GLAST Large Area Telescope: TEM/TPS TRR

Transcription

1 Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: TEM/TPS TRR Presented by G. Haller SLAC (650) DAQ & FSW V3 1

2 Contents Introduction Overview Significant Changes since CDR Objectives Status Requirements/Verification EGSE and Test-Procedures Verification Test Plan and Flow At Assembly Vendor Test-plan and Flow Facility Man-Power Quality Assurance Vibration At SLAC Test-plan and Flow Thermal Vacuum Test Mass Property EMI/EMC (at sub-contractor) Man-Power Quality Assurance Equipment Calibration/Safety Risk Assessment Schedule Status of Procedures Issues and Concerns DAQ & FSW V3 2

3 LAT Electronics TKR Front-End Electronics (MCM) ACD Front-End Electronics (FREE) CAL Front-End Electronics (AFEE) TKR Global-Trigger/ACD-EM/Signal-Distribution Unit* Spacecraft Interface Units (SIU)* Storage Interface Board (SIB): Spacecraft interface, control & telemetry LAT control CPU LAT Communication Board (LCB): LAT command and data interface CAL 16 Tower Electronics Modules & Tower Power Supplies 3 Event-Processor Units (EPU) (2 + 1 spare) Event processing CPU LAT Communication Board SIB Power-Distribution Unit (PDU)* Spacecraft interface, power LAT power distribution LAT health monitoring * Primary & Secondary Units shown in one chassis DAQ & FSW V3 3

4 TEM/TPS Mounted to CAL TKR not shown LAT GRID with 16 CAL/TEM/TPS Modules CAL TEM TPS DAQ & FSW V3 4

5 Tower Electronics Module Main DAQ module, one on each tower Controls and reads out data from TKR MCM and CAL AFEE front-end electronics Zero-suppresses CAL event data Buffers events in cable ASIC FIFO s Assembles CAL and TKR event fragments to tower event Transmits data to GASU Contains monitoring and low-rate science circuits LVDS interface to front-end electronics and GASU EM Tower Electronics Module (TEM) before coating/staking X 2 5 TEM Assembly X DAQ & FSW V3 5

6 Tower Power Supply Tower Power Supply module, one on each tower Input 28V Generates low-noise voltages for TKR (2.65V analog, 2.65V Digital) CAL (3.3V analog, 3.3V digital) TEM (3.3V and 2.5V digital) TKR Bias (20V-140V programmable) CAL (20V to 90V programmable) Temperature sensors EM Tower Power Supply (TPS) before coating/staking 20X X 7 2 2X X 2 13 J1 4 26X X 2 6 TPS Assembly X 5 3 4X 4 J X DAQ & FSW V3 6

7 TEM/TPS Assembly After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package is tested TPS X TEM 1 2 Shown upside-down TPS 1 1 TEM DAQ & FSW V3 7

8 Changes since TEM CDR and Power-Supply Delta CDR Power Supply Review from SLAC GLAST web-site -> Electronics & DAQ -> Reviews TEM Modification of FPGA code To fix a couple of bugs To change flow-control slightly to optimize dataflow throughout system Code was reviewed by GSFC reviewer (Dr Rod) Some resistor/capacitor values have changed to optimize monitoring ranges Details of monitoring circuit have changed and a sub-set of current monitoring functions were eliminated TPS Resistor/capacitor changes to optimize circuit performance over temperature Changes in poly-switch values to protect better over temperature (instead of RXE185, split the load into two paths with a RXE110 each), increased the current sensing resistor from a 1W to a 3W resistor. Changed resistor values to Modify TKR 2.5V to 2.65V Decrease maximum CAL Bias from 120V to 90V Changed Zener diodes at Bias output voltage for new max values Changed resistor values to optimize in-rush current level Worst Case Analysis updated to incorporate changes Thermal Analysis from CDR/Delta-CDR remained since changes don t impact thermal performance DAQ & FSW V3 8

9 Objectives Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test Demonstrate that planned and completed testing meets performance and interface requirements Identify and understand all the risks and limitations TRR is not intended to Review TEM/TPS design Review flight readiness Buy-off hardware or software RFA s should only be of sufficient concern to stop test Prior to start of an given test, any applicable TRR RFAs must be closed DAQ & FSW V3 9

10 Test Entrance / Exit Criteria Entrance All required paperwork released and in place Procedures, drawings, etc Test configuration verified and approved Essential personnel in place Pre-test TEM/TPS functional successfully passed Exit As-run procedures completed Correct and accurate application of test environment Test data acquired and archived No damage to TPS/TEM TEM/TPS performance within specification limits Post-test TEM/TPS functional successful DAQ & FSW V3 10

11 Status 3 TEM/TPS Qualification unit, Tower A, and Tower B units Assembled, Functional tested Ready for environmental test Assembly of balance of 19 TEM and TPS authorized to proceed, but not started yet All parts at assembler DAQ & FSW V3 11

12 Tests To-Date TEM and TPS engineering modules were extensively tested As EGSE in DAQ/CAL/TKR/I&T >50 test-stands were tested with SLAC TPS and TEM Test Procedure TEM and TPS were used to test functionality and performance of TKR and CAL sub-system electronics Met requirements by sub-system CAL performed vibration tests on coated/staked TEM/TPS to CAL levels, passed (exceptions were first modules in-house staked) Additional TEM/TPS tests Informal thermal-vacuum test -40C to 55C, passed CPT Vibration tests of staked TEM/TPS passed DAQ qual levels On test-bed 16 TEM/TPS connected to EM PDU and GASU and to Front-End Simulator modules generating trigger and event-data Run up to 10 KHz data-rates DAQ & FSW V3 12

13 Tests To-date (con( con t) On fully-instrumented tower 36 TKR MCM s 4 CAL AFEE s Ran tests and passed Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS E.g. TEM/TPS delivered to CAL: IO tested to sub-system ICD s Configuration and data-taking tested Monitoring functions/performance tested Tested over Frequency (16Mhz to 22 MHz, 20 MHz nominal) Temperature (-40C to 55C) TEM supply range (3.3V +/- 10%, 2.5V +/-10%) One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots, including flight-lot ACTEL FPGA s Passed tests from -40C to 55C over voltage and frequency Three TEM and TPS flight modules assembled at flight-assembly vendor individually tested with CPT procedures, over temperature, passed tests DAQ & FSW V3 13

14 Requirements LAT-SS Specifications, Level 3 T&DF Subsystem Specification LAT-SS Specifications, Level 4 Trigger LAT-SS Specifications, Level 4 Dataflow LAT-SS Specifications, Level 3 Power Supply System LAT-SS Specifications, Level 4 Power Supply System LAT-SS Specifications, Level 5 TEM Specification LAT-SS Specifications, Level 5 TPS ICD & Specification LAT-SS Specifications, Level 5 TEM/TPS Specification DAQ & FSW V3 14

15 Derived Requirements LAT-SS TEM/TPS lists 132 requirements for TEM/TPS package (most are from TEM LAT-SS (108) with extensions (24) to include TPS requirements for the TEM/TPS package) Verification Matrix gives approach to verify each requirement LAT-TD Lists verification method used Assembly level at which requirement is verified All TEM requirements at TEM assembly level (LAT-SS ) ALL TPS requirements at TPS assembly level (LAT-SS ) TEM/TPS package requirements at TEM/TPS assembly level (LAT-SS-05533) DAQ & FSW V3 15

16 System Performance Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types Level 5 TEM/TPS requirements which are verified are derived from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc) Level 5 requirement doc includes derived requirement addressing Functionality/performance Power Mass/C.G. EMI/EMC Environmental incl temperature and vibration DAQ & FSW V3 16

17 Verification Status Engineering Module TEM/TPS EM completed full environmental/functional test program with exception of EMI/EMC, mass, and C.G. Demonstrated compliance with specifications DAQ & FSW V3 17

18 EGSE and Test-Procedures EGSE for Functional/Performance Tests Test-Stand documented in LAT-DS TEM (at TEM module level) TEM Stray-Voltage-Test Procedure LAT-TD TEM Electrical Interface Continuity and Isolation Test procedure LAT-TD TEM Test-Procedure LPT LAT-TD TPS (at TPS module level) TPS Stray-Voltage-Test Procedure LAT-TD TPS Electrical Interface Continuity and Isolation Test procedure LAT-TD TPS Test-Procedure LPT LAT-TD TEM/TPS (at combined unit level) TEM/TPS Performance Test Procedure LAT-TD DAQ & FSW V3 18

19 EGSE Test-Configuration LAT-DS TEM (Unit Under Test) 14 TEM connectors: 9-51 pin connectors (Trk, GASU) 4-69 pin connectors (Cal) 1 50 pin connector (TEM PS) JC0 JC1 JC2 JC3 JT0 JT1 JT2 JT3 JT4 JT5 JT6 JT7 J1 JS1 J2 JC0 JC3 Connector savers LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 P1 LAT-DS P2 JT0 JT7 Connector savers MWDM2L-51USP1 Tower Power Supply J1 TEM Test Board LAT-DS connectors: 8-51 pin connectors (TKR) 4-69 pin connectors (CAL) 1-2 pin connector (PWR In) P1 +X JC0 +Y JC1 -X JC2 -Y JC3 C0 JT0 C1 JT1 C2 JT2 C3 JT3 C4 JT4 C5 JT5 C6 JT6 C7 JT7 Connector saver DGBH26MF J1 Test Board Cooling Fan Assembly P3 LAT-DS P2/P2 DC Power (-) Supply #1 BK 1697 P1/P1 Set to 28 V (+) RS-232 Cable LAT-DS Pomona B-12-0 LAT-DS P1 P2 LAT-DS LAT-DS (+) DC Power Supply #2 BK1697 (-) Set to 3.3 V Function Generator P3 P2 NC P1 J1 J2 LAT-DS J3 EXT CLK 28 V GND PS CTRL EXT TRIG To TEM (GASU) To LCB EVENT To LCB CMD Slot 0 SBC MVME 2304 Card VME Slot 4 TST-STP Trans Card LAT-DS LCB Mezzanine Card LAT-TD Connector saver MWDM2L-51USP1 Local network connection TRD855PL-50 CAT5 Ethernet 10/100 Base Local PC Serial port connection and adapter TDC003-7, (RECO98M Connectors) RS-232 Cable Debug DAQ & FSW V3 19

20 Verification Level Module Detail Breakout of verification at TEM/TPS Module Level Tests to be conducted after successful TRR At assembly vendor Functional test Vibration Functional test Thermal cycle Functional test Pre-ship review At SLAC Incoming functional test Mass properties Thermal vacuum (in-situ testing) EMI/EMC Functional test Review Deliver to I&T» DAQ (out-going) / I&T (incoming) test combined In the following slides first the work/tests at the assembly vendor is defined, then the work/tests at SLAC DAQ & FSW V3 20

21 At Assembly Vendor Test-Stand Supplied by SLAC Operated by SLAC engineers Vibration facility at General Technology Vibration test-procedure ESS-Procedure pdf Also includes» Thermal test procedures» Environmental chamber (thermal/vibration) description SLAC engineers present for vibration tests Work at assembly vendor specified in SOW LAT-PS DAQ & FSW V3 21

22 Process & Test Flow-GTC (Assembly Vendor) See also in more detail in Procedure pdf Assemble TEM/TPS Stake HW Vibration Test Functional Test Functional test Thermal test Final functional test Source inspection &EIDP review Pack & ship to SLAC DAQ & FSW V3 22

23 GTC Qualification and Acceptance Test Matrix CCA Qual Unit (Qty. 1) Module Qual Unit (Qty. 1) TEM/TPS Qual Unit (Qty. 1) CCA Production Units (Qty.21) Module Production Units (Qty. 21) Initial ambient x x x x x x Thermal Cycling (Qualification) x x x Thermal Cycling (Acceptance) x x x Post Thermal Cycle Funtional x x x x x x Low Level Sine Sweep x x Random Vibration (Qualification) x Random Vibration (Acceptance) x Low Level Sine Sweep x x Final Performance x x TEM/TPS Production Units (Qty. 21) DAQ & FSW V3 23

24 GTC Environmental Test Requirements Parameter Required Characteristic Thermal Cycling (4 cycles) -40 to +55 C (Qualification) Thermal Cycling (4 cycles) -35 to +50 C (Acceptance) Random Vibration See Figure 1. Sinusoidal Vibration 0.5g rms, 20 to 2000Hz ASD Level (G 2 /Hz) Freq (Hz) Accept Qual Overall 6.8 Grms 7.1 Grms Duration 60s/axis AT, PT 120s/axis QT ASD Level (G^2/Hz) Accept Qual Freq. (Hz) Figure 1. Vibration Levels, Duration, and Spectra DAQ & FSW V3 24

25 Manpower & Quality Assurance at Assembly Vendor Man-Power Thermal and vibration test man-power provided by assembler Test man-power supplied by SLAC TEM: L. Sapozhnikov TPS: D. Nelson Test Support: J. Ludvik Quality assurance: see below Quality Assurance Assembly QA by vendor as required by SOW On-site, full-time LAT QA presence (P. Lujan) Required changes to documentation at GTC is immediately documented on an NCMR and forwarded to SLAC for disposition All outstanding changes to documents are incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing/test level (CCA, Module, Top Assembly) DAQ & FSW V3 25

26 At SLAC After TEM/TPS module has been shipped from assembly vendor to SLAC: Test-Stand Supplied by SLAC, operated by SLAC engineers Work flow Functional Test Mass Property Plus C.G. measurement Thermal Vacuum (in-situ testing) Functional Test Ship to EMI/EMC vendor EMI/EMC test Ship back to SLAC Final functional test Review DAQ & FSW V3 26

27 Mass Property Mass properties checked at SLAC Procedure in progress (done at SLAC Metrology) Measured on EM (ref LAT-TD-00564) TEM kg TPS kg TEM/TPS Total 7,050 kg Allocation 12% above = 7,896 kg C.G. to be measured for the qualification unit DAQ & FSW V3 27

28 Thermal Vacuum Test Thermal Vacuum facility in Building 33 at SLAC Thermal Vacuum Chamber Operating Procedure LAT-TD (draft in review) TEM/TPS Thermal Vacuum Test-Procedure LAT-TD ( draft in review) Chamber was relocated to Building 33 from Central Lab Needs earth-quake securing, in progress (by 1/10) Needs recalibration (by 1/15) DAQ & FSW V3 28

29 Qual and Flight Acceptance Thermal Vacuum Test See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD At < 10-5 Torr DAQ & FSW V3 29

30 Manpower & Quality Assurance at SLAC Man-Power Thermal Vacuum test (R. Williams, J. Ludvik) Test man-power supplied by SLAC TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik Quality Assurance LAT QA already present at SLAC Required changes to documentation is immediately documented on an NCMR DAQ & FSW V3 30

31 EMI/EMC Test Qualification Test (Conductive & Radiative) Sub-contracted to CK Labs Statement of Work: LAT-PS CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103 Detailed EMI/EMC procedure deliverable by vendor (in work) Required to be reviewed/released prior to tests SLAC engineers present at vendor for tests Vendor supplies test-report LAT QA at SLAC present for tests Flight Acceptance Test (Conductive) Performed at SLAC Procedure in work Required to be reviewed/released prior to tests CE102, CS102 SLAC supplies test-report LAT QA at SLAC present for tests DAQ & FSW V3 31

32 Problem Failure Report/ Configuration Management Problem Failure Reporting Via standard SLAC LAT Non-Conformance Reporting (NCR) System NCR is entered Reviewed/accepted/resolved LAT engineering LAT QC Already exercised during past TEM/TPS assembly Configuration Management Via standard LATDOC system DAQ & FSW V3 32

33 Planned Tests Function/Performance Tests (LAT-TD-01485) Verifies all requirements in LAT-SS except below Thermal Vacuum Tests Verifies performance/function over temperature Mass/C.G. Verifies/measures mass and C.G. Vibrations test Verifies vibration performance requirements EMI/EMC Verifies EMI/EMC performance DAQ & FSW V3 33

34 Equipment Calibration Electrical Functional Test Equipment EGSE Test-Stand was certified by SLAC (will be posted on LAT EGSE web-site shortly) EMI/EMC Test Equipment Quantitative measurement equipment (sensors, antennas, etc) calibrated to NIST standards Calibration performed annually All item are (will be) within calibration at time of testing Vibration Test Equipment Accelerometers calibrated against a standard accelerometer traceable to NIST Signal conditioners calibrated annually TVAC Equipment Thermocouples calibrated against standard temperature; calibrated prior to test Thermocouple reader calibrated very 2 years DAQ & FSW V3 34

35 Sub-System System Safety EGSE Safe-to-mate Configuration control Calibration verification Functionality verification with golden TEM/TPS prior to test with flight hardware MGSE No custom MGSE Environment Temperature controlled in all test-facilities Cleanliness actively controlled in clean-room; hardware bagged and purged when required Training ESD training completed Clean room training completed DAQ & FSW V3 35

36 Risk Assessment GTCC/GCCC TEM ASICs qualification program not completed at GSFC No issue to-date Test completion end of February ACTEL FPGA s TEM s use relatively new UMC fabrication-line space-qualified FPGA s, no flight heritage ESD sensitivity of ASIC s higher than expected (200V, class 0) Mate-demate and safe-to-mate are of concern when connecting/disconnecting TEM to front-end test (simulator) board. Keep cables as short as possible, apply handling taught in ESDtraining, use de-ionizers Schedule Pressure to deliver flight hardware could force less than complete characterization and analysis of modules, could result in replicating a problem in follow-on modules Performance None known DAQ & FSW V3 36

37 Test-Schedule Depending on assembly vendor, estimate as follows 1/10/05: functional test of qual/twra/twrb 1/11-12/05: vibration test of qual/twra/twrb 1/13/05: functional test of qual/twra/twrb 1/14-15/05: TC of qual/twra/twrb 1/16/05: functional test of qual/twra/twrb 1/17-21: review/shipping 1/24/05: functional test of qual/twra/twrb 1/25/05: mass, c.g. property test of qual/twra/twrb 1/26/05: TV start of TwrA, end Feb 2 2/3/05: EMI/EMC of TwrA, end 2/5/05 2/7/05: TV start of TwrB, end Feb 14 2/15/05: EMI/EMC of TwrA, end 2/16/05 2/15/05: TV start of Qual, end Feb 22 2/22/05: EMI/EMC of Qual, end 3/8/ DAQ & FSW V3 37

38 Status of Main Test Procedures TEM/TPS Performance Test Procedure LAT-TD-01485: released Vibration & thermal cycle procedure GT procedure SK-282-SLAC: approved EMI/EMC Qual CKC Lab procedure: will be started 2 nd week of January Flight Working together with TKR to get procedure finished by 3 rd week of January (procedures are similar) Thermal Vaccum LAT-TD-03631, in draft form All procedures must be released before respective test DAQ & FSW V3 38

39 Issue & Concerns EMI tests Concern passing qualification tests Schedule Tight Qualification and Flight acceptance tests of flight TEM/TPS are performed with front-end simulators, not with actual CAL or TKR electronics In the planning phase: Taking qualification module after baseline environmental testing is completed Connect it to CAL AFEE / TKR MCM electronics Test over temperature (no vacuum required) Need documentation Possible for every flight modules: schedule issues DAQ & FSW V3 39