Process: Chlorine etch. Item Qty Description Price/Unit Total

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1 To: University of Colorado Issued: November 25, 2015 Dept. of ECEE Expiry date: February 23, 2016 Boulder CO Sales Contact: Paul Sadlek Attn: USA Won Park Phone: Project: Apex SLR Fax: Process: Chlorine etch Item Qty Description Price/Unit Total process module Apex SLR Series, Inductively Coupled Plasma Etch System This reactor is engineered for research level, pilot line ICP plasma processing using chlorine/fluorine chemistry. Standard specifications: Power Distribution Center: Integrated disconnect box for facilities input power (see power configuration selection below). Includes system "RESET" and EMO access on the rear of the system. Additional EMO button placed on system front. Power configuration: 208V 3 phase, 5 lead system (Neutral+PE) 50/60Hz. V-SL PM: Contains operating system, anodized aluminium support frame, processing chamber, closed looped pressure control system with vacuum gauges (capacitance manometer, wide range vacuum gauge and on-board gas enclosure. Automatic load lock (with on-board control - load/unload, pump/vent, run and clean) allowing transfer of substrates in and out of the process chamber. CH-PM: Solid high grade aluminium process chamber with capability to process substrates up to 8" in diameter. Prepared for 4" wafers. MESC port for load lock. Close coupled turbo molecular pump ensures optimum pumping performance. Lower electrode with bias supply and ICP source with ICP power supply (2MHz). Pressure control: 100 mtorr digital heated capacitance manometer, DIN 160 ISO-K digital control pendulum valve provides fast and extremely accurate closed loop pressure control. Closed coupled vacuum pumping using DryTek PS80A, combined with a Edwards Vacuum MagLev STP1303C (1300 l/s) corrosive gas compatible pump ensures the high pumping speeds required for ICP processing. Pump interface: PDC control. Substrate table: Standard equipped with 4" feature plate and clamp-assembly to allow processing of 4" wafers. He-backside cooling integrated with automatic flow/pressure control. 5 C to 40 C temperature range as standard. ICP chamber: 4-spool 2MHz ICP source assembly allowing processing of up to 8" diameter substrates. Peak-to-peak voltage monitoring and fast automatching ensures repeatable and accurate processing. Chamber opens up for easy maintenance and cleaning. Easy maintenance feature allows for fast swapout of spool if required. Operator terminal: Incorporated into the system frame, mounted to the left hand side of the tool. Allows for easy-access to the control system with a keyboard integrated to the monitor arm assembly. Adjustable height ensures compliance to ergonomic requirements. Fax : +1 (727) Page 1 of 6

2 Item Qty Description Operating system: Windows based operating system. Includes easy to use GUI with full system control mode (manual, automatic and maintenance modes). All data is stored in an open format SQL database, and all data logging adheres to the ANSI-ISA 88 standard. System comes pre-installed with 4 operator levels (Guest, Operator, Process and Administrator). Price/Unit Total Gas Enclosure: Gas enclosure with extraction point to ensure proper extraction of enclosure volume. Includes 6(six) metal-sealed Digital (DeviceNet) controlled mass flow controllers (MFCs). Can be field upgraded to accomodate a total of 12 lines. Out of the six MFCs, 2 are equipped with flush/bypass capability. Each gas channel includes a normally closed isolation valve on the inlet and outlet of the MFCs. A common N2 inlet provides nitrogen for both chamber vent and post-process purge. Gas lines are constructed of <10 RA finish 316 stainless steel tube, all fittings are orbital welded and all gaskets are metal nonplated stainless steel VCR. The common process gas mixing manifold includes a normally closed process gas isolation valve Base cabinet consists of: 1 x process chamber vent line. 1 x process chamber purge/flush line. 6 x PGC-ISO process gas channel with isolation valves. Normally closed isolation valve on both the inlet and outlet side of the MFC for process gases. 6 x metal sealed, Digital (DeviceNet) mass flow controllers. Quoted configuration (gas types need to be confirmed on order): Size Gas Formula Flushed Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Chlorine Boron trichloride Argon Nitrogen Tetrafluoromethane (R-14) Cl2 BCl3 Ar N2 CF4 Yes Yes No No No Channel 6 Oxygen O2 No Channel 7 Not equipped Channel 8 Not equipped Channel 9 Not equipped Channel 10 Not equipped * All MFCs are calibrated for configured gas. Plasma power supply configuration 300W MHz bias power supply with automatic matching network. 1kW 2 MHz ICP power supply with automatic matching network. Vacuum pump Drypump mechanical and electrical interface package Includes electrical and mechanical items used to interface the pump package to the Apex SLR process module. The interface includes: 1 (one) meter lenght of flexible bellows to interface the pump to the system (KF25NW). 3 (three) meter electrical connection cables with tool interface connectors Pump specifications: DryTek PS80A (1300 l/m) dry backing pump; Edwards Vacuum MagLev STP1303C corrosive gas compatible turbomolecular pump with 1300 l/s capacity. (for connections >3m in lenght, ISO63 vacuum plumbing is recommended). Fax : +1 (727) Page 2 of 6

3 Item Qty Description Price/Unit System operations Training, Standard training 2 day basic training for up to 5 people provided to the buyer or buyers representative during In-House Acceptance Testing. Follow on training will be provided on basic system knowledge, safety principles, danger areas, graphical user interface, system operation and period tests or check as applicable at the buyers location in conjunction with the system installation/startup. Total Final Price: 418,102 USD Option: Endpoint Endpoint solutions (not included in final price) EndPointWorks V300 OES/OEI/LEPD EndPointWorks is a flexible endpoint detection system which can collect data from a variety of input devices and utilize this to determine endpoint for deposition processes. A spectrometer is used to collect the light from the plasma and a dedicated computer running EndPointWorks software is used to process this data. On the RIE system the light is collected via a viewport and fiber optic connector located on the left side of the process chamber or alternatively through a top viewport (LEPD). Various endpoint recipes can be utilized to determine endpoint. The EndPointWorks computer interfaces with the Apex SLR computer such that automatic starting of the endpoint system is triggered during a process, and automatic termination occurs once endpoint is found. OES Endpoint solution - Optical Emission Spectroscopy OEI Endpoint solution - Optical Emission Interferometry LEPD Endpoint solution - Laser Endpoint Detection USD USD USD Fax : +1 (727) Page 3 of 6

4 Item Qty Description Price/Unit Total Other options: Quoted options (not included in final price) Non-toxic gasline 5946 USD Non-toxic gas channel with pneumatically controlled isolation valves. Normally closed isolation valve on both the inlet and outlet side of MFC for process gases. Metal sealed MFC used to measure and control the flow of gases during process Toxic gasline Toxic gas channel with pneumatically controlled isolation valves and a bypass/flush valve. Normally closed isolation valve on both the inlet and outlet side of MFC for process gases. Metal sealed MFC used to measure and control the flow of gases during process USD Chamber wall heater 4858 USD Resistive chamber wall heater assembly including regulation box which interfaces to the GUI WCK USD Extra 6" Wafer Change Kit LN2 Upgrade Kit USD Includes Apex LN2 electrode (-150 deg to 300 deg C) with LN2 autochangeover kit (ensures transparent use from -150 degrees to 300 deg C) using a recirulating system. Fax : +1 (727) Page 4 of 6

5 Item Qty Description Price/Unit Condition of Sale System acceptance : Hardware per AVE ACC-V-SLICP-2012-A. Process per standard Chlorine etch specification. Delivery: weeks after confirmed order Shipment terms: EXW manufacturer Total Payment terms: 40% Due Net 30 days upon order placement 50% Due Net 30 days uopn System Shipment 10% Due Net 30 days upon Final Acceptance, but not to exceed 60 days from shipment if delay occurs through no fault of Plasma-Therm All quoted prices are quoted in USD unless stated otherwise. Plasma-Therm/Advanced Vacuum Systems AB Terms and Conditions are included as "Attachment A" and hereby included as part of this quotation by this reference. Warranty statement: (NOTE: This warranty statement takes precedence over any corresponding statement in the attached Plasma- Therm/Advanced Vacuum Systems AB Terms and Conditions. All other T&C of sale are as per attached.). Warranty period: Warranty standard term ends 365 days from date of install/commissioning, or 395 days from shipment Ex- Works, whichever is earlier if any delay occurs through no fault of Plasma-Therm. Standard warranty conditions apply per attached Terms and Conditions. For subsystems retrofits and modifications, 90 days, beginning on the date of completion, or 120 days from shipment, whicever is earlier. Fax : +1 (727) Page 5 of 6

6 Generic footprint Fax : +1 (727) Page 6 of 6