Product Reliability Qualification Report

Transcription

1 Product Rliability Rport Family : PEX8605-AB50NI G PEX8603-AB50NI G USB3382-AB50NI G USB3380-AB50NI G USB2380-AB50NI G Sptmbr 14, 2012 Prpard and Rviwd By: Thoma Huang Quality and Rliability Enginr Approvd By: Brt Bigly Dirctor, Quality Auranc and Rliability PLX Tchnology 870 W. Maud Av. 1 Sunnyval, CA

2 1. Purpo: Prform a product family rliability qualification for th PEX8605/3 Switch and USB3380/2, USB2380 Bridg dvic, rviion AB ilicon, in a 90nm fab proc tchnology. An aqfn (Advancd Quad Flat No-Lad Packag) and QFN (Quad Flat No-Lad Packag) packag ambly tchnology ar utilizd for th Switch and Bridg famili rpctivly. Thi documnt ummariz th qualification plan and th rult to dat of th product a pr blow. 2. Scop: Th PEX8605/3 and USB3380/2, USB2380 dvic ar fabricatd in a 90nm proc tchnology from Rna and ambld in 10x10 QFN/aQFN packag typ at ASE Kaohiung, Taiwan (ASEK). Th PEX8605 (Switch) and USB3380 (Bridg) will b ud a th prim rliability qualification vhicl for th following dvic: PEX8605 and PEX8603 witch; USB3382, USB3381, and USB3380 bridg. Rna 90nm tchnology nod gnrat conitnt and rproducibl prformanc from lot to lot, through a matur fabrication proc, in-lin monitor, and an xcllnt rliability hitory. Th PEX8605 and USB3380 will b ud to paratly qualify thir rpctiv witch and bridg famili. Th 10x10 mm 136L aqfn and 10x10 mm 88L QFN packag i alrady qualifid prviouly via a full packag qualification of th PEX8605-AB50NI G and OXU3102-AANC G dvic (rport attachd hrin). 3. Background information: Wafr Fabrication Information (Rna) Proc Typ CMOS LOGIC (CUP) Gnral Purpo Proc Nam 90nm Numbr of Mtal Layr 6 Lad Fram Information Lad Fram matrial Cu (C7025) Ambly Proc Information (ASEK) Packag Nam USB 3380, USB 2380 QFN (Quad Flat No-Lad Packag) Packag Siz 10x10 Lad Count 88L Lad Fram Pitch 0.4mm Wir Bond Matrial Cu Plating Compoition 100% matt Sn MSL Moitur Snitivity Lvl 3 Packag Nam PEX 8605, PEX 8603, USB 3382 aqfn (Advanc Quad Flat No-Lad Packag) Packag Siz 10x10 Lad Count 136L Lad Fram Pitch 0.5mm Wir Bond Matrial Cu Plating Compoition 100% matt Sn MSL Moitur Snitivity Lvl 3 PLX Tchnology 870 W. Maud Av. 2 Sunnyval, CA

3 4. Di Rult QUALIFICATION PLAN and RESULTS: Th following i th product qualification rult for PEX8605-AB50NI G and th USB3380- AB50NI G dvic. 4.1 High Tmpratur Oprating Lif Tt (JESD B), Condition: Ta= 125 C, Voltag: Vdd max, Sampl Siz: 120 Dvic Lot # Sampl Siz Cycl Rjct Rult 168 hr 0 Pa 0 Pa 500 hr 0 Pa 0 Pa Not Conditional / Full, Compltion : 7/23/ hr 0 Pa 0 Pa Conditional and Full Rliability only rquir 168hr HTOL hr HTOL i for information only. Bad on th Arrhniu quation with Ta = 125 C, Tu = 55 C, CL = 60 % and Ea =0.7 V, th xpctd failur rat in FIT (Failur in Tim) i 25 FIT. PLX Tchnology 870 W. Maud Av. 3 Sunnyval, CA

4 4.2 Elctrotatic dicharg (ESD) Dvic Lot # a. Human Body Modl JESD22-A114F, 2kV, Sampl Siz: 5 Sampl Siz Tt Rjct Rult Not 0 Pa Conditional / Full HBM 2000V USB A-ES Pa Compltion : 7/23/12 Dvic Lot # b. Charg Dvic Modl JESD22-C101D, 500V, Sampl Siz: 5 Sampl Siz Tt Rjct Rult Not 0 Pa Conditional / Full CDM 500V USB A-ES Pa Compltion : 7/23/12 Dvic Lot # c. Machin Modl JESD22-A115A, 200V, Sampl Siz: 5 Sampl Siz Tt Rjct Rult Not 0 Pa Conditional / Full MM 200V USB A-ES Pa Compltion : 7/23/ Latch Up, JESD 78A, +/- 100mA, Sampl Siz: 6 Dvic Lot # Sampl Siz Tt Rjct Rult PEX D-ES Currnt Injction & Ovr USB A-ES Voltag 0 Pa Not 0 Pa Conditional / Full Compltion : 7/23/12 PLX Tchnology 870 W. Maud Av. 4 Sunnyval, CA

5 5. Packag Rult ASEK QFN packag tchnology wa qualifid prviouly by PLX. Th OXU3102-AANC G i ambld in ASEK 10x10 QFN 88L packag tchnology and th attachmnt blow i th packag qualification rult. PLX_310x_Full_Rliab ility Rpo ASEK aqfn packag tchnology wa alo qualifid prviouly by PLX. Th PEX8605-AB50NI G i ambld in ASEK 10x10 aqfn 136L packag tchnology and th attachmnt blow i th packag qualification rult. PEX8605_3andUSB3 380_2_2380_Full_Rl 6.0 CONCLUSION Thi rliability qualification plan appli to th PEX8605/3 and USB3380/2, USB2380 family of product in rviion AB ilicon, all of which ar manufacturd with th am proc tchnology (90nm), packag typ (aqfn/qfn), and matrial. Th PEX8605/USB3380 dvic hav bn utilizd a th qualification vhicl for th family of product which includ: PEX8605-AB50NI G, PEX8603-AB50NI G, USB3382-AB50NI G, USB3381-AB50NI G, and USB3380-AB50NI G. Ba on th rliability data compltd to dat, PLX grant full qualification approval for th ubjct product. 7.0 REVISION HISTORY Rviion Rv. 0 Rv. 1 Rv. 2 1/5/12 7/23/12 9/14/12 PLX Tchnology Orginator Thoma Huang Thoma Huang Thoma Huang 870 W. Maud Av. Commnt Product Rliability Plan. Full Product Rliability Don. Updat HTOL 1000hr Rult (Information Only). 5 Sunnyval, CA