMALAB 80PLUS (CLOEY) Rev D Table of Contents Contents Table of Contents...1 1. Purpose / Scope...2 2. Reference Documents...2 3. Equipment / Supplies / Material...2
Standard Operating Manual
Standard Operating Manual Branson IPC 3000 O 2 Asher Page 1 of 14 Contents 1 Picture and Location 2 Process Capabilities 2.1 Cleanliness Standard 2.2 Recipes 2.3 Performance of Branson IPC 3000 O 2 Asher
University of Minnesota, MN Nano Center Standard Operating Procedure
Equipment Name: HDPCVD Revision Number: 2 Badger Name: HDPCVD Revisionist: L. von Dissen Model: Advanced Vacuum Date: 10/25/2016 Apex SLR ICP Location: PAN, Bay 3 1 Description The Apex SLR ICP is a high
Plasma-Therm PECVD. Operating Characteristics. Operating Instructions. Typical Processes. I. Loading. II. Operating
Plasma-Therm PECVD A PECVD (plasma enhanced chemical vapor deposition) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD
त जप र व श व द य लय / TEZPUR UNIVERSITY क ल सध क क य लय/ OFFICE OF THE REGISTRAR SHORT QUOTATION NOTICE
SHORT QUOTATION NOTICE TU/11-24/Pur/Qtn/2013/ 3180 dated:- 15/10/2013. Sealed quotations are invited from reputed manufacturers/authorized dealers/vendors for supply & installation of Laboratory Equipment
Parts Manual STRIKER Striker 2840 Parts List - PN Printed in USA 03/18/08
Parts Manual STRIKER 2840 Striker 2840 Parts List - PN 238155 - Printed in USA 03/18/08 Standard Parts Recommended General Wear Parts Ref No Part Description Qty Part No 1 Squeegee Hose Assembly
Thermo Scientific Model 146i Principle of Operation
Thermo Scientific Model 146i Principle of Operation The Model 146i Multi-gas Calibrator dilutes calibration gases to precise concentrations. The diluted gases are used to perform zero, precision and Level
Rev C Force 2 Parts Book Page 1 of 7 Top End
1181378 Rev C.2016.03.14 Force 2 Parts Book Page 1 of 7 Force 2: Fork Assembly Date: Customer: Ship to: PER BIKE DESCRIPTION 1 1166391 1 Fork, Force 2 (incl: fork, 4 bolts) -Serial# Required- Red Blue
GMA FUNCTIONAL TEST SETTING & TESTING OF SPIN UP PARAMETERS. P0586 REV -- 20, June 2000 GPB SCIENCE MISSION PROCEDURE
P0586 Rev. June 20, 2000 STANFORD UNIVERSITY W.W. HANSEN EXPERIMENTAL PHYSICS LABORATORY GRAVITY PROBE B, RELATIVITY GYROSCOPE EXPERIMENT STANFORD, CALIFORNIA 94305-4085 GMA FUNCTIONAL TEST SETTING & TESTING
User s Guide. Vacuum Controller for liquid delivery systems
Flow Control User s Guide Vacuum Controller for liquid delivery systems Precise Vacuum Control throughout the experiment Flow control Compatible with any perfusion system Ideal for Small Volume Delivery
SNS BL-13B NPDGamma Experiment
SNS BL-13B NPDGamma Experiment Hydrogen Supply to Cryogenic Target, Relief and Vent System Design Review April 7, 2010 C-156 9:00 10:30 PM Hydrogen System Block Diagram Diagram of Major System Components
Rev A. 10/2012 Page 1 of 6
Rev A. 10/2012 Page 1 of 6 www.topendwheelchair.com (800) 532-8677 (727) 522-8677 fax: (727) 522-1007 Force CC Fork Assy Customer: Top End Sales Order: PART NUMBER 1 1166643 1 Fork, Force CC (incl: fork,
9600 Compressor Installation, Operation, and Maintenance Instructions Rev. G (1/99)
9600 Compressor Installation, Operation, and Maintenance Instructions 8040444 Rev. G (1/99) TECHNOLOGY CORPORATION Mansfield Corporate Center, Nine Hampshire Street, Mansfield, Massachusetts 02048-9171
STS Advanced Oxide Etch DRIE System Trends
Date: 7/16/07 STS Advanced Oxide Etch DRIE System A- INTRODUCTION The purpose of this document is to help for process development of the AOE DRIE. This document provides general trends but the actual results
GDS OPERATING PROCEDURE
SU/GP-B P0886 Rev A 4 September, 2002 STANFORD UNIVERSITY W.W. HANSEN EXPERIMENTAL PHYSICS LABORATORY GRAVITY PROBE B, RELATIVITY GYROSCOPE EXPERIMENT STANFORD, CALIFORNIA 94305-4085 GDS OPERATING PROCEDURE
HELIX. On-Board IS Cryopump Installation Instructions
HELIX On-Board IS Cryopump Installation Instructions 2005 Helix Technology CorporationPart Number 8040596, Revision 12, 03/29/05 ECO Number 17066 Printed in USA HELIX TECHNOLOGY CORPORATION http://www.helixtechnology.com
September 10, 2014 Revision 2. Puncher Unit-BE1/BF1/BG1/BH1 Service Manual
1 4 September 10, 014 Revision Puncher Unit-BE1/BF1/BG1/BH1 Service Manual 0 0- Application This manual has been issued by Canon Inc. for qualified persons to learn technical theory, installation, maintenance,
7250 Sys. Ruska Multi-Range Pressure Calibration System. GE Sensing & Inspection Technologies. Features. Applications
GE Sensing & Inspection Technologies 7250 Sys Ruska Multi-Range Pressure Calibration System Features Fully integrated multi-range pressure test and calibration systems Select either an eight range or the
Installation and operation Manual. Bermad Surge Anticipation Valve. Model No 435
Instruction manual Bermad surge anticipation manual Model No 435 Installation and operation Manual Bermad Surge Anticipation Valve Model No 435 Bermad Water Technologies Rev 0 5/05/2015 7 Inglewood Drive,
Rev D. May 12, 2011 Page 1 of 7
Rev D. May 12, 2011 Page 1 of 7 www.topendwheelchair.com (800) 532-8677 (727) 522-8677 fax: (727) 522-1007 Force R: Fork/Crank Assy 1 1153309 1 Fork, Force R (incl: fork, 2 clamps, 4 bolts, 4 nuts) -Serial
Filter Integrity Testers for the Pharmaceutical Industry
Inline Filter Integrity Tests on Filters on huge Vessels, Freeze Dryers, Autoclaves, Filling -and Pressure Lines 1 The portable Filter Integrity Tester "it-01" The Filter Integrity Tester " it-01" can
SMTmax Corp. AE-3090D Automatic Stencil printer. User Manual
SMTmax Corp. AE-3090D Automatic Stencil printer User Manual SMTmax Corporation 5675 Kimball CT, Chino California 91710 www.smtmax.com AE-3090D Index 1. Introduction 2. Specifications 3. Installation guide
CONTROL TECHNOLOGY INC Middlebrook Pike, Knoxville, TN Phone FAX
CONTROL TECHNOLOGY INC. 5734 Middlebrook Pike, Knoxville, TN 3792 Phone 865.584.0440 www.controltechnology.com FAX 865.584.5720 CE Declaration of Conformity August 5, 205 Manufacturer: Control Technology
Technical Specifications of Hydrogen Isotope Handling and Recovery System
SECTION - C TECHNICAL SPECIFICATIONS OF STORES AND DRAWINGS. Technical Specifications of Hydrogen Isotope Handling and Recovery System INSTITUTE FOR PLASMA RESEARCH GANDHINAGAR, GUJARAT 382428 ANNEXURE-I
User s Guide. Pressure Controller for liquid delivery systems
Flow Control User s Guide Pressure Controller for liquid delivery systems Precise Pressure Control throughout the experiment Flow control Compatible with any perfusion system Ideal for Small Volume Delivery
Agilent ICP-MS Interactive Troubleshooting tool for Plasma ignition problem
Agilent ICP-MS Interactive Troubleshooting tool for Plasma ignition problem Rev. B 2017, January, 20 Next > Preconditions 7900, 7800, 7700, 8800, or 8900 ICP-MS is used. Sample introduction type is PeriPump.
Series Environmental Chambers
3119-600 Series Environmental Chambers Challenges in Non-Ambient Testing Testing at non-ambient temperatures adds another layer of challenges to your testing laboratory. Ensuring you get accurate and stable
Pegas 4000 MF Gas Mixer InstructionManual Columbus Instruments
Pegas 4000 MF Gas Mixer InstructionManual Contents I Table of Contents Foreword Part I Introduction 1 2 1 System overview... 2 2 Specifications... 3 Part II Installation 4 1 Rear panel connections...
Standard Operating Manual
NANOELECTRONICS FABRICATION FACILITY (NFF), HKUST Standard Operating Manual STS ICP-DRIE Copyright 2014 by Hong Kong University of Science & Technology. All rights reserved. Page 1 NANOELECTRONICS FABRICATION
Standard Operating Manual
Standard Operating Manual Branson IPC 3000 O 2 Asher Copyright 2014 by Hong Kong University of Science & Technology. All rights reserved. Page 1 Contents 1. Picture and Location 2. Process Capabilities
GV Standard X-Vent. Setup, Commissioning & Installation Guide
GV Standard X-Vent Setup, Commissioning & Installation Guide Technical experts in the design, manufacture and supply of precision engineered, architectural rooflights for residential and commercial buildings.
High Pressure Breathing Air Compressors
High Pressure Breathing Air Compressors [ Full variety for different applications] MSA offers a comprehensive range of high pressure breathing air compressors for both the firefighting and diving market,
APAS - 72 Parts Manual
VERSION HISTORY The table below summarizes the history of this document as it is published onto the company website(s). It identifies the version, date of issue and revisions and changes. VERSION DATE
REPORT, RE0813, MIL, ENV, 810G, TEMP, IN HOUSE, , PASS
REPORT, RE0813, MIL, ENV, 810G, TEMP, IN HOUSE, TST 00191 REV. A Crystal Group Inc 850 Kacena Rd., Hiawatha, IA Phone: 877 279 7863 Fax: 319 393 2338 9/23/2014 Revision History REV Date Approved Description
Bernhard Thomas September EnCal 3000 prochain Energy in Gas with ROI
Bernhard Thomas September 2018 EnCal 3000 prochain Energy in Gas with ROI Agenda 1 Introduction The new EnCal 3000 prochain Technical details Outlook Introduction 2 What we measure and why 3 What we measure
Digital Vacuum Regulator
Temperature Control for Research and Industry Digital Vacuum Regulator User s Manual Model 300 INDEX SECTION PAGE 1. QUICK OPERATING INSTRUCTIONS........................... 3 Safety Notices.................................................
DF-550E PROCESS ANALYSERS APPLICATIONS FEATURES
PROCESS ANALYSERS DF-550E The DF-550E Nano Trace oxygen analyser is a Coulometric sensor based analyser designed to measure oxygen as a contaminant at ultra trace levels in ultra high purity electronic
Arizona State University NanoFab PLASMATHERM 790 RIE. Version A
rizona State University NanoFab PLSMTHERM 790 RIE Version SU NanoFab Title: PLSMTHERM 790 RIE Table of Contents Contents Table of Contents...1 1. Purpose / Scope...2 2. Reference Documents...2 3. Equipment
Customer Responsibilities
Thank you for purchasing an Agilent instrument. To get you started and to assure a successful and timely installation, please refer to this specification or set of requirements. Correct site preparation
PPC4E Pressure Controller/Calibrator Superior rangeability and reliability
PPC4E Pressure Controller/Calibrator Superior rangeability and reliability Technical Data ± 0.02 % of AutoRanged spans from ± 1 kpa (0.15 psi) to 14 MPa (2,000 psi) The Fluke Calibration PPC4E brings high
Microscopy Cryogenic WORKSTATION. Performance by Design
CRYO Microscopy Cryogenic WORKSTATION Optical cryostat for use in microscopy and spectroscopy Performance by Design RC102-CFM Microscopy Cryostat offers fast cooldown, high efficiency, excellent temperature
Rev B. Jan, 2014 Page 1 of 6
Rev B. Jan, 2014 Page 1 of 6 www.topendwheelchair.com Invacare Top End Sports and Recreation Products (800) 532-8677 (727) 522-8677 fax: (727) 522-1007 Force 2, Fork Assembly Date: 1 1166391 1 Fork, Force
5 Channel Calibrator
212 N. Woodwork Lane Palatine, IL 60067 800-223-3977 5 Channel Calibrator Part # 0724 User Manual Questions? Contact us at 800-223-3977 or online at http://www.cleanair.com/equipment/express/main.html
Standard Operating Manual
Standard Operating Manual Denton Explorer 14 RF/DC Sputter Version 1.0 Page 1 of 11 Contents 1. Picture and Location 2. Process Capabilities 1. Cleanliness Standard 2. Available for Sputtering Materials
69200 w/5 Spring External Pivot, Stationary tower Stationary Tower, External Pivots, Up To 24 of Tarp
Roll Off Hook Lift System 69200 w/5 Spring External Pivot, Stationary tower Stationary Tower, External Pivots, Up To 24 of Tarp 2014 Roll Rite, LLC, All Rights Reserved Welcome to Roll Rite Automated Covering
Crest Heating Boilers FBN(L) Series &
Replacement Parts List PARTS & SERVICE DEPARTMENT Nashville, Tennessee 877-554-5544 Fax: 615-882-2918 parts_team@lochinvar.com www.lochinvar.com Crest Heating Boilers FBN(L) 751-2001 Series 100-101 & 110-111
MANUAL GAS MANIFOLDS
MANUAL GAS MANIFOLDS Phoenix Pipeline Products Limited. Unit 8, McKenzie Industrial Park, Tel No.: 44 (0) 161 428 7200 Bird Hall Lane, Fax No.: 44 (0) 161 428 7010 Stockport, Email: info@p3-phoenix.com
This educational seminar discusses creating, measuring, and troubleshooting Rough Vacuum.
This educational seminar discusses creating, measuring, and troubleshooting Rough Vacuum. Specifically, today s talk will cover: Brief review of Vacuum Fundamentals Applications Using Rough Vacuum Rough
3200 Dwight Road Suite #100 Elk Grove, CA Ph: Fax: GNB Corporation
3200 Dwight Road Suite #100 Elk Grove, CA 95758 Ph: 916-395-3003 Fax: 916-395-3363 www.gnbvalves.com info@gnbvalves.com GNB Corporation Vacuum Excellence Defined A Message from our President Welcome, and