Standard Operating Manual

Transcription

1 Standard Operating Manual Denton Explorer 14 RF/DC Sputter Version 1.0 Page 1 of 11

2 Contents 1. Picture and Location 2. Process Capabilities 1. Cleanliness Standard 2. Available for Sputtering Materials 3. Performance of the Denton Explorer 14 RF/DC Sputter 3. Contact List and How to Become a Qualified User 1. Emergency Responses and Communications 2. Training to Become a Qualified Denton Explorer 14 RF/DC Sputter User 4. Operating Procedures 1. System Description 2. Safety Warnings 3. Operation Rules 4. Initial System Checks 5. Status Checks 6. Venting the Chamber (Before Loading Wafers) 7. Inspecting the Chamber Before Use 8. Load Wafers 9. Pumping Down the System for Sputtering 10. Start your Sputtering Process 11. Venting the Chamber (Before Unloading Wafers) 12. Pumping Down the Systen for Idle Version 1.0 Page 2 of 11

3 Denton Explorer 14 RF/DC Sputter Cathode #3 Picture and Location Cathode #1 Cathode #2 Main Chamber RF Power Readout Denton Explorer 14 RF/DC Sputter Ar Gas Valve DC Power Readout Version 1.0 Page 3 of 11

4 Display ON/OFF Switch (RF Power) ON/OFF Switch (DC Power) This tool is located at NFF Enterprise Center Cleanroom Room 4162 Version 1.0 Page 4 of 11

5 Process Capabilities Cleanliness Standard Denton Explorer 14 RF/DC Sputter is Non-Standard equipment for DC and RF sputtering process of metals. Available for Sputtering Materials The following sources are available in Denton Explorer 14 RF/DC Sputter. Denton Explorer 14 RF/DC Sputter: Ti, TiW, Ag, Al (pure), AlSi and Cu for 2 to 4 wafer or small piece sample. NOTE: Consult a NFF EC staff member prior to do new materials other than above listed materials. Hazardous or Radioactive materials are not allowed to be sputtered in Denton Explorer 14 RF/DC Sputter. Performance of the Denton Explorer 14 RF/DC Sputter What the Denton Explorer 14 RF/DC Sputter CAN do Denton Explorer 14 can provide to sputter thin films thickness ( 50A thick) or thick films thickness ( 1.5um thick). Thin films: Ti, TiW and Ag. Thick films: Al (pure), AlSi and Cu. Denton Explorer 14 is suitable up to 4 wafer or small piece sample. What the Denton Explorer 14 RF/DC Sputter CANNOT do Denton Explorer 14 RF/DC Sputter should not be used for replacement of VARIAN 3180 and CVC-601 to sputter thick films, e.g. over 1.5um Denton Explorer 14 RF/DC Sputter should not be used for dielectric material sputtering. Users cannot modify the recipes, such as process minimum vacuum, cathode power (RF/DC), ignition pressure, argon gas flow, please consult NFF EC Version 1.0 Page 5 of 11

6 staff member. Process time is not allowed for longer than 400 seconds per run and there should be 10 minutes for chamber cooling. Contact List and How to Become a User Emergency Responses and Communications Security Control Center: (24hr) & (24hr) Safety Officer: Mr. Wing Leong CHUNG & Deputy Safety Officer: Mr. Man Wai LEE & NFF EC Technician: Mr. Peter Yiu Cheong PUN & NFF Phase 2 Technician: Mr. Wilson Pui Keung YIP Training to Become a Qualified Denton Explorer 14 RF/DC Sputter User Please follow the procedures below to become a qualified user of Denton Explorer 14 RF/DC Sputter. 1. Read all materials posted on the NFF website about Denton Explorer 14 RF/DC Sputter. 2. Send an to Mr. Peter PUN requesting Denton Explorer 14 RF/DC Sputter safety operation training. Schedule of training will be informed within several weeks, depending on number of requests. Operating Procedures System Description Denton Explorer 14 RF/DC Sputter is a sputtering system installed with three targets and it allows single layer and multilayer processes. One of the cathodes is energized by a radio frequency (RF) power source whereas the other two are direct current (DC) Version 1.0 Page 6 of 11

7 powered. This means that the RF/DC cathodes can sputter from conductive targets. A large collection of targets is available for this sputtering system but obviously, only three can be installed at any given time. In the event that a target is required which is not currently installed in the sputtering system, the user must submit a target change request via or phone to NFF EC staff. The request must be submitted at least 2 days prior to needing the target. Emergency off and Interlock facilities Emergency Stop is provided to shut down the sputtering system in an emergency. An emergency off switch, with normally-closed contacts, is mounted on bottom of the console. The switch is activated by pressing a 40mm diameter red Emergency Stop button. PLC interlock chain The interlock chain is monitored by the software, but acts independently. It is also supplemented by machine protection sensors, which operate only via the software. Safety Warnings This equipment can cause injury if not used in a cautious manner. 1. Do not operate the system if any of the doors, panels or covers is removed. 2. Ensure that all personnel who operate this equipment are trained to use the equipment, and are alerted to the range of hazards present. 3. When opening the chamber, ensure that personnel stand clear of the chamber door. 4. Close chamber door carefully, ensure that personnel vacate the vicinity of the door and its operating mechanism before it is closed to avoid trapped fingers etc. 5. Ensure that you do not leave tweezers from the chamber, damage the turbo pump could occur. 6. If the sample to be sputtered contains thin film photo resist for liftoff, then the Version 1.0 Page 7 of 11

8 substrate must be baked immediately before placing it in the chamber. Operation Rules 1. If an equipment failure while being used, never try to fix the problem by yourself. Please contact NFF staff. 2. Do not operate equipment unless you are properly trained and approved by NFF staff. 3. Do not leave an on-going experiment unattended. 4. Do not run sputtering process for long than 400 seconds per run. 5. Should be at least ten minutes for chamber cooling after sputtering process or in between two processes. Initial system checks 1. Verify that the needed targets have been installed in the chamber. The targets currently installed can be checked on the log sheet or via correspondence with NFF EC staff. 2. If the required targets are not in place, submit a target change request via or phone to NFF EC staff. The request must be submitted at least 2 days prior to needing the target. 3. Review the desired recipe to check that every parameter is set as required, especially the deposition time which determines the coating thickness. Status checks 1. Check the NFF website for reservations, problems and to see if it is already occupied by other users. 2. Check for an EMPTY sign attached to the machine. Do not use if an IN USE signs or MAINTENANCE sign is there. Check for problem notes. 3. The system is available if the initial system and status checks are normal. Check-in the equipment and enable the system on NFF Machine Reservation System. Place sign IN USE on the machine. Version 1.0 Page 8 of 11

9 Venting the Chamber (Before Loading Wafers) 1. Make sure that the system is not in the service mode position. 2. Turn off all internal sources of power (RF power and DC power). 3. Select the Auto Control screen indicator. 4. Select the Auto Vent indicator button. 5. System status will display Auto Mode. 6. Chamber will safely vent to atmospheric pressure. Inspecting the chamber before Sputtering 1. Review the previous entry in logbook to ensure there are no reported problems. 2. Fill in the log sheet with your name, NFF project number, reservation timeslot, source, thickness, RF power, DC Bias, gases flow rate and processing time being used. 3. Minimize time that the chamber opens. Load wafers 1. Place your sample to face upward in the center of the substrate holder. Before beginning, be sure to wear gloves to reduce contamination and to protect the hands. 2. Allow to load 3 pieces of 4 full wafers (100mm) at the same time. 3. Check the O-ring of the chamber lid to ensure that they are free of particles, dirt and not damaged. Pumping Down the System for Sputtering To pump down the system, use the following procedures: 1. Make sure the system is NOT in Service mode. 2. Select the Auto Control screen indicator. 3. Select the Auto Pump indicator button. 4. System Status will display Auto Mode. 5. System will safely pump from atmosphere to high vacuum. 6. The base pressure is 6e-06 Torr. Version 1.0 Page 9 of 11

10 Remark: Turning off the rough pump will cause all process and pumping actions using that pump to stop. Start your Sputtering Process Automatic Process Run: 1. Make sure in System Control page, press the Auto Control button, select Auto Pump button for pump down the system. 2. Check that the system has pumped down to base pressure. (The base pressure is 6e-06 Torr). 3. Auto RF/DC Sputtering is the easiest and fastest procedure overall. However, note that the Pre-Sputter Time and Sputter Time vary with different sputtering material and output power. You can select Auto Control button and then select Auto Setup button to modify the Pre-Sputter and Sputter time. 4. Make sure you will select RF or DC sputtering process. 5. Ensure to turn on DC power supply (XANTREX, XFR 600) when you choose DC sputtering process. 6. Otherwise, when you choose RF sputtering process, please turn on RF Generator (SEREN R MHz) and RF Automatic Matching Network Controller (SEREN MC 2 ). 7. And then press Close button to return to Auto Control page. 8. Select desired Cathode number (1, 2 or 3) and then press Auto Process for start your sputtering process. 9. Until the process completed, please give 10 minutes for chamber and target cooling. 10. Then turn off DC power supply or RF Generator and RF Automatic Matching Network Controller. 11. Press Auto Control button and select Auto Vent button for chamber vent. 12. Until the pressure has reached to atmospheric pressure, open the chamber door for unloading your samples. 13. Close the chamber door and press Auto Pump to pump down the system. Version 1.0 Page 10 of 11

11 Venting the Chamber (Before Unloading Wafers) 1. Ensure that the system is not in service mode position. 2. Turn off all internal sources of power (RF power and DC power). 3. Select the Auto Control screen indicator. 4. Select the Auto Vent indicator button. 5. Chamber will safely vent to atmospheric pressure. Pumping Down the System for Idle To pump down the system, use the following procedures: 1. After unloading the samples, close the process chamber door and lock the door. 2. Ensure that the System Control screen is displayed. 3. Ensure that the system status is displayed at Auto Mode. 4. Then select the Auto Control button and press Auto Pump button for system pump from atmosphere to high vacuum. 5. Ensure that the status indicators (Vacuum/Skin/Door/Water/Crossover Switches/Turbo at speed/minimum Vacuum) are in green color. 6. DON T GO AWAY YET! 7. Monitor the pressure to make sure that the base pressure can reach to 6e-05 Torr. 8. Clean up the area and move the items back to their proper positions. 9. Place an EMPTY sign on the machine. 10. Fill in the logbook, completely noting any problems. Remark: Turning off the rough pump will cause all process and pumping actions using that pump to stop. Version 1.0 Page 11 of 11