STMicroelectronics LISY300AL Single-Axis Analog Yaw Rate Gyroscope

Size: px

Start display at page:

Download "STMicroelectronics LISY300AL Single-Axis Analog Yaw Rate Gyroscope"

Maximilian Jordan
5 years ago
Views:

1 Single-Axis Analog Yaw Rate Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Package 2.2 Inside the Package 2.3 ASIC Die 2.4 MEMS Cavity Gases 2.5 GK02A Lid and Die 3 Control ASIC Basic Process Analysis 3.1 Overview 3.2 General Structure and P-Well 3.3 STI and Poly and Transistors 3.4 Metallization, Contacts, and MIM Capacitor 3.5 Dielectrics 4 GK02A MEMS Lid and Die Assembly 4.1 Device Structure 4.2 Bond Pads 4.3 Lid Attach 5 GK02A MEMS Process Analysis 5.1 General Device Structure 5.2 Dielectrics 5.3 Polysilicon and Metal 5.4 Polysilicon Anchors and Contacts 6 GK02A MEMS Architectural Analysis 6.1 GK02A Architectural Overview

3 MEMS Process Review 7 Critical Dimensions 7.1 Critical Dimensions 7.2 GK02A Lid and Die Critical Dimensions 7.3 ASIC Critical Dimensions 8 References 9 Statement of Measurement Uncertainty and Scope Variation Report Evaluation

4 Overview Overview 1.1 List of Figures 2 Device Overview Top Package View Bottom Package View Plan-View Package X-Ray Side-View Package X-Ray Composite Package Cross Section Package PCB Detail GK02A MEMS Gyroscope Die and ASIC Plan View GK02A Lid Cut-Out Tilt View GK02A Lid Cut-Out Detailed Tilt View MEMS Ball Bond Optical Cross Section MEMS Ball Bonds SEM Tilt View ASIC Die Photograph ASIC Die Markings ASIC Die Corner ASIC Minimum Pitch Bond Pads ASIC Bipolar Transistors Underside of Lid SEM Tilt View Underside of GK02A Lid Optical GK02A MEMS Die Photograph GK02A MEMS Die at Substrate GK02A Functional Layout GK02A Die Marking A GK02A Die Marking B GK02A Minimum Pitch Bond Pads 3 Control ASIC Basic Process Analysis General Structure and P-Well STI and Poly Minimum NMOS Transistor Minimum Pitch Poly Metal 1 and Metal Metal Metal MIM Capacitor Via 1 and Minimum Pitch Contacts PMD, IMD, and Passivation Layers

5 Overview GK02A MEMS Lid and Die Assembly Annotated Device Cross-Sectional Planes GK02A MEMS Device Optical (S6) Left Edge of GK02A MEMS Device (S5) Right Edge of GK02A MEMS Device (S5) GK02A MEMS Cavity Detail (S5) GK02A Cross Section SCM GK02A Bond Pad Optical (S10) GK02A Au Ball on Al Bond Pad (S9) Pb Glass Frit Hermetic Lid Seal Detail (S4) 5 GK02A MEMS Process Analysis MEMS Annotated Die Photograph GK02A MEMS General Structure (S10) GK02A MEMS General Structure (S8) Right Die Edge and Substrate Ground Contact (S6) Oxide 1 (S10) Nitride 1 and Oxide 2 (S10) Nitride 2 and Trench Bottom (S9) Nitride 3 and Trench Top (S9) Minimum Pitch Poly 1 Plan View Poly 2 (S9) Drive Electrodes Plan View Minimum Width Poly 2 (S8) Metal (S4) Minimum Width Metal Plan View Minimum Width Anchor (S8) Substrate Ground Contact (S4) 6 GK02A MEMS Architectural Analysis GK02A MEMS Device Plan View GK02A MEMS Spring-Mass Structure Plan View GK02A MEMS Spring-Mass Structure Tilt View GK02A MEMS Spring-Mass Structure Upper Left Tilt View GK02A MEMS Outer Suspension Spring Tilt View GK02A MEMS Detection Mass Suspension Spring Plan View GK02A MEMS Air Bridge Tilt View

6 Overview List of Tables 1 Overview Angular Rate Sensor Specification Device Summary MEMS Gyroscope Control ASIC MEMS Gyroscope Die MEMS Lid Control ASIC Die 2 Device Overview ASIC Die Dimensions GK02A Lid and Die Dimensions 3 Control ASIC Basic Process Analysis Observed ASIC Critical Dimensions 5 GK02A MEMS Process Analysis Dielectric Layer Thickness Aluminum and Polysilicon Dimensions Via and Contact Dimensions 7 Critical Dimensions Dimensions GK02A Lid and Die Horizontal Dimensions Dielectric Layer Thickness Aluminum and Polysilicon Dimensions Via and Contact Dimensions ASIC Die Dimensions Observed ASIC Critical Dimensions

7 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com

Philips SAA7118E Multi Standard Video Decoder Process Review

March 31, 2006 Philips SAA7118E Multi Standard Video Decoder Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor