FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16819

Transcription

1 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 Issue Date: -Feb-0 TITLE: Qualification of Serial SPI EEPROM devices CAT and CAT for fabrication at ON Semiconductor s Gresham, Oregon Wafer Fab. PROPOSED FIRST SHIP DATE: -Jun-0 Customers needing additional time to qualify Gresham die will be given 0 more days. AFFECTED CHANGE CATEGORY(S): CAT and CAT (all Packages, all Temperatures) FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Denisa Stefan<denisa.stefan@onsemi.com> SAMPLES: Samples available per Affected Device List table on Page Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Tony Luciani <tony.luciani@onsemi.com> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 0 days of receipt of this notice. To do so, contact <quality@onsemi.com>. DESCRIPTION AND PURPOSE: ON Semiconductor is pleased to announce that, as part of its ongoing effort to improve product availability, the Serial SPI EEPROM devices CAT and CAT are now qualified for production in the 0. µm CMOS EE process at ON Semiconductor s -inch Wafer Fab in Gresham, Oregon, USA. The Gresham Wafer Fab is ISO900:00, ISO/TS99:009 and ISO00:00 certified. Wafers for these devices will also continue to be supplied by our foundry partner OKI Semiconductor, Japan from a -inch line running a 0. µm CMOS EE process. This will provide increased die capacity, improved product performance (higher speed) while maintaining 00% backward compatibility to the previous CAT/ die revisions. This notification and acceptance thereof, allows for the use of either Gresham or OKI die in future shipments under the same OPN. Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 RELIABILITY DATA SUMMARY: QTP: 000, CATM0 Rev A, C Rev A, C Rev E, C Rev C, CAT Rev A, CAT Rev E Product Qual Lot Number Assy Lot Wfr Lot CATM0 lot EBR 0 GAM9._ CATM0 lot EBR 0 GAM9._ CATM0 lot EBR 00 GAM9._ CATM0 lot EBR 0 GAM9._ CATM0 lot N/A GAM9._ CATC lot EBR00 GAM90._ CATC lot EBR 00 GAM90._w CATC lot EBR0 GAM99_w CAT lot 9 EBR09 GAN9._ CAT lot 0 EBR0 GAN09. Package Lot Number Samples hrs 0hrs 000hrs HTOL 0hrs, 0C release lot PASS PASS PASS High Temp Op Life Per JA0 lot PASS PASS PASS Cycling Precon to M lot PASS PASS PASS (x) Tritemp test before and after lot PASS PASS PASS lot PASS PASS PASS lot 9 PASS PASS PASS lot 0 PASS PASS PASS Package Lot Number Samples hrs ELFR Per AEC-Q00-00 lot 00 PASS Early Life Failure Rate HTOL conditions, hrs, 0C lot 00 PASS lot 00 PASS lot 00 PASS Room/Hot testing before and after lot 00 PASS lot 0 00 PASS Package Lot Number Samples 00k 00k 00k 00k 00k EDR NVM Endurance lot PASS PASS PASS PASS PASS Per JESD-A0/Q00-00 M Cycles lot PASS PASS PASS PASS PASS lot PASS PASS PASS PASS PASS lot 9 PASS PASS PASS PASS PASS Room/Hot test before and after lot 0 PASS PASS PASS PASS PASS Package Lot Number Samples 00k 00k 00k 900k M lot PASS PASS PASS PASS PASS lot PASS PASS PASS PASS PASS lot PASS PASS PASS PASS PASS lot 9 PASS PASS PASS PASS PASS lot 0 PASS PASS PASS PASS PASS Wafer Level Endurance Lot Number Samples M M Cycles Wafer lot PASS Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 RELIABILITY DATA QTP 000 Cont d EDR NVM Data Retention Data Lot Number Samples hrs hrs 00hrs 000hrs Package Level lot PASS PASS PASS PASS Per Q hrs, 0C lot PASS PASS PASS PASS "00" lot 9 PASS PASS PASS PASS Room/Hot test before and after Cycling Precon to M lot 0 PASS PASS PASS PASS lot PASS PASS PASS PASS "FF" lot PASS PASS PASS PASS lot 9 PASS PASS PASS PASS lot 0 PASS PASS PASS PASS Wafer Level Data Lot Number Samples 00hrs Bake at C, 00hrs lot PASS "00" Endurance Preconditioning: M Cycles "FF" lot PASS Package Lot Number ss 00V 000V 00V 000V ESD Human Body Model lot /level PASS PASS PASS PASS AEC Q00-00 lot /level PASS PASS PASS PASS lot /level PASS PASS PASS PASS lot /level PASS PASS PASS PASS lot 9 /level PASS PASS PASS PASS lot, units per level lot 0 /level PASS PASS PASS PASS Package Lot Number ss 00V 0V 00V 00V ESD Machine Model lot /level PASS PASS PASS PASS AEC Q00-00 lot /level PASS PASS PASS PASS lot /level PASS PASS PASS PASS lot /level PASS PASS PASS PASS lot 9 /level PASS PASS PASS PASS lot, units per level lot 0 /level PASS PASS PASS PASS Package Lot Number ss 00ma LU Latch Up C C lot PASS PASS ( x ) per AEC-Q00-00 lot PASS PASS lot PASS PASS lot PASS PASS lot 9 PASS PASS Room / Hot testing after LU test lot 0 PASS PASS Package Lot Number ss Result CHAR Per AEC-Q00 lot 0 PASS Characterization lot 0 PASS lot 0 PASS lot 0 PASS lot 0 PASS lot 0 PASS lot 9 0 PASS ( x 0) lot 0 0 PASS The Qualification report is available upon request. Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

4 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 ELECTRICAL CHARACTERISTIC SUMMARY: The new Gresham die (Product Rev. E) is 00% compatible to the corresponding OKI die in the sense of meeting existing data sheet specifications. In addition the Gresham die (Rev E) supports a faster SPI protocol: 0MHz / Vcc=V, Industrial and 0MHz for VCC down to. / Extended Temperature. The product DC / AC specifications, including package availability and Ordering information are available at: A detailed characterization report for each product is available upon request. CHANGED PART IDENTIFICATION: While both Gresham and OKI die will be offered under the same OPN, new package marking will be used only for Gresham die, with OKI die marking continuing unchanged. The Gresham die marking reflects the integration of former CSI (Catalyst) into ON Semiconductor, and provides for easier identification of device and die revision, especially for smaller packages with less room for marking. Die origin will also be identified on the packaging box label by the -digit wafer fabrication country code of CS: US for Gresham and CS: Japan for OKI. The top package marking format for the new Gresham die versus current marking for the OKI die is shown in the Appendix. Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 List of Affected General Parts: Part Number (OPN) Samples Availability CATVI-GT //0 CATVI-G //0 Comments CATVI-GTD //0 Obsolete; use CATVI-GT CATVE-GT //0 CATYI-GT //0 CATYI-G //0 CATYE-GT //0 CATHUI-GT //0 New OPN- Gresham die CATHUE-GT //0 New OPN- Gresham die CATVPI-GT /0/0 Not recommended new designs CATVPE-GT /0/0 Not recommended new designs CATVPIGTD /0/0 Obsolete CATXI-T /0/0 CATXE-T /0/0 CATLI-G /0/0 CATLE-G /0/0 Part Number (OPN) Samples Availability CATVI-GT //0 CATVI-G //0 CATVE-GT //0 CATYI-GT //0 Comments CATYI-GTC //0 Obsolete; use CATYI-GT CATYI-G //0 CATYE-GT //0 CATHUI-GT //0 New OPN- Gresham die CATHUE-GT //0 New OPN- Gresham die CATZDI-GT N/A Not recommended new designs CATXI-T /0/0 CATXI-TC /0/0 Obsolete; use CATXI-T CATXI /0/0 CATXE-T /0/0 CATXE /0/0 CATLI-G /0/0 CATLI-GC /0/0 Obsolete; use CATLI-G CATLE-G /0/0 Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

6 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 Appendix PART IDENTIFICATION CAT Package Marking Gresham die versus actual OKI die OKI 0. (Rev. D ) GRESHAM (Rev. E) CAT -(V,X) D E V : Assembly Location Code : Lead Finish (NiPdAu) : Product Revision -9: Product Code 0: Temp Range : Production Year : Production Month -: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code : Production Year 9: Production Month 0-: Assembly Lot Number CAT TSSOP-(Y) S S E : Product Code : Assembly Location Code : Lead Finish (NiPdAu) : Production Year : Production Month -0: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code : Production Year : Production Month -0: Assembly Lot Number Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

7 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 CAT Package Marking Gresham die versus actual OKI die, Cont d OKI 0. (Rev. D ) GRESHAM (Rev. E) CAT PDIP-(L) D E L ON G : Assembly Location Code : Lead Finish (NiPdAu) : Product Revision -9: Product Code 0: Temp Range : Production Year : Production Month -: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code -0: Assembly Lot Number -: Production Year -: Production Week : Pb-free designator H S CAT TDFN-(VP) S T -: Device code : Assembly location code -: Assembly Lot Number : Production Year : Production Month -: Product Code : Assembly Location Code -: Assembly Lot Number : Production Year : Production Month Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

8 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 CAT Package Marking Gresham die versus actual OKI die, Cont d OKI 0. (Rev. D ) GRESHAM (Rev. E) CAT UDFN-(HU) Not existing S U -: Product Code : Assembly Location Code -: Assembly Lot Number : Production Year : Production Month Issue Date: -Feb-0 Rev. 0-Jan-00 Page of

9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 CAT Package Marking Gresham die versus actual OKI die OKI 0. (Rev. C ) GRESHAM (Rev. E) CAT - (V,X) C E V : Assembly Location Code : Lead Finish (NiPdAu) : Product Revision -9: Product Code 0: Temp Range : Production Year : Production Month -: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code : Production Year 9: Production Month 0-: Assembly Lot Number CAT TSSOP- (Y) S S E : Product Code : Assembly Location Code : Lead Finish (NiPdAu) : Production Year : Production Month -0: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code : Production Year : Production Month -0: Assembly Lot Number Issue Date: -Feb-0 Rev. 0-Jan-00 Page 9 of

10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 CAT Package Marking Gresham die versus actual OKI die, Cont d OKI 0. (Rev. C ) GRESHAM (Rev. E) CAT PDIP- (L) C E L ON G : Assembly Location Code : Lead Finish (NiPdAu) : Product Revision -9: Product Code 0: Temp Range : Production Year : Production Month -: Assembly Lot Number -: Product Code : Product Revision : Assembly Location Code -0: Assembly Lot Number -: Production Year -: Production Week : Pb-free designator CAT TDFN- (ZD) C C H M Not offered 9 0 CCHM: Device code : Assembly location code -: Last three digits of assembly lot number 9: Production Year ( digit) 0: Production Month ( digit): -9, (Jan-Sep) O, N, D (Oct-Dec) -: Two digit country of origin code (TH: Thailand, MY: Malaysia) Issue Date: -Feb-0 Rev. 0-Jan-00 Page 0 of

11 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #9 CAT Package Marking Gresham die versus actual OKI die, Cont d OKI 0. (Rev. C ) GRESHAM (Rev. E) CAT UDFN- (HU) Not existing S U -: Product Code : Assembly Location Code -: Assembly Lot Number : Production Year : Production Month Issue Date: -Feb-0 Rev. 0-Jan-00 Page of