Product Characterization Report. for the. SPX2815 Family of Products
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1 Product Characterization Report for the SPX2815 Family of Products Prepared By: William Chou, Salvador Wu & Greg West Date: November 8, 20
2 SPX2815 Product Family Characterization Report Table of Contents Section Page Introduction 3 Characterization Procedure 3 Data Summary for Key Parameters 4 Conclusions 5 Data Histograms Appendix A Page 2 of 7 11/17/20
3 SPX2815 Product Family Characterization Report Introduction: This product family characterization was done as part of the qualification of Sipex s fabrication site transfer from Sipex s Hillview Fab in Milpitas, CA, to a contract foundry, Silan, in Hangzhou, China. This characterization report summarizes data for key SPX2815 product family characteristics and contains distributions for all parameters. The distributions in Appendix A are arranged so that the Hillview and Silan distributions for a given parameter are adjacent. A distribution for a given parameter shows different temperature data which are at -40ºC, 25ºC, and 85ºC. Wafer Fab: Silan Fab Location: Hangzhou, China Process: Silan bp2 MS: 1593 Characterization Procedure: Silan Lot number(s): MS1593 Hillview Lot number(s): 1055 Temperatures: Ambient (25C), 85C, -40C Tester: ETS300 Test Program: MS1593_SPX2915_33 Page 3 of 7 11/17/20
4 SPX2815 Product Family Characterization Report Data Summary: Key Parameter Across Temperature Data Summary Key Parameter Units Hillview Fab Distribution Mean 25C 4.0: After Final Trim Vref V 6.0: Quiscent_Current Hillview Fab Distribution Variance Hillview Fab Cpk (across temp) Silan Fab Distribution Mean Silan Fab Distribution Variance Silan Fab Cpk (across temp) E E E E- > E- 03 > A 7.0: Line > > Regulation m% 9.0: Load E- Regulation > > m% 10.0: Dropout > > A mv -40C 4.0: After Final V E E Trim Vref 6.0: A 8.535E E- > E- > Quiscent_Current : Line Regulation 9.0: Load Regulation 10.0: Dropout 1.5A 85C 4.0: After Final Trim Vref 6.0: Quiscent_Current 7.0: Line Regulation 9.0: Load Regulation 10.0: Dropout 1.5A m% m% < V E E V E E A 7.684E E- > E-03 > m% > m% V E E Page 4 of 7 11/17/20
5 SPX2815 Product Family Characterization Report Conclusion: Characterization data over temperature and Vcc range show datasheet parameters meet the spec. Cpk s for most parameters are comparable between Hillview and Silan although many show a strong temperature dependence that tends to produce lower Cpk s in this analysis. The performance of SPX2815 parts fabricated at Silan are comparable to the current SPX2815 parts built from the Hillview fab. Page 5 of 7 11/17/20
6 SPX2815 Product Family Characterization Report This page intentionally left blank. Page 6 of 7 11/17/20
7 SPX2815 Product Family Characterization Report Appendix A Characterization Data Histograms Page 7 of 7 11/17/20
8 ROOMHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout ROOM Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% Range E-03 Cp Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_ROO M: N/A MS1055 SPX2815 _ CHAR SILAN BP2 25-SEP-20 ETS300 MS1593_SPX2815_33-0 2
9 ROOMHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout ROOM Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% Range E-03 Cp Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_ROOM: N/A MS1393CZ SP6652CZ _ WS N/A N/A 14-SEP-20 ETS300 MS1593_SPX2815_33-0 2
10 ROOMHistogram: Test.Number=6.0, Test.Name=Quiescent_Current ROOM Min Max Mean 8.4 StdD E-03 25% Mean+3*StdD *StdD Cpk > Skew Statistics: (ma) 90% Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_ROO M: N/A MS1055 SPX2815 _ CHAR SILAN BP2 25-SEP-20 ETS300 MS1593_SPX2815_33-0 3
11 ROOMHistogram: Test.Number=6.0, Test.Name=Quiescent_Current ROOM Min 8.095E-03 Max 8.292E-03 Mean 8.190E-03 StdD E- 25% 8.134E-03 Mean+3*StdD 8.351E-03 3*StdD 8.029E-03 Cpk > Skew Statistics: (A) 90% 8.256E-03 Range E- Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_ROOM: N/A MS1393CZ SP6652CZ _ WS N/A N/A 14-SEP-20 ETS300 MS1593_SPX2815_33-0 3
12 ROOMHistogram: Test.Number=7.0, Test.Name=Line Regulation ROOM Min E-03 Max E-03 Mean E-03 StdD 3.556E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (%) 90% E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_ROO M: N/A MS1055 SPX2815 _ CHAR SILAN BP2 25-SEP-20 ETS300 MS1593_SPX2815_33-0 4
13 ROOMHistogram: Test.Number=7.0, Test.Name=Line Regulation ROOM Min E-03 Max E-03 Mean E-03 StdD 6.012E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (%) 90% E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_ROOM: N/A MS1393CZ SP6652CZ _ WS N/A N/A 14-SEP-20 ETS300 MS1593_SPX2815_33-0 4
14 ROOMHistogram: Test.Number=9.0, Test.Name=Load Regulation ROOM Min E-03 Max 7.100E-03 Mean E-03 StdD 3.917E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (%) 90% 4.350E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_ROO M: N/A MS1055 SPX2815 _ CHAR SILAN BP2 25-SEP-20 ETS300 MS1593_SPX2815_33-0 5
15 ROOMHistogram: Test.Number=9.0, Test.Name=Load Regulation ROOM Min E-03 Max 9.000E-03 Mean E- StdD 4.572E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (%) 90% 7.200E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_ROOM: N/A MS1393CZ SP6652CZ _ WS N/A N/A 14-SEP-20 ETS300 MS1593_SPX2815_33-0 5
16 ROOMHistogram: Test.Number=10.0, Test.Name=Dropout Voltage at 1.5A ROOM Min E-03 Max E-03 Mean E-03 StdD E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (V) 90% E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_ROO M: N/A MS1055 SPX2815 _ CHAR SILAN BP2 25-SEP-20 ETS300 MS1593_SPX2815_33-0 6
17 ROOMHistogram: Test.Number=10.0, Test.Name=Dropout Voltage at 1.5A ROOM Min E-03 Max E-03 Mean E-03 StdD E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (V) 90% E-03 Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_ROOM: N/A MS1393CZ SP6652CZ _ WS N/A N/A 14-SEP-20 ETS300 MS1593_SPX2815_33-0 6
18 COLDHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout COLD Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% Range E-03 Cp Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_COL D: N/A MS1055 SPX2815 _ CHAR SILAN BP2 29-SEP-20 ETS300 MS1593_SPX2815_
19 COLDHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout COLD Min Max Mean 3.3 StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% Range E-03 Cp 0.92 Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_COLD: N/A MS1393CZ SP6652CZ _ WS N/A N/A 29-SEP-20 ETS300 MS1593_SPX2815_33-0 7
20 COLDHistogram: Test.Number=6.0, Test.Name=Quiescent_Current COLD Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk > Skew Statistics: (ma) 90% Range E-03 Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_COL D: N/A MS1055 SPX2815 _ CHAR SILAN BP2 29-SEP-20 ETS300 MS1593_SPX2815_
21 COLDHistogram: Test.Number=6.0, Test.Name=Quiescent_Current COLD Min 8.242E-03 Max 8.655E-03 Mean 8.535E-03 StdD E- 25% 8.484E-03 Mean+3*StdD 8.771E-03 3*StdD 8.298E-03 Cpk > Skew Statistics: (A) 90% 8.616E-03 Range E- Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_COLD: N/A MS1393CZ SP6652CZ _ WS N/A N/A 29-SEP-20 ETS300 MS1593_SPX2815_33-0 8
22 COLDHistogram: Test.Number=7.0, Test.Name=Line Regulation COLD Min E-03 Max E-03 Mean E-03 StdD E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk Skew Statistics: (%) 90% E-03 Range E-03 Cp 2.54 Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1593_COL D: N/A MS1055 SPX2815 _ CHAR SILAN BP2 29-SEP-20 ETS300 MS1593_SPX2815_
23 COLDHistogram: Test.Number=7.0, Test.Name=Line Regulation COLD Min E-03 Max E-03 Mean E-03 StdD E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk Skew Statistics: (%) 90% E-03 Range E-03 Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_COLD: N/A MS1393CZ SP6652CZ _ WS N/A N/A 29-SEP-20 ETS300 MS1593_SPX2815_33-0 9
24 HOTHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout HOT Lot: Wafers MS1593_HO T: N/A Maskset ID Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% 3.3 Range E-03 Cp Cpl Cpu 2.10 Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1055 SPX2815 _ CHAR SILAN BP2 27-SEP- 20 ETS300 MS1593_SPX2815_3 3V_QUAL_DL.09/1 3/20-0 7
25 HOTHistogram: Test.Number=4.0, Test.Name=After Final Trim Vout HOT Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk Skew Statistics: (V) 90% Range E-03 Cp Cpl Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_HOT: N/A MS1393CZ SP6652CZ _ WS N/A N/A 27-SEP-20 ETS300 MS1593_SPX2815_
26 HOTHistogram: Test.Number=6.0, Test.Name=Quiescent_Current HOT Lot: Wafers MS1593_HO T: N/A Maskset ID Min Max Mean StdD E-03 25% Mean+3*StdD *StdD Cpk > Skew Statistics: (ma) 90% Range E-03 Cpu > Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1055 SPX2815 _ CHAR SILAN BP2 27-SEP- 20 ETS300 MS1593_SPX2815_3 3V_QUAL_DL.09/1 3/20-0 8
27 HOTHistogram: Test.Number=6.0, Test.Name=Quiescent_Current HOT Min 7.570E-03 Max 7.840E-03 Mean 7.684E-03 StdD E- 25% 7.618E-03 Mean+3*StdD 7.904E-03 3*StdD 7.464E-03 Cpk > Skew Statistics: (A) 90% 7.758E-03 Range E- Cpu > Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_HOT: N/A MS1393CZ SP6652CZ _ WS N/A N/A 27-SEP-20 ETS300 MS1593_SPX2815_
28 HOTHistogram: Test.Number=7.0, Test.Name=Line Regulation HOT Lot: Wafers MS1593_HO T: N/A Maskset ID Min E-03 Max E-03 Mean E-03 StdD 3.844E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk > Skew Statistics: (%) 90% E-03 Range E-03 Cpu > Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest MS1055 SPX2815 _ CHAR SILAN BP2 27-SEP- 20 ETS300 MS1593_SPX2815_3 3V_QUAL_DL.09/1 3/20-0 9
29 HOTHistogram: Test.Number=7.0, Test.Name=Line Regulation HOT Min E-03 Max E-03 Mean E-03 StdD 8.008E-03 25% E-03 Mean+3*StdD E-03 3*StdD E-03 Cpk Skew Statistics: (%) 90% E-03 Range E-03 Cpu Lot: Wafers Maskset ID Dice Dice R Operation Foundry Process Date Tested Tester Test Program Sequence Retest 1055_HOT: N/A MS1393CZ SP6652CZ _ WS N/A N/A 27-SEP-20 ETS300 MS1593_SPX2815_
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