G. H. Raisoni College of Engineering,Nagpur (An Autonomous Institute affiliated to Rashtrasant Tukadoji Maharaj Nagpur University)

Size: px
Start display at page:

Download "G. H. Raisoni College of Engineering,Nagpur (An Autonomous Institute affiliated to Rashtrasant Tukadoji Maharaj Nagpur University)"

Transcription

1 G. H. Raisoni College of Engineering,Nagpur (An Autonomous Institute affiliated to Rashtrasant Tukadoji Maharaj Nagpur University) Report on GIAN Workshop on MEMS for BioMechanics and BioRobotics at VNIT, Nagpur Dr. Shubhangi Giripunje, Prof. Sonali Joshi, Prof.Rahul Agrawal has attended GIAN workshop on MEMS for Biomechanics and BioRobotics from 4 th Dec-8 th Dec 2017, organized by VNIT, Nagpur. The workshop was started with inauguration on 4/12/17 with the gracious presence of Dr. Shuji Tanaka, Department of Robotics, Microsystem Integration Center, Tohoku University, Dr.N.S.Chaudhari,Director,VNIT, Dr.K.M.Bhurchandi, Dr. R.B.Deshmukh, & Dr.R.M.Patrikar. Inauguration of workshop The five days scheduled divided in theory classes, demonstration of Lab facilities for fabrication and hands on practice which was conducted by Dr. Shuji Tanaka, Dr. R.M. Patrikar and Dr. R.B.Deshmukh. Day1 : Session 1: Lecture taken by Dr. Shuji Tanaka on topic Overview of MEMS and Applications. The following topics are covered by him: Home Game Consoles Revolution of TV Game by MEMS Electronics in Smartphone Structure of Accelerometer Mechanism of Accelerometer MEMS Vibratory Gyroscope Vehicle Stability Control (Toyota Motor) Mechanism of Gyroscope Energy Loss and Quality Factor

2 Anchor Loss Integrated Inertia Sensors (Analog Devices) Wafer-level Batch Production of MEMS Photolithography Fabrication Technology Unique to MEMS MEMS Microphone Thermal Inkjet Printer (Canon) Digital Micromirror Device (TI) Fabrication Process of New DMD Day1: Session 2: MEMS Trends in Industry by Dr. Tanaka MEMS Downsizing by Advanced Packaging Wafer-Level Packaging: Bonding Methods Sensor Module: ST Sensor Tile Importance of Module in Business MEMS Company Ranking Layer Poly Silicon MEMS (Robert Bosch) MEMS-LSI Integration Platform (Inven Sense) Our MEMS-LSI Integration Platform Multi Sensors Based on EpiSeal Applications Needing High Performance Gyro MEMS Vibratory Gyroscope Performance of Gyroscopes Feedback System of Mode-Matched Gyro Sensor Platform LSI HIROSE TSV in Multi Project Wafer for Integrated MEMS Day1:Session 3: Hands on COMSOL Software for cantilever Based Gas Sensors by Prof.Akansha Singh Comsol Multiphysics Software tool For Distance Measurement in Sensors FEM Concept

3 Day2 : Lecture taken by Dr. Shuji Tanaka on topic MEMS Fabrication Process. The Following topics covered are : Silicon Accelerometer Bulk and Surface Micromachining Micro Flow Meter Various Structures by Anisotropic Wet Etching Earliest Surface-Micromachined MEMS: Resonant Vapor Sensor Thin-Film-Packaged Resonator SCREAM SCREAM Electrostatic Lens Examples of MEMS Packaging Why Wafer-Level Packaging for MEMS Bonding Methods Anodic Bonding First MEMS Accelerometer Capacitive Accelerometer Integrated Capacitive Pressure Sensor Feedthrough s in Glass Capping Wafer Glass Drilling Methods Electrical Connection using Porous Au Bumps Wafer-Level Packaging of FBAR (Avago) Pretreatment for Cu-Cu Themocomp. Bonding Au-Si Eutectic Bonding SiC Diaphragm Pressure Sensor Bonding Methods Wafer-Level Packaging of Accelerometers. Epi-poly Si Technology

4 Poly-SiGe Above-CMOS MEMS: Process (IMEC) Day2:Session2 Lecture taken by Dr. Shuji Tanaka on topic LSI Integration with MEMS.The Following points are covered: Why Is MEMS-CMOS Integration Needed Integrated Capacitive Pressure Sensor. Integrated Piezoresistive Pressure Sensor Two-Wire Pressure Sensor for Catheters Poly-Si Surface Micromachining Digital Micromirror Device Driving Method of Digital Micromirror Device Resonant Gate Transistor (Westinghouse) Day2:Session3: Dr. Shuji Tanaka discussed on MEMS Application Idea for Mini Contest. Day3 : Lecture taken by Dr. Shuji Tanaka on topic Transducers for MEMS. The Following points are discussed: Piezoresistive Effect Piezoresistive Effect of Silicon Piezoresistive Silicon Pressure Sensor Temperature Coefficient of Sensitivity Gap-Closing-Type Electrostatic Actuator Pull-in of Electrostatic Actuator Comb-Type Electrostatic Actuator Scaling of Electrostatic Actuators Time Dependent Dielectric Breakdown (TDDB) Breakdown Voltage Dependence on Electrode Charge-up Problem and Its Preventive Measures Charge Up Avoidance for Electrostatic Actuator PZT: Lead Zirconate Titanate Applied Electric Filed vs. Induced Strain Single Crystal vs. Polycrystal Transducers for Electromechanical Resonators FD Product Day3: Session 3: Hands on Lab on Chip Fabrication by Prof.T.Pravinraj who demonstrated how to design the layout on PCB, fabrication.

5 Day4 :Mini contest was conduct on MEMS Application. Total 8 teams have participated and they have presented the following projects: MEMS for Beauty & Beast ICT based Disease Detection using pulse MEMS For Child Safety I See( For Blind) Womb health detection System For over speeding detection and safety for people Superpointer Wearable Gas sensor(health band) In this competition GHRCE group presented on ICT based Disease Detection using pulse and won third prize in MINI Contest. Mini contest certificate received by the hands of Dr. Tanaka Day4 : Session 2 Lecture taken by Dr. Shuji Tanaka on topic Overview of Piezoelectric MEMS. The Following are the Topics Covered by him Piezoelectric MEMS in and near Market PZT MEMS Gyroscope (Panasonic) HDD Head Actuator (TDK-SAE Magnetics) Actuation Types of Micromirror Device Electromagnetic Micromirror (Microvision) PZT Micromirror (Stanley) Laser Projector Using Micromirror Device MEMS Scanning Micromirror for LIDER PZT Scanning Micromirror for Endscopic OCT Varifocal Liquid Lens with PZT Actuator

6 Thermally-Actuated RF MEMS Switch Challenges of RF MEMS Switch Contact Resistance of Ohmic Switch PZT Cantilever Actuator Wireless RF Front-End of Cellphone (2G + 3G) Day5: Session 1:Lecture taken by Dr. R.M.Patrikar on topic System on Chip design Flow. Following points are covered System Overview of MEMS Applications Advantages Importance of MEMS and CMOS integration Day5: Session 2: Lecture taken by Dr. R.B.Deshmukh on topic Fundamentals of BioMehanics and BioRobotics applications. The following points are covered Stochastic process Bio-inspired System Real time Problems Day5: Session 3: Hands on taken by Prof.Ravi Solanke on CADENCE SOC Design for MEMS Application using CAD tools following points are covered CMOS and MEMS Integration CMOS layout Designing SKILL language using Cadence Virtuoso Terminologies Automated Layout designing. Some Programming Hands on Dr. Shubhangi Giripunje Prof. Sonali Joshi Prof. Rahul Agrawal

7 Mini Contest on MEMS Application

8

9 Certificate of participant

10

MEMS Sensors for Smart Living: ITRI Solutions. Chris Chen, ITRI

MEMS Sensors for Smart Living: ITRI Solutions. Chris Chen, ITRI MEMS Sensors for Smart Living: ITRI Solutions Chris Chen, ITRI MEMS Sensors for Smart Living Outline Sensors are Everywhere What MEMS Sensors are Most Required Smart Living Megatrend Herald Next Wave of

More information

MEMS for automotive and consumer electronics

MEMS for automotive and consumer electronics MEMS for automotive and consumer MEMS for automotive and consumer electronics Dr. Jiri Marek Senior Vice President Engineering Sensors Robert Bosch GmbH, Automotive Electronics 1 Automotive Electronics

More information

Design and Technology Solutions for Development of SiGeMEMS devices. Tom Flynn Vice President, Sales Coventor

Design and Technology Solutions for Development of SiGeMEMS devices. Tom Flynn Vice President, Sales Coventor Design and Technology Solutions for Development of SiGeMEMS devices Tom Flynn Vice President, Sales Coventor Special thanks to: Stephane Donnay, Program Manager, imec Gerold Schropfer, Director, Foundary

More information

MEMS for Automotive and Consumer Applications

MEMS for Automotive and Consumer Applications MEMS for Automotive and Consumer Applications AE/NE4 Dr. Jiri Marek Senior Vice President, Sensors Robert Bosch GmbH IEEE EDS Mini Colloquium, Stuttgart, IMS Chips, June 2010 1 Agenda Introduction MEMS

More information

Instrumentation & Data Acquisition Systems

Instrumentation & Data Acquisition Systems Instrumentation & Data Acquisition Systems Section 4 - Pressure Robert W. Harrison, PE Bob@TheHarrisonHouse.com Made in USA 1 Definition of Pressure Pressure is the amount of force applied perpendicular

More information

Sensorik für Inertiale Messtechnik

Sensorik für Inertiale Messtechnik Sensorik für Inertiale Messtechnik Daniel Meisel Robert Bosch GmbH NAVIGARE 2012 1 Outline The Bosch Group Automotive MEMS Inertial Sensors Automotive Applications Technology Packaging and Roadmaps Bosch

More information

Concurrent Design to Achieve High Performance and Low Cost: Case Study of a MEMS Automotive Pressure Sensor Design Presented by David DiPaola, Managing Director, DiPaola Consulting Moderated by Rob O'Reilly,

More information

Freescale Semiconductor MMA6222AEG ±20/20g Dual-Axis Medium-g Micromachined HARMEMS Accelerometer

Freescale Semiconductor MMA6222AEG ±20/20g Dual-Axis Medium-g Micromachined HARMEMS Accelerometer Freescale Semiconductor MMA6222AEG ±20/20g Dual-Axis Medium-g Micromachined HARMEMS Accelerometer MEMS Process Review For comments, questions, or more information about this report, or for any additional

More information

Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters. Roy Knechtel, Sophia Dempwolf, Holger Klingner

Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters. Roy Knechtel, Sophia Dempwolf, Holger Klingner 10.1149/07509.0255ecst The Electrochemical Society Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters Roy Knechtel, Sophia Dempwolf, Holger Klingner X-FAB MEMS Foundry

More information

STMicroelectronics LISY300AL Single-Axis Analog Yaw Rate Gyroscope

STMicroelectronics LISY300AL Single-Axis Analog Yaw Rate Gyroscope Single-Axis Analog Yaw Rate Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please

More information

Level MEASUREMENT 1/2016

Level MEASUREMENT 1/2016 Level MEASUREMENT 1/2016 AGENDA 2 A. Introduction B. Float method C. Displacer method D. Hydrostatic pressure method E. Capacitance method G. Ultrasonic method H. Radar method I. Laser method J. Level

More information

IE039: Practical Process Instrumentation & Automatic Control

IE039: Practical Process Instrumentation & Automatic Control IE039: Practical Process Instrumentation & Automatic Control IE039 Rev.001 CMCT COURSE OUTLINE Page 1 of 8 Training Description: Process Control & Instrumentation is becoming an increasingly important

More information

The World Leader in High Performance Signal Processing Solutions MEMS Webcast

The World Leader in High Performance Signal Processing Solutions MEMS Webcast The World Leader in High Performance Signal Processing Solutions MEMS Webcast October, 2013 High Performance Inertial Sensors Sensor Trends Mark Martin VP, MEMS / Sensors Growth Opportunities Products

More information

ACCURATE PRESSURE MEASUREMENT FOR STEAM TURBINE PERFORMANCE TESTING

ACCURATE PRESSURE MEASUREMENT FOR STEAM TURBINE PERFORMANCE TESTING ACCURATE PRESSURE MEASUREMENT FOR STEAM TURBINE PERFORMANCE TESTING Blair Chalpin Charles A. Matthews Mechanical Design Engineer Product Support Manager Scanivalve Corp Scanivalve Corp Liberty Lake, WA

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr November 2015 Version 1 - Written by Romain

More information

March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 5

March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 5 March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 5 2017 BiTS Workshop Image: tonda / istock Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings

More information

Get Instant Access to ebook Practical Mems PDF at Our Huge Library PRACTICAL MEMS PDF. ==> Download: PRACTICAL MEMS PDF

Get Instant Access to ebook Practical Mems PDF at Our Huge Library PRACTICAL MEMS PDF. ==> Download: PRACTICAL MEMS PDF PRACTICAL MEMS PDF ==> Download: PRACTICAL MEMS PDF PRACTICAL MEMS PDF - Are you searching for Practical Mems Books? Now, you will be happy that at this time Practical Mems PDF is available at our online

More information

THIẾT KẾ VI MẠCH TƯƠNG TỰ CHƯƠNG 2: CMOS Technology

THIẾT KẾ VI MẠCH TƯƠNG TỰ CHƯƠNG 2: CMOS Technology THIẾT KẾ VI MẠCH TƯƠNG TỰ CHƯƠNG 2: CMOS Technology Hoàng Trang-bộ môn Kỹ Thuật Điện Tử hoangtrang@hcmut.edu.vn 1 TP.Hồ Chí Minh 12/2011 1. Overview - IC technology - CMOS vs BJT Hoàng Trang-bộ môn Kỹ

More information

Bosch IMU in iphone X IMU Sensor

Bosch IMU in iphone X IMU Sensor Bosch IMU in iphone X IMU Sensor MEMS report by Audrey LAHRACH January 2018 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr IMU Bosch in iphone X

More information

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website : 21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr April 2013 - Version 1 Written by: Romain FRAUX DISCLAIMER : System

More information

Analysis of MEMS Diaphragm of Piezoresistive Intracranial Pressure Sensor

Analysis of MEMS Diaphragm of Piezoresistive Intracranial Pressure Sensor Analysis of MEMS Diaphragm of Piezoresistive Intracranial Pressure Sensor S.H.Abdul Rahman, N.Soin- IEEE Member and F. Ibrahim, IEEE Member. Abstract In the present paper, the design and simulation of

More information

ECE520 VLSI Design. Lecture 9: Design Rules. Payman Zarkesh-Ha

ECE520 VLSI Design. Lecture 9: Design Rules. Payman Zarkesh-Ha ECE520 VLSI Design Lecture 9: Design Rules Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Interconnect

More information

IE011: Process Control & Instrumentation Technology

IE011: Process Control & Instrumentation Technology IE011: Process Control & Instrumentation Technology IE011 Rev.001 CMCT COURSE OUTLINE Page 1 of 8 Training Description: This intensive course covers fundamental and practical of instrumentation measurements

More information

ESAIL D45.1 Final Report of Remote Unit Gas Thruster

ESAIL D45.1 Final Report of Remote Unit Gas Thruster D45.1 Final Report of Remote Unit Gas Thruster Work Package: WP 45 Version: Version 1.2 Prepared by: NanoSpace AB, Kristoffer Palmer, Tor-Arne Grönland Time: Uppsala, November 8 th, 2013 Coordinating person:

More information

TEPZZ A_T EP A1 (19) (11) EP A1 (12) EUROPEAN PATENT APPLICATION. (51) Int Cl.: G01L 9/00 ( )

TEPZZ A_T EP A1 (19) (11) EP A1 (12) EUROPEAN PATENT APPLICATION. (51) Int Cl.: G01L 9/00 ( ) (19) TEPZZ 796844A_T (11) EP 2 796 844 A1 (12) EUROPEAN PATENT APPLICATION (43) Date of publication: 29..2014 Bulletin 2014/44 (51) Int Cl.: G01L 9/00 (2006.01) (21) Application number: 13165416.2 (22)

More information

Project Title: Pneumatic Exercise Machine

Project Title: Pneumatic Exercise Machine EEL 4924 Electrical Engineering Design (Senior Design) Preliminary Design Report 27 January 2011 Project Title: Pneumatic Exercise Machine Team Members: Name: Gino Tozzi Name: Seok Hyun (John) Yun Email:

More information

Introduction to Pressure Measurement

Introduction to Pressure Measurement Introduction to Pressure Measurement FG05W5 Version 1.3 2010 Standards Certification Education & Training Publishing Conferences & Exhibits Seminar Logistics Seminar materials Downloadable presentation

More information

Usage Policies Notebook for Xenon Difluoride (XeF 2 ) Isotropic Si Etch

Usage Policies Notebook for Xenon Difluoride (XeF 2 ) Isotropic Si Etch Usage Policies Notebook for Xenon Difluoride (XeF 2 ) Isotropic Si Etch Revision date September 2014 2 Emergency Plan for XeF 2 Si Etcher Standard Operating Procedures for Emergencies Contact information

More information

Real-time Wobbe Index Determination of Natural Gas. J.C. Lötters Bronkhorst

Real-time Wobbe Index Determination of Natural Gas. J.C. Lötters Bronkhorst Real-time Wobbe Index Determination of Natural Gas J.C. Lötters Bronkhorst Real-time Wobbe index determination of gas mixtures Joost Lötters Professor Chief Technology Officer Microfluidic handling systems

More information

Training Fees 3,400 US$ per participant for Public Training includes Materials/Handouts, tea/coffee breaks, refreshments & Buffet Lunch.

Training Fees 3,400 US$ per participant for Public Training includes Materials/Handouts, tea/coffee breaks, refreshments & Buffet Lunch. Training Title DISTRIBUTED CONTROL SYSTEMS (DCS) 5 days Training Venue and Dates DISTRIBUTED CONTROL SYSTEMS (DCS) Trainings will be conducted in any of the 5 star hotels. 5 22-26 Oct. 2017 $3400 Dubai,

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr July 2011 - Version 1 Written by: Romain FRAUX DISCLAIMER

More information

Instrumentation & Data Acquisition Systems

Instrumentation & Data Acquisition Systems Instrumentation & Data Acquisition Systems Section 3 -Level Robert W. Harrison, PE Bob@TheHarrisonHouse.com Made in USA 1 Level Section Question Which level measuring technology is the best solution when

More information

1001ICT Introduction To Programming Lecture Notes

1001ICT Introduction To Programming Lecture Notes 1001ICT Introduction To Programming Lecture Notes School of Information and Communication Technology Griffith University Semester 2, 2015 1 4 Lego Mindstorms 4.1 Robotics? Any programming course will set

More information

IE068: Process Instrumentation Technology

IE068: Process Instrumentation Technology IE068: Process Instrumentation Technology IE068 Rev.002 CMCT COURSE OUTLINE Page 1 of 8 Training Description: This course covers fundamental and practical of instrumentation measurements including Flow

More information

Fig. 1: Mechanical vacuum gauge (left) and capacitive vacuum gauge (right)

Fig. 1: Mechanical vacuum gauge (left) and capacitive vacuum gauge (right) Dear Readers! This is your 4pvd Newsletter. We hope you enjoy the information it contains. If you wish to unsubscribe, please send a blank Email to unsubscribe@4pvd.de June 1 st, 2006, Issue No. 24 Principles

More information

MS52XX-C&T SMD Pressure Sensor

MS52XX-C&T SMD Pressure Sensor 1, 4, and 7 bar absolute pressure range Piezoresistive silicon micromachined sensor Surface mount 6.2 x 6.4 mm LCP plastic cap for easy connection Uncompensated Optional trimmed offset Low noise, high

More information

Pressure Measurement. Introduction. Engr325 Instrumentation. Dr Curtis Nelson 3/12/18

Pressure Measurement. Introduction. Engr325 Instrumentation. Dr Curtis Nelson 3/12/18 3/12/18 Pressure Measurement Engr325 Instrumentation Dr Curtis Nelson Introduction A cluster of 72 helium-filled balloons over Temecula, California in April of 2003. The helium balloons displace approximately

More information

Design, Simulation and Analysis of MEMS Parallel Plate Capacitors for Pressure Measurement

Design, Simulation and Analysis of MEMS Parallel Plate Capacitors for Pressure Measurement International Journal of Engineering Research and Development e-issn: 2278-067X, p-issn: 2278-800X, www.ijerd.com Volume 5, Issue 12 (February 2013), PP. 35-41 Design, Simulation and Analysis of MEMS Parallel

More information

SAES Packaging service. making innovation happen, together

SAES Packaging service. making innovation happen, together SAES Packaging service MEMS Packaging service description Facility and operations Capabilities and future prospective Choose your type of service : Fast prototyping Process developments Packaging foundry

More information

TEPZZ 6 7ZZ7A_T EP A1 (19) (11) EP A1 (12) EUROPEAN PATENT APPLICATION. (51) Int Cl.: G01L 9/00 ( ) G01L 27/00 (2006.

TEPZZ 6 7ZZ7A_T EP A1 (19) (11) EP A1 (12) EUROPEAN PATENT APPLICATION. (51) Int Cl.: G01L 9/00 ( ) G01L 27/00 (2006. (19) TEPZZ 6 7ZZ7A_T (11) EP 2 637 007 A1 (12) EUROPEAN PATENT APPLICATION (43) Date of publication: 11.09.13 Bulletin 13/37 (1) Int Cl.: G01L 9/00 (06.01) G01L 27/00 (06.01) (21) Application number: 1218617.6

More information

MANUAL FOR SPTS APS (DIELECTRICS ETCHER)

MANUAL FOR SPTS APS (DIELECTRICS ETCHER) MANUAL FOR SPTS APS (DIELECTRICS ETCHER) To be read first: SPTS APS is an etcher dedicated to dielectrics (SiO 2, Si 3 N 4, glass types...). Dielectrics etching in AMS200 is no more CMi standard. AMS200

More information

AMS 6916 Board mount pressure sensor with ratiometric analog output

AMS 6916 Board mount pressure sensor with ratiometric analog output FEATURES Piezoresistive pressure sensor with amplified analog output Calibrated and temperature compensated Ratiometric voltage output, 0.5 4.5 V Digital signal conditioning, 12 bit output resolution Differential,

More information

Pressure measurement explained

Pressure measurement explained Rev A1, May 25 th, 2018 Sens4Knowledge Sens4 A/S Nordre Strandvej 119 G 3150 Hellebaek Denmark Phone: +45 8844 7044 Email: info@sens4.com www.sens4.com Introduction Pressure is defined as the force per

More information

Design and Development of Pressure Sensing Bandage

Design and Development of Pressure Sensing Bandage GRD Journals- Global Research and Development Journal for Engineering Volume 2 Issue 5 April 2017 ISSN: 2455-5703 Design and Development of Pressure Sensing Bandage Pudhumozhi Subramanian Department of

More information

Pressure Measurement

Pressure Measurement Pressure Measurement Manometers Sensors, Transducers Ashish J. Modi Lecturer, Dept. of Mech.Engg., Shri S.V.M. inst. Of Technology, Bharuch Pressure Pressure is a force per unit area exerted by a fluid

More information

Field Instrumentation Training Strategy

Field Instrumentation Training Strategy Field Instrumentation Training Strategy 21 st Nico Marneweck 082 883 2652 Kallie Bodenstein 083 226 2787 Marco Coccioni 072 409 5779-1 - Introduction Training customised for the South Africa Industrial

More information

Specifications. The Field:

Specifications. The Field: ME 218b Winter 2008 Project: SPDL Happy Fun Ball Project Preview on February 29, 2008 6-10 pm (in SPDL) Grading Session on March 4, 2008 6-10 pm (in SPDL) Project Presentations on March 5, 2008 starting

More information

Lab 1c Isentropic Blow-down Process and Discharge Coefficient

Lab 1c Isentropic Blow-down Process and Discharge Coefficient 058:080 Experimental Engineering Lab 1c Isentropic Blow-down Process and Discharge Coefficient OBJECTIVES - To study the transient discharge of a rigid pressurized tank; To determine the discharge coefficients

More information

Technical Explanation

Technical Explanation Technical Explanation for ESI Pressure Sensors Technical Explanation What is a pressure transmitter? A pressure transmitter (also called pressure transducer or pressure converter) is a component used to

More information

AMS 2710 PCB pressure sensor module with V output

AMS 2710 PCB pressure sensor module with V output FEATURES Universal pressure sensor module with 0.. 10 V voltage output Fully calibrated and temperature compensated sensor module Variants for (bidirectional) differential, gage, absolute and barometric

More information

Plasma Cleaner. Yamato Scientific America. Contents. Innovating Science for Over 125 Years. Gas Plasma Dry Cleaner PDC200/210/510 PDC610G.

Plasma Cleaner. Yamato Scientific America. Contents. Innovating Science for Over 125 Years. Gas Plasma Dry Cleaner PDC200/210/510 PDC610G. Yamato Scientific America Innovating Science for Over 125 Years Plasma Cleaner Contents Gas Plasma Dry Cleaner PDC200/210/510 PDC610G Gas Plasma Reactor 145 146 147 149 144 Gas Plasma Dry Cleaner Plasma

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 Switch Model of NMOS Transistor V GS Gate CPE/EE 47, CPE 57 VLSI Design I L0: IC Manufacturing Source (of carriers) Drain (of carriers) Department of Electrical and Computer Engineering University of Alabama

More information

Specifications for the CMI 2409 Magnetocardiograph

Specifications for the CMI 2409 Magnetocardiograph Specifications for the CMI 2409 Magnetocardiograph Revision date April 14, 2006 1 518-381-1000 (tel) The CMI-2409 system consists of a holder (A), a patient bed (B) and a workstation (not shown in the

More information

Radar, Ultrasonic and RF Level Transmitters

Radar, Ultrasonic and RF Level Transmitters Radar, Ultrasonic and RF Level Transmitters Both measures the time it takes the wave to travel between the transmitter and that reflected wave off the surface of the material to reach the transmitter again.

More information

The Criticality of Cooling

The Criticality of Cooling Reliability Solutions White Paper January 2016 The Criticality of Cooling Utilities, power plants, and manufacturing facilities all make use of cooling towers for critical heat transfer needs. By cycling

More information

BS12N Piezoresistive OEM Pressure Sensor

BS12N Piezoresistive OEM Pressure Sensor BS12N Piezoresistive OEM Pressure Sensor Model: BS12N-1 Model: BS12N-2 Feature Pressure range (-0.1~60)Mpa; Pressure reference: Gauge, absolute and sealed gauge; Constant current power supply; Isolated

More information

Pressure measurement. Absolute pressure D Gauge pressure C Atmospheric pressure

Pressure measurement. Absolute pressure D Gauge pressure C Atmospheric pressure Pressure measurement Pressure measurement is a very common requirement for most industrial process control systems and many different types of -sensing and -measurement systems are available. However,

More information

Course Title: Concept DVD System Duration: 2 days This training course is designed to provide the necessary level of competence for mobile speed enforcement camera operators in the use of Tele-Traffic

More information

Yokogawa Systems and PCI Training

Yokogawa Systems and PCI Training Yokogawa Systems and PCI Training 09 th December 2014 Nico Marneweck 082 883 2652 Kallie Bodenstein 083 226 2787 Marco Coccioni 072 409 5779-1 - Introduction Training customised for the South Africa Industrial

More information

Sense Element Pump Ripple Fatigue

Sense Element Pump Ripple Fatigue white paper Sense Element Pump Ripple Fatigue Providing and analyzing solutions to protect sensitive components in aircraft hydraulic systems from prolonged exposure to pump ripple. 2 CONTENTS Sense Element

More information

HASTAC High stability Altimeter SysTem for Air data Computers

HASTAC High stability Altimeter SysTem for Air data Computers HASTAC High stability Altimeter SysTem for Air data Computers André Larsen R&D Director Memscap Sensor Solution SIXTH FRAMEWORK PROGRAMME PRIORITY 4 Aeronautics and Space EC contract no. AST4-CT-2005-012334

More information

UK Opportunities in SiD Calorimetry

UK Opportunities in SiD Calorimetry UK Opportunities in SiD Calorimetry Paul Dauncey Imperial College London 7 Sept 2007 Paul Dauncey - Calorimetry 1 Overview SiD is designed for particle flow Calorimeters will be optimised using particle

More information

BS12 Piezoresistive OEM Pressure Sensor

BS12 Piezoresistive OEM Pressure Sensor BS12 Piezoresistive OEM Pressure Sensor Feature Pressure range (-0.1~60)Mpa; Pressure reference: Gauge, absolute and sealed gauge; Constant current power supply; Isolated construction to measure various

More information

VLSI Design 12. Design Styles

VLSI Design 12. Design Styles 1 9 8 5 1 9 8 7 1 9 9 1 1 9 9 3 1 9 9 9 2 0 0 1 2 0 0 5 2 0 0 7 2 0 0 9 Pr odu ctiv it y (T r an s./ St a f -M o nt h ) VLSI Design Last module: Floorplanning Sequential circuit design Clock skew This

More information

ProChek, A COMPREHENSIVE FABRICATION PROCESS MISMATCH AND RELIABILITY CHARACTERIZATION TOOL

ProChek, A COMPREHENSIVE FABRICATION PROCESS MISMATCH AND RELIABILITY CHARACTERIZATION TOOL Vendor: Ridgetop Group, Inc. Office Address: 3580 West Ina Road, Tucson, Arizona 85741 Phone: 520-742-3300; Fax: 520-544-3180 Technical Contact: Esko Mikkola, Ph.D., Project Manager Phone: 520-742-3300

More information

Bonding Reliability Testing for Wafer Level Packaged MEMS Devices

Bonding Reliability Testing for Wafer Level Packaged MEMS Devices Bonding Reliability Testing for Wafer Level Packaged MEMS Devices Michael Shillinger Vice President of Operations Innovative Micro Technology Santa Barbara, CA, USA mjs@imtmems.com October 20, 2011 Innovative

More information

Robotathon IEEE Robotics and Automation Society

Robotathon IEEE Robotics and Automation Society Robotathon 2017 IEEE Robotics and Automation Society 1 Table of Contents Introduction Parts Field Layout Competition Rules Scoring Competition Points Breakdown Checkpoints Breakdown The Conference Bonus

More information

BOSCH MEMS SENSORS: ENABLER FOR THE IOT DR. UDO-MARTIN GÓMEZ, CTO BOSCH SENSORTEC GMBH

BOSCH MEMS SENSORS: ENABLER FOR THE IOT DR. UDO-MARTIN GÓMEZ, CTO BOSCH SENSORTEC GMBH BOSCH MEMS SENSORS: ENABLER FOR THE IOT DR. UDO-MARTIN GÓMEZ, CTO BOSCH SENSORTEC GMBH OUTLINE 2 01 INTRODUCTION MEMS OVERVIEW & MEMS@BOSCH 02 AUTOMOTIVE MEMS TECHNOLOGY & APPLICATIONS 03 CE MEMS DRIVING

More information

Bernhard Thomas September EnCal 3000 prochain Energy in Gas with ROI

Bernhard Thomas September EnCal 3000 prochain Energy in Gas with ROI Bernhard Thomas September 2018 EnCal 3000 prochain Energy in Gas with ROI Agenda 1 Introduction The new EnCal 3000 prochain Technical details Outlook Introduction 2 What we measure and why 3 What we measure

More information

USER'S GUIDE. Digital Barometers with Analog Output PTB210 Series M210670EN-B

USER'S GUIDE. Digital Barometers with Analog Output PTB210 Series M210670EN-B USER'S GUIDE Digital Barometers with Analog Output PTB210 Series M210670EN-B PUBLISHED BY Vaisala Oyj Phone (int.): +358 9 8949 1 P.O. Box 26 Fax: +358 9 8949 2227 FIN-00421 Helsinki Finland Visit our

More information

Measurement And Control Appreciation

Measurement And Control Appreciation Measurement And Control Appreciation Course Content Aim To provide an appreciation of the operation and application of process plant instrumentation used for the measurement and display of the main process

More information

IE098: Advanced Process Control for Engineers and Technicians

IE098: Advanced Process Control for Engineers and Technicians IE098: Advanced Process Control for Engineers and Technicians IE098 Rev.001 CMCT COURSE OUTLINE Page 1 of 6 Training Description: Advanced Process Control and Loop Tuning and Analysis is designed to provide

More information

EE 434 Lecture 6. Process Technology

EE 434 Lecture 6. Process Technology EE 434 Lecture 6 Process Technology Quiz 4 If an n-channel MOS transistor is modeled with an input capacitance of 2fF and an on resistance of 5KΩ and a p-channel transistor with an input capacitance of

More information

Nordiko Metal Sputtering System Standard Operating Procedure

Nordiko Metal Sputtering System Standard Operating Procedure Nordiko Metal Sputtering System Standard Operating Procedure Specifications : Target Size Gases used in the system Base pressure Sputtering pressure Substrates used Substrate size : 2 inch or 4 inch :

More information

Procedures for operation of the TA Instruments DSC

Procedures for operation of the TA Instruments DSC Procedures for operation of the TA Instruments DSC Purpose and Scope: This document describes the procedures and policies for using the MSE TA Instruments DSC. The scope of this document is to establish

More information

Pressure Sensor Bridge Configurations

Pressure Sensor Bridge Configurations Pressure Sensor Bridge Configurations 1. Purpose Describe different pressure sensor bridge configurations, when each can and cannot be used, and the advantages and disadvantages of each. 2. Introduction

More information

SPD Pressure Sensor Families

SPD Pressure Sensor Families DATASHEET SPD Pressure Sensor Families 1/7 Introduction to the principals of Smart Pressure Devices 1 Basic principles Pressure sensors are based on the principle of bending a membrane caused by the pressure

More information

Layout Design II. Lecture Fall 2003

Layout Design II. Lecture Fall 2003 Layout Design II Lecture 6 18-322 Fall 2003 Roadmap Today: Layout Verification & design in the large Next week: Transistor sizing Wires Homework 1: Due Today Homework 2: Out Today, Due Sept 18 Lab 2: This

More information

Technical Explanation

Technical Explanation Technical Explanation for ESI Pressure Sensors Technical Explanation What is a pressure transmitter? A pressure transmitter (also called pressure transducer or pressure converter) is a component used to

More information

Physical Design of CMOS Integrated Circuits

Physical Design of CMOS Integrated Circuits Physical Design of CMOS Integrated Circuits Dae Hyun Kim EECS Washington State University References John P. Uyemura, Introduction to VLSI Circuits and Systems, 2002. Chapter 5 Goal Understand how to physically

More information

DEVICES FOR FIELD DETERMINATION OF WATER VAPOR IN NATURAL GAS Betsy Murphy MNM Enterprises 801 N. Riverside Drive Fort Worth, Texas 76111

DEVICES FOR FIELD DETERMINATION OF WATER VAPOR IN NATURAL GAS Betsy Murphy MNM Enterprises 801 N. Riverside Drive Fort Worth, Texas 76111 INTRODUCTION Water vapor in natural gas has more than a substantial effect on the quality of the gas stream. Without quality measurement of water vapor the gas is basically not saleable. Contracts are

More information

Static Extended Trailing Edge for Lift Enhancement: Experimental and Computational Studies

Static Extended Trailing Edge for Lift Enhancement: Experimental and Computational Studies Static Extended Trailing Edge for Lift Enhancement: Experimental and Computational Studies T. Liu, J. Montefort, W. Liou Western Michigan University Kalamazoo, MI 49008 and Q. Shams NASA Langley Research

More information

PRESSURE SENSOR - ABSOLUTE (0 TO 700 kpa)

PRESSURE SENSOR - ABSOLUTE (0 TO 700 kpa) Instruction Sheet for the PASCO Model CI-6532A PRESSURE SENSOR - ABSOLUTE (0 TO 700 kpa) 012-06859B 10/98 $1.00 polyurethane tubing syringe cable with DIN s to computer interface quick release s (4) pressure

More information

Pressure Measurements

Pressure Measurements ME 22.302 Mechanical Lab I Pressure Measurements Dr. Peter Avitabile University of Massachusetts Lowell Pressure - 122601-1 Copyright 2001 A transducer is a device that converts some mechanical quantity

More information

PTB210 Series Digital Barometers with Analog Output USER'S GUIDE

PTB210 Series Digital Barometers with Analog Output USER'S GUIDE PTB210 Series Digital Barometers with Analog Output USER'S GUIDE M210670en-A December 2004 PUBLISHED BY VAISALA Oyj Phone (int.): (+358 9) 894 91 P.O. Box 26 Telefax: (+358 9) 894 9227 FIN-00421 Helsinki

More information

CONTENTS TABLE OF MAIDA S HISTORY TERMINOLOGY & GENERAL SPECIFICATIONS. iii. LEAD CODES and TAPE & REEL STANDARD SERIES 1 HC SERIES 17

CONTENTS TABLE OF MAIDA S HISTORY TERMINOLOGY & GENERAL SPECIFICATIONS. iii. LEAD CODES and TAPE & REEL STANDARD SERIES 1 HC SERIES 17 TABLE OF CONTENTS MAIDA S HISTORY TERMINOLOGY & GENERAL LEAD CODES and TAPE & REEL i ii iii STANDARD SERIES 1 HC SERIES 17 LOW PROFILE SERIES 33 THERMALLY PROTECTED SERIES 39 HIGH ENERGY SERIES LEAD CODES

More information

Computer Aided Drafting, Design and Manufacturing Volume 26, Number 2, June 2016, Page 53. The design of exoskeleton lower limbs rehabilitation robot

Computer Aided Drafting, Design and Manufacturing Volume 26, Number 2, June 2016, Page 53. The design of exoskeleton lower limbs rehabilitation robot Computer Aided Drafting, Design and Manufacturing Volume 26, Number 2, June 2016, Page 53 CADDM The design of exoskeleton lower limbs rehabilitation robot Zhao Xiayun 1, Wang Zhengxing 2, Liu Zhengyu 1,3,

More information

How to specify a product. Process Sensors and Mechanical Instruments

How to specify a product. Process Sensors and Mechanical Instruments How to specify a product Process Sensors and Mechanical Instruments Keep the overview. Here is some guideline information on how to specify our products. Intended as supplementary help to specification

More information

(TRCM) Wire Wound RF SMD Inductor

(TRCM) Wire Wound RF SMD Inductor Version: February 17, 2017 (TRCM) Wire Wound RF SMD Inductor Token Electronics Industry Co., Ltd. Web: www.token.com.tw Email: rfq@token.com.tw Taiwan: No.137, Sec. 1, Zhongxing Rd., Wugu District, New

More information

Quick-start Guide. Heart Rate Monitors. Copyright Wireless Motorsport Pty Ltd 2016

Quick-start Guide. Heart Rate Monitors. Copyright Wireless Motorsport Pty Ltd 2016 BioTelemetry Quick-start Guide Heart Rate Monitors Copyright Wireless Motorsport Pty Ltd 2016 The information in this document is subject to change without notice. While every effort is taken to ensure

More information

PropaGator Autonomous Surface Vehicle

PropaGator Autonomous Surface Vehicle PropaGator Autonomous Surface Vehicle Andrew Wegener December 4, 2012 University of Florida Department of Electrical and Computer Engineering EEL 5666C IMDL Final Report Instructors: A. Antonio Arroyo,

More information

High Density FPGA Package BIST Technique

High Density FPGA Package BIST Technique High Density FPGA Package BIST Technique Douglas Goodman, James Hofmeister, Justin Judkins, PhD Ridgetop Group Inc. 3580 West Ina Road Tucson, AZ 85741 (520) 742-3300 Doug@ridgetop-group.com Abstract Over

More information

CPE/EE 427, CPE 527 VLSI Design I IC Manufacturing. The MOS Transistor

CPE/EE 427, CPE 527 VLSI Design I IC Manufacturing. The MOS Transistor CPE/EE 427, CPE 527 VLSI Design I IC Manufacturing Department of Electrical and Computer Engineering University of Alabama in Huntsville Aleksandar Milenkovic The MOS Transistor Polysilicon Aluminum 9/11/2006

More information

Indian Institute of Technology Kanpur Samtel Centre for Display Technologies

Indian Institute of Technology Kanpur Samtel Centre for Display Technologies Fax: + 91-0512-2596620 Phones: + 91-0512-2596622,6088 Indian Institute of Technology Kanpur Samtel Centre for Display Technologies Enquiry number: SCDT/FlexE/2016-17/02 Date:05/05/2016 Sealed Quotations

More information

Stride October 20, 2017

Stride October 20, 2017 Preliminary Design Review Stride October 20, 2017 Advisor: ProfessorTessier Hollot 1 Advisor : Professor Group Members Richie Hartnett CSE Jarred Penney EE Advisor Prof. Tessier Joe Menzie CSE Jack Higgins

More information

Programmable pressure and temperature transmitters PTM/RS485

Programmable pressure and temperature transmitters PTM/RS485 Programmable pressure and temperature transmitters PTM/RS485 Version: 26.06.2014 Technical Specifications Pressure measuring range (bar) 0.1... 0.5 > 0.5 2 > 2 25 Overpressure 3 bar 3 x FS ( 3 bar) 3 x

More information

EC214 EC215 - EC215R Bench Conductivity Meters

EC214 EC215 - EC215R Bench Conductivity Meters Instruction Manual EC214 EC215 - EC215R Bench Conductivity Meters http://www.hannainst.com These Instruments are in Compliance with the CE Directives Dear Customer, Thank you for choosing a Hanna Instruments

More information

Relative Pressure Sensor for Automobile Fuel Tanks

Relative Pressure Sensor for Automobile Fuel Tanks Relative Pressure Sensor for Automobile Fuel Tanks KATO, Hirofumi ASHINO, Kimihiro SATO, Eisuke ABSTRACT In recent years, there has been increasing regulation to reduce the environmental burden of automobiles.

More information

Pressure Measurement. Introduction. Engr325 Instrumentation. Dr Curtis Nelson 3/1/17

Pressure Measurement. Introduction. Engr325 Instrumentation. Dr Curtis Nelson 3/1/17 3/1/17 Pressure Measurement Engr325 Instrumentation Dr Curtis Nelson Introduction A cluster of 72 helium-filled balloons over Temecula, California in April of 2003. The helium balloons displace approximately

More information

COMELEC C-30-S Parylene Coating System

COMELEC C-30-S Parylene Coating System COMELEC C-30-S Parylene Coating System Comelec C-30-S Parylene deposition system Introduction Parylene is a polymere deposited at room temperature in a vacuum chamber (few µb). Parylene coating is perfectly

More information