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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : July Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 1
2 Table of Contents Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. VTI Company Profile VTI Profile MEMS Portfolio CMR3000 Characteristics CMR3000 Block Diagram VTI Business Model 3. Physical Analysis Synthesis of the Physical Analysis Physical Analysis Methodology Package Characteristics & Markings Package Pin-Out Package X-Ray Package Cross-Section Device Structure ASIC Dimensions ASIC Markings ASIC Cross-Section ASIC Delayering ASIC Process Characteristics MEMS Dimensions MEMS Vias MEMS Opening MEMS Sensor MEMS Sensor (Buried Cavities) MEMS Cap MEMS Cross-Section MEMS Process Characteristics Physical Data Summary 4. Manufacturing Process Flow Global Overview ASIC Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Process Overview MEMS Process Flow (c-soi wafer) MEMS Process Flow (Sensor wafer) MEMS Process Flow (Cap wafer) MEMS Process Flow (Wafer Bonding) Packaging Process Flow Description of the MEMS /Packaging Wafer Fabrication Unit 6. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Supply Chain Analysis Yields Explanation Yields Hypotheses Die per wafer & Probe Test ASIC Front-End : Hypotheses ASIC Front-End Cost ASIC Back-End 0 : Probe Test, Backgrinding & Dicing ASIC Die Cost MEMS Front-End : Hypotheses MEMS Front-End Cost MEMS Front-End Cost per Process Steps MEMS Front-End : Equipment Cost per Family MEMS Front-End : Material Cost per Family Back-End 0: Packaging, Probe Test & Dicing Cost Back-End 0 Cost per Process Steps Back-End 0: Die Cost Back-End 1: Final test & Calibration Cost CMR3000 Component Cost (FE + BE 0 + BE 1) 7. Estimated Price Analysis Definition of Prices Manufacturer Financial Ratios CMR3000 Estimated Manufacturer Price CMR3000 Estimated Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 2
3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the VTI CMR3000 component. The CMR3000 is a triple-axis MEMS gyroscope manufactured using a SOI bulk micromachining process. The component is suitable for further applications requiring battery operation (Gaming input devices, Computer peripherals and remote controllers, Mobile Phones) Compatible with SMD process, the CMR3000 is provided in a 4.1x3.1x0.83mm WLP 10-pin package by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 3
4 Package Characteristics & Markings Package type: 10-pin WLP Dimensions: 4.10mm x 3.10mm x 0.83mm Pin pitch: 0.50mm Marking: CMR Package Top view Package side view Package back view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 4
5 Package Pin-Out CMR3000 sensing directions (from datasheet) CMR3000 pin number (from datasheet) CMR3000 Pin Descriptions (from datasheet) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 5
6 1.68mm ASIC Dimensions 2.48mm Die area: 4.16mm² Total Pads nb : by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 6
7 MEMS Cap MEMS Cap Overview MEMS cap details SEM View MEMS cap details SEM View 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 7
8 MEMS Cross-Section 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 8
9 MEMS Process Flow (c-soi Wafer) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 9
10 Main steps of economic analysis Front-End ASIC Front-End Cost MEMS Front-End Cost Back-End 0 Probe Test Cost Backgrinding & Dicing Cost Packaging Cost Probe Test & Dicing Cost Back-End 1 Final Test & Calibration Cost Component Cost CMR3000 We perform the economic analysis of the ASIC with the IC Price+ software. We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 10
11 ASIC Die Cost (Front-End + Back-End 0) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 11
12 MEMS Front-End Cost 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 12
13 CMR3000 Component Cost (FE + BE 0 + BE 1) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR Axis MEMS Gyroscope 13
21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :
21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr April 2013 - Version 1 Written by: Romain FRAUX DISCLAIMER : System
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