OLED vacuum deposition cluster system Sunicel Plus 400 / Plus 400L (Sunic Systems)

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Hester Bell
6 years ago
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1 OLED vacuum deposition cluster system Sunicel Plus 400 / Plus 400L (Sunic Systems) Gen2 substrate size : 370 (+/- 0.2) mm x 470 (+/- 0.2) mm. Thickness : 0.55 to 2.0mm. Supports the following deposition modes : orbital organic thermal evaporation (OC), orbital metallic thermal evaporation (MC), linear (scanning) organic thermal evaporation (LOC), linear and static sputtering (SP). All deposition processes target the bottom side of the substrate in a horizontal plane. Patterning of thin film layers is possible by shadow masking technique. Up to 8 masks can be loaded simultaneously into the system (masks for sputtering and evaporation are not-compatible). Up to 20 substrates can be processed in a single run. Reproducibility of the mask/substrate alignment is 150um for evaporation processes, ~0.5mm for sputtering process. Automation: deposition of a multi-layer OLED stack can be realized in automatic mode, with the same recipe applied to all substrate or with changing parameters. The cluster can also be operated in manual mode. Datalogging and alarm systems are installed. System overview Global footprint Approx. 9 x 20 meters. Description of the process chambers 1) (OC) Orbital organic deposition chamber. 4 organic material sources are operable independently. Each source consists of a revolver with 5 process cells of equal capacity which can be loaded with different organic materials (20 materials are

2 possible in total). In each revolver, only 1 cell can be evaporating at a time while the next cell is in standby mode (pre-heating with temperature stabilization is available in standby mode). The other cells of the revolver are inactive (=unpowered). The selection of the active cell is done by rotation of the revolver. Each source evaporation rate is controlled by its own quartz crystal microbalance. Temperature is monitored at the 2 positions on the cell (top and bottom) and can be actively stabilized by programmable PID. Maximum admissible temperature is 500 C Crucible sizes : 2 revolvers are designed for 120 cc crucibles (for host materials) and the 2 other revolvers are designed for 40 cc crucibles (for dopants). 2) (MC) Metallic deposition chamber 4 metallic material evaporation sources : - 2 are specific for Aluminum process with dual-crucible configuration (120cc) - 2 are multi-purpose, high temperature evaporation sources, with 120cc crucibles. Maximum temperature of the sources is 1500 C. Each source deposition rate is controlled by its own QCM. 3) (SP) Sputtering chamber Sputtering chamber is equipped with 4 independent guns. Gun #1 is designed for high-speed process and features 4 parallel targets and a cooling backplate in order to process the substrate in a static mode (thickness uniformity is +/- 7%). Guns #2,3,4 have each 2 targets and requires processing in horizontal scanning mode, without cooling backplate. Pulsed DC+RF are available on all guns. Max power: pulsed DC (5 kw) and RF (1kW). Reactive processes are possible on Gun #01 and #03 Gases installed are Oxygen / Argon / Nitrogen. Chamber pressure is set and stabilized during process by throttling valve.

3 4) (LOC) Linear organic deposition chamber. The linear organic deposition chamber allows to deposit a full stack of up to 10 layers or organic materials (each can be either a pure material or a (matrix:guest) system) in a single run. It is designed for high volume production of identical OLED stacks. Each substrate is attached to a shuttle in a first chamber, then moves through the 10 evaporation zones, 5 in the first chamber (LOC1) and 5 in the second chamber (LOC2). LOC1 and LOC2 have the same design. Each chamber is 3-meter long. A total of 11 shuttles are available. Each shuttle has its own shadow mask for patterning of organic layers. Each source can accommodate 2 cells for organic materials, 1 large for a 180 cc crucible and 1 small for a 70 cc crucible. Evaporation cones of each cell overlap and ensure a maximum 3% thickness homogeneity along the direction perpendicular to the shuttle motion. Temperature is monitored at 5 positions on each cell and can be adjusted by 2 independent filament heaters at the top and the bottom of the cell. Cells can be operated at a maximum temperature of 500 C. Other chambers are necessary for the operation : (AC) Attachment chamber (for loading/unloading substrates), (PC) Pass chamber 1 & 2, (LC) Lift chamber for transferring substrates on shuttles return line.

4 Description of utility chambers 1) (LL) Load lock For substrates and masks loading ; chamber capacity is 20 substrates + 8 masks (orbital or sputtering process masks). 2) (BF) Buffer chamber The buffer chamber is used to store substrates before the run, between two processes or after the run. It has a capacity of 28 glasses. Buffer is connected to a (GB) glovebox for encapsulation processes in inert atmosphere (see below). 3) (TM) Transfer chamber In a central position, it allows to move the substrate between the different chambers. Octogon shaped, 8 ports. Works with a DaiHen robot, 2 arms. 4) (GB) Glove box The glove box has two areas connected by electro-pneumatic gate and rail transfer system. - (GB1) 1st for transferring substrates out of the BF and storage (electrical lift system with a storage capacity of 50 substrates) - (GB2) 2nd for manual processing (e.g. encapsulation) with dimensions (inside) : L=4m x d=1.0m x h=0.9m ; access on one side with 8 gloves. Airlock to the outside on one end (pumping by Leybold XPS10) The glove box is connected to M'Braun purifier, model IGMS (dimensions 1.2 m x 1m x 2.6 m) ;

5 Cryo-pump types: Chamber Pump type Ultimate pressure (torr) MC CTI-Cryogenics CT-10 CTI-Cryogenics CT-10 1e-7 TM (replaced in 2015) OC CTI-Cryogenics CT-10 3e-8 BF 2x CTI-Cryogenics CT-8F 3e-8 LL 2x CTI-Cryogenics CT-8F 4e-8 SP LOC (AC) LOC (PC1 & PC2) LOC(OC1 & OC2) LOC(LC) 2x Genesis Vacuum Technologies ICP-300 Genesis Vacuum Technologies ICP-250L 2x Genesis Vacuum Technologies ICP-250 4x Genesis Vacuum Technologies ICP-300L Genesis Vacuum Technologies ICP-250L <2e-6 3e-8 Cryo-pump compressors 5x CTI-Cryogenics 9600 (for OC, MC, LL, TM, BF) 5x Genesis Vacuum Technologies HC80+ (for SP and LOC) Dry pumps 2x EBARA ESR200WN (for OC, MC, LL, TM, BF) 2x EBARA EV-S200P (for SP and LOC) Standalone Glove box (for OLED material storage) M'Braun Labmaster SP L=2.55 m x d=0.95m x h=1.95m Known issues Defect cryo pumps : 5 (1x CT-10, 3x ICP-300L, 1x ICP-250)

Issue: H Title: CHA E-Beam Evaporator Page 1 of 7. Table of Contents

Issue: H Title: CHA E-Beam Evaporator Page 1 of 7. Table of Contents Title: CHA E-Beam Evaporator Page 1 of 7 Table of Contents Purpose/Scope... 2 2.0 Reference Documents... 2 3.0 Equipment/Supplies/Material... 2 4.0 Safety... 2 5.0 Set Up Procedures... 2 5.1 PC Logon and