Company Presentation Nov 19, 2009

Transcription

1 Company Presentation Nov 19, 2009

2 Table of Contents Market and Business Development 4th Quarter & Fiscal Year 2009 Business Focus Divisions, Products and Technology General Company Information 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 2

3 Table of Contents Market and Business Development 4th Quarter & Fiscal Year 2009 Business Focus Divisions, Products and Technology General Company Information 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 3

4 Market researchers expect 2009 to end with -17% to -12% year-over-year growth; 2010 up 8% to 15% Semiconductor Market Forecasts Growth [% based on USD market] Forecasts Date* WSTS Forecast -16% 9% Aug-09 isuppli -16% 14% Sep-09 Gartner -17% 8% Aug-09 VLSI -12% 14% Sep-09 IC Insights -17% 15% Jun-09 Future Horizons -14% 15% Aug-09 [USD bn] 249 * forecast publication date /19/2009 Copyright Infineon Technologies All rights reserved. Page 4

5 Infineon s Rankings Power Industrial Chip Card Automotive Wireless ASSP #1 #1 #1 #2 #4 Market share Market share Market share Market share Market share 10% 8% 26% 9% 6% IMS Research, July 2009 Semicast, May 2008 Frost & Sullivan, October 2009 Strategy Analytics, July 2009 isuppli, March /19/2009 Copyright Infineon Technologies All rights reserved. Page 5

6 Infineon at a Glance The Company Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy efficiency, Communications and Security Revenue in FY 2009: billion EUR Some 26,000 employees worldwide (as of Sept 2009) Strong technology portfolio with about 22,900 patents and patent applications More than 30 major R&D locations Germany s largest semiconductor company 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 6

7 Infineon Group Results for FY 2008 and FY 2009 [EUR m] FY 2008 FY 2009 Change Net Sales Growth (%) Infineon Segment Result in % of sales Loss from continuing operations Loss from discontinued operation 3, ,027 (22) (167) (6) (876) (404) (204) (273) (69) (3,543) (398) 3,145 Net loss (3,747) (671) 3,076 Earnings (loss) per share [EUR] (3.61) (0.73) /19/2009 Copyright Infineon Technologies All rights reserved. Page 7

8 Infineon Segment Revenues and Results FY 2008 and Q4 FY 09 page 1 of 2 [EUR m] Q4 FY 08 Q3 FY 09 Q4 FY 09 Automotive Revenues Segment Result (17) Industrial & Multimarket Revenues Segment Result Chipcard & Security Revenues Segment Result Wireless Solutions Revenues Segment Result /19/2009 Copyright Infineon Technologies All rights reserved. Page 8

9 Infineon Segment Revenues and Results FY 2008 and Q4 FY 09 page 2 of 2 [EUR m] Q4 FY 08 Q3 FY 09 Q4 FY 09 Other Operating Segments Revenues Segment Result 21 (8) 1 (2) 6 (3) Corporate and Eliminations Revenues Segment Result (10) (22) 0 (13) 1 (16) Infineon Revenues Segment Result 1, /19/2009 Copyright Infineon Technologies All rights reserved. Page 9

10 Net Sales Infineon Group by Segment, FY 2008 and FY 2009 Q4 FY 2008 Q4 FY 2009 Industrial & Multimarket EUR 325m 31% Chip Card & Security EUR 115m 11% Industrial & Multimarket EUR 257m 30% 10% Chip Card & Security EUR 88m Automotive EUR 312m 30% 1% Others* EUR 11m 27% Wireless Solutions EUR 286m Automotive EUR 238m 28% 1% 31% Others* EUR 7m Wireless Solutions EUR 265m Total: EUR 1,049m Total: EUR 855m * Includes Corporate & Eliminations and Other Operating Segments 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 10

11 Net Sales Infineon Group by Segment, FY 2009 Q3 FY 2009 Q4 FY 2009 Industrial & Multimarket EUR 221m 29% 11% Chip Card & Security EUR 82m Industrial & Multimarket EUR 257m 30% 10% Chip Card & Security EUR 88m Automotive EUR 206m 33% 27% 10% 0% Others* EUR 1m Wireless Solutions EUR 251m Automotive EUR 238m 28% 1% Others* EUR 7m 31% Wireless Solutions EUR 265m Total: EUR 761 m Total: EUR 855 m * Includes Corporate & Eliminations and Other Operating Segments 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 11

12 Net Sales by Region FY 2007 Through FY , , , , , , , Total EUR 3,660m 6% 35% 15% 22% 22% * excluding Germany ** and others 22% Total EUR 3,903m 41% 14% 19% 21% Total EUR 3,027m GJ FY 2007 GJ FY 2008 GJ FY 2009 Japan APAC NAFTA ** Europe * Germany 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 12 5% 5% 45% 14% 18% 18%

13 Table of Contents Market and Business Development 4th Quarter & Fiscal Year 2009 Business Focus Divisions, Products and Technology General Company Information 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 13

14 We focus on our Target Markets Focus Areas Energy Efficiency Communications Security Core Competencies Analog/Mixed Signal RF Power Embedded Control Our Target Markets Automotive Industrial Electronics Chip Card & Security Mobile Phone Platforms 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 14

15 Focus Areas and Target Markets Revenue Split by Focus Area FY 2009 revenue split Industrial & Multimarket Automotive Energy Efficiency: EUR 1744m Communications: EUR 917m Security: EUR 341m Wireless Solutions Chip Card & Security 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 15

16 We align to our customer segments Customers Automotive Industrial & Multimarket Chip Card & Security Wireless Solutions Power Semiconductors Power ICs Microcontroller Sensors Electric Drive Train Power Discretes Power Modules Power ICs ASICs RF & Protection Devices Identification Payment Pay-TV SIM cards Platform Security Mobile Phone Platforms Mobile Software RF Solutions Tuner and Receiver RF Power Sales, Operations, Central Functions Board 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 16

17 Our Infineon Values We understand our customers needs We are flexible and respond quickly We provide solutions We keep our commitments and deliver exceptional quality We profitably develop opportunities We excel in outstanding engineering We learn continuously and get better each day We respect each other We cooperate across boundaries We help others to grow We walk the talk We strive for our customers success We generate sustainable results We care about people and society Our products enhance the quality of life 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 17

18 Table of Contents Market and Business Development 4th Quarter & Fiscal Year 2009 Business Focus Divisions, Products and Technology General Company Information 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 18

19 Infineon Market-Oriented Business Structure Divisions Core Applications Automotive Powertrain (engine and transmission control); Hybrid and electric cars; Car body and comfort electronics (steering, suspension, lights, air conditioning, sunroof, power windows, windshield wipers, central body control units, door electronics); Safety (ABS, airbags, ESP), Emergency call system (ecall) Industrial & Multimarket Chip Card & Security Electric drive control for industrial applications & home appliances, Modules for renewable energy generation, transmission & conversion, Semiconductor components for light management systems & low-energy lamps, Power supplies for servers, PCs, notebooks, netbooks, game consoles, entertainment electronics; Customized components for PC peripherals (e.g. mouse), game consoles & medical engineering applications, Small-signal semiconductors for communication (e.g. GPS, UMTS, WLAN, digital TV) and tuner systems SIM card for mobile phones; Payment systems; Electronic passports, ID cards, healthcare cards and driver's licenses; Personal identification; Object identification; Pay TV; Platform security for computers and networks; Authentication and system integrity e.g. in game consoles, printers, industrial controllers Customers Wireless Solutions Baseband processors, radio-frequency solutions and power management chips, mostly also available as single-chip solutions; Complete platforms including software for mobile phones (GSM, EDGE, HSPA, LTE); Bluetooth and GPS receivers; Analog and digital TV tuners for stationary and mobile TV receivers; Transceivers for satellite radio; Power transistors for amplifiers in cellular base stations 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 19

20 Automotive Overview Product Range Sensors: pressure, temperature, magnetic; wireless control ICs, radar Microcontrollers: 8-bit, 16-bit, 32-bit Power: MOSFETs, IGBTs, smart power ICs: voltage regulators, bridges, driver ICs, CAN / LIN / FlexRay transceiver, DC-DC converter, power system ICs, system-on chip embedded power ICs Hybrid & Electric Vehicle: HybridPACK 1, HybridPACK 2, gate driver ICs, MOSFETs, IGBTs Core competencies/ Value proposition More than 40 years of automotive system and application expertise Automotive industry commitment Innovative product and technology portfolio Complete automotive system provider Worldwide development, production and support sites for automotive semiconductors Automotive Excellence: most comprehensive quality program of the industry Market Positions No.2 in Automotive Semiconductors worldwide (Head-to-Head to No. 1) No.1 in Europe No.2 in ROW Source: Strategy Analytics (May 2009) * FlexRay is a trademark licensed by FlexRay Consortium GbR 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 20

21 Industrial & Multimarket Overview Product Range Power discretes and modules Power management ICs AF/RF diodes and transistors Silicon MEMS microphone, TVS diodes ASIC design solutions incl. secure ASICs for authentication and brand protection Core competencies/ Value proposition High quality products and services Leading edge technology and IP portfolio System expertise with broad application competence Strong worldwide presence with local sales and application support Dedicated account teams & distributors Market Positions No.1 in Power Semiconductors for six consecutive years No.1 in Industrial Applications Sources: IMS Research, Semicast 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 21

22 Chip Card & Security Overview Product Range Contact-based and contact-less chip card security controllers and memories Security ICs & Secure ASICs Customer- and application-specific secure solutions and designs (System-on-Chip, System-in-Package or ODM ready) Core competencies/ Value proposition Outstanding security and contactless expertise Leading edge in-house and partner IP expertise Best-in-class CMOS and packaging technologies Customized solutions incl. firmware & software and complete reference designs Strong customer-focused teams Long-term track record in all applications Market Positions No. 1 in the Chip Card market with a market share of 27% Source: Frost & Sullivan, Oct /19/2009 Copyright Infineon Technologies All rights reserved. Page 22

23 Wireless Solutions Overview Product Range RF Solutions: Complete portfolio from GPRS to HSxPA, LTE and WiMax RF transceivers; Tuner Systems; RF Power Mobile Phone Platforms: Complete HW/SW platform solutions from ultra low cost (ULC - GSM/GPRS) to HSPA and beyond Mobile Software: Protocol Stack: GSM, EDGE, HSPA+, LTE IMS: Device Framework, RCS Client and LTE support Core competencies/ Value proposition Leadership in RF CMOS technology and System-on-chip (SoC) integration Strong System and Software competence Partnering with leading customers Partner on connectivity and application processor Market Positions No. 1 in RF transceivers for mobile phones: Shipped some 1.5 billion cellular RF TRx to date. World s first 65nm LTE DigRF TRx sampled Leading position in GSM/GPRS, EDGE and HSPA mobile phone platform solutions: Shipped >130 Mio Single Chips for ULC phones. World s first EDGE single chip in volumes No. 4 in Wireless ASSPs Source: isuppli 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 23

24 Infineon Partner of the Worldwide Electronics Industry Main Customers Automotive Industrial & Multimarket Autoliv Bosch Continental Delphi ABB Alstom Converteam Dell Delta Denso Hella Hyundai Mobis Lear Emerson HP Microsoft Philips Rockwell Mitsubishi TRW Valeo Schneider Electric Siemens SMA Technology Sony Main channel partners (distributors): Arrow, Avnet, Beijing Jingchuan, Rutronik, Tomen, Toyotsu, WPG Holding Chip Card & Security Communication Wireless Solutions Solutions Gemalto Giesecke & Devrient Oberthur Ericsson Huawei LG Nokia Sagem Orga US Government Printing Office Motorola Panasonic RIM Samsung SEMC Vodafone ZTE Electronic Manufacturing Services (EMS): Celestica, Elcoteq, Flextronics, Foxlink, Hon Hai, Jabil 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 24

25 Infineon Semiconductor Technology Portfolio Technology Portfolio fits needs of logic and power applications CMOS Digital CMOS: Analog/Mixed Signal: envm: eflash/eeprom: 800nm 40nmTechnology Nodes (Platform <180nm incl. RF, AMS) 500nm 180nm Technology Nodes (CxNA) EEPROM: IMEMR, C9FL OTP: C5OP (Automotive) 250nm 90nm CxFL (Chip Card), CxFLA, CxFLN (Automotive) RF/Bipolar Power/Analog incl. Green Robust RF BICMOS: 25GHz 40GHz: B6HFC, B9COPT Bipolar IC: NF-IC, 2GHz...200GHz RF-Bipolar: BxHF SiGe: B7HFM, B7HF_SLC, B7HF200 HiPAC: Al/Cu Integrated Passives RF Switches: C7NP P7Mxx, P7Dxx, P8Mxx Bipolar/Discretes/MMIC: RF-Transistors NF-TR; BxHF(D/M), SiGe: B7HFD/M, B7HF_SD Power Amplifier: LDMOS, LDxM, LDxIC, LD9AB RFMOS: HFM Diodes: NF-DI, Tuner: DxT, Schottky: DxS PIN: DxP Analog Bipolar: Analog BICMOS: Smart Power : Smart : (SmartMOS) DOPL, Ax, BIPEP B6CA, B6CA-CT, B7CA, SPT nm HV-CMOS-SOI nm BIP/CMOS/DMOS SPTx (Automotive, EDP) (BCD) CMOS/DMOS, SMARTx, MSMARTx, SSMARTx Opto-TRIAC DMOS: KSPx, PFET (p-channel) (OptiMOS) KSNx, EH4, SFETx (n-ch.) HV-DMOS: EH5/6, EHATx, (CoolMOS) EHATDx, EHCx, EHCxD IGBT: IGBTx, LightMOS, ZIGBT Fast Recov. Diodes: FRSTD (ECxxx) SiC Devices: Diode; MOS/JFET(Research) MEMS/Sensors Analog ICs: Magnetic: B6CA, B7CA Coreless Transformer BxCAS, C9FLRN_GMR Pressure: BxCSP, TIREPx Microphone: DSOUND Opto: OP-DI, OP-TR, OP-C9N, µ-modules 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 25

26 Infineon Package Technology Portfolio IC Power Wafer Level Packages, Bare Die Laminate based Packages Leadframe based Packages Power Discretes Sensors High Power Chip Card Surface Mount Technology (SMD) Without redistribution WLP (fan-in) Wafer level w/redistribution WLB (fan-in) ewlb (fan-out) Bare Die Wirebond Flip chip SMD OCCN 1) BGA LBGA xfbga, xfsga Flip chip FCxBGA xf2bga, xf2sga Through Hole DIP 2) SMD PLCC 2) TSSOP TQFP, LQFP, MQFP Leadless VQFN O-LQFN 1) Through Hole TO, DIP SMD TO DSO SSOP Leadless CanPAK SON QFN SIP Low Power IDC SIP Medi. Power CIPOS SMD leaded SOT SOD Flat lead TSFP SC Leadless TSLP Wafer level WLP Through Hole PSSO SMD Leaded DSO SC TSOP Open cavity DSOF Power Modules Easy 62mm Econo Econo PACK+ PrimePACK IHM IHV Hybrid PACK Mold on LF P-MCCx Mold P-Mx.x Chip on Flex UV Globe top T-Mx.x PRELAM PPxx Flip Chip S-MFCx.x Wafer Bumped Diced 1) for specialities only 2) phase-out 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 26

27 Table of Contents Market and Business Development 4th Quarter & Fiscal Year 2009 Business Focus Divisions, Products and Technology General Company Information 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 27

28 Infineon Functional Organization Board P. Bauer (CEO) Prof. Dr. H. Eul Dr. R. Ploss Dr. M. Schroeter (CFO) Divisions & Sales Automotive J. Hanebeck C. Geisler M. Seitz Industrial & Multimarket A. Mittal P. Schiefer O. Schuster Chipcard & Security Dr. H. Gassel M. Friedinger Wireless Solutions W.K. Tan C. Eisenschmid Sales, Marketing & Distribution D. Bilo / A. Mueller Joint management responsibility of Division Head and Division Finance Head Operations Frontend - Power Dr. H.-D. Loewe Assembly & Test - Power K. T. Ng Frontend CMOS P. Haidas Assembly & Test CMOS W. T. Gan Operations Dr. R. Ploss Corporate Supply Chain Dr. K. Gruber Finance P. Gruber Central Functions Accounting Services & Processes M. Schneider Audit & Risk Management R. Hawliczek Business Continuity W.-R. Moritz Communications R. Driever Compliance Officer R. Hawliczek Consolidation & External Reporting Dr. F. Kirchmeier Controlling & Projects A. Sauer Corporate Dev. & Investor Relations U. Pelzer Enabling Technologies & Services Dr. F. Neppl Public Authorities & Associations Dr. A. Hoffmann Finance & Treasury F.-X. Gerard Human Resources Dr. T. Marquardt Information Technology M. Schmelmer Legal & Patent M. v. Eickstedt Purchasing H.-M. Schweizer Quality Management H. Mahler R&D Excellence Dr. C. Kutter Taxes A. Rappl Regions North America J.-B. Loire, A. Prillwitz Asia Pacific T.T. Pow, A. Chong, H.-M. Stech Japan Y. Mori, A. Trost 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 28

29 Infineon: 26,464 Employees Worldwide* USA 687 employees East Coast (Allentown, Fishkill,...) West Coast (Milpitas, Morgan Hill) Europe 13,836 employees Asia/Pacific 11,941 employees 75 Great Britain 2,061 Singapore 2,415 Austria 1,666 Indonesia 9,094 Germany 496 India 66 Portugal** 6,078 Malaysia 1,496 France 1,188 China 89 Italy 37 Hongkong 157 Romania 138 Japan * as of Sep 30, 2009; data w/o Qimonda Sweden, Norway Hungary Korea Taiwan ** incl. ESAS HC 12 Other Europe 9 Australia 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 29

30 Infineon - R&D Network in Europe Duisburg Warstein Aalborg Nuremberg Dresden Bristol Regensburg Ulm Linz Augsburg Graz Sophia Antipolis Munich, Neubiberg Padova Villach Bucharest 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 30

31 Infineon - Worldwide R&D Network (excluding Europe) Allentown Xi an Bejing Milpitas Shanghai Morgan Hill Seoul Torrance Singapore East Fishkill Bangalore Malacca 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 31

32 Infineon - Worldwide Production Sites Both Frontend and Backend Dresden Wuxi Singapore Batam Echtrop Morgan Hill Malacca Warstein Essonnes Regensburg Villach Cegléd Kulim 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 32

33 Infineon Sales Offices in Europe Antwerp Duisburg Warstein Hanover Stockholm, Kista Helsinki, Espoo Moscow Dublin Erlangen, Nuremberg Warsaw Bristol Stuttgart Saint Denis Vienna Toulouse, Blagnac Aubagne, Marseille Zurich Milan Karlsruhe Munich, Neubiberg Villach 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 33

34 Infineon Sales Offices Worldwide (Excluding Europe) Milpitas Libertyville Livonia Nagoya Sanbu Tokyo San Diego Osaka Kokomo Shanghai Lebanon Taipei Sao Paulo Seoul Hongkong Singapore Beijing Blackburn Bangalore 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 34

35 Sustainability for Human Beings and the Environment IMPRES *) : Synergy between responsibility for humans & environment and economic success EN ISO and OHSAS certification Efficient resources management for environmental protection Intelligent concepts for minimization of waste and emissions Voluntary commitment to reduce green-house gas emissions Responsible acting accompanies our products and is part of our supply chain management High safety and health standards For Infineon, responsibility and sustainability are more than just the fulfillment of legal requirements *) Infineon Integrated Management Program for Environment, Safety and Health Picture source: photocase.de 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 35

36 Green Products Infineon initiated the project "Green Product" in the year 2000 in order to meet the legal as well as even more stringent quality requirements called for by modified soldering processes. Today nearly all of Infineon's products are converted to lead-free production and are available as "RoHS compliant". This corresponds to the actual requirements of the markets, since for the time being not all production operations of our customers have been switched over to the lead-free process. More informations are available on: 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 36

37 Integrated Business Continuity, Disaster Recovery and Security at Infineon Business Continuity Planning Business impact & risk assessment Supply chain security Security Crisis Management Supply chain & manufacturing recovery IP protection Business continuity plans Crisis management Information System Security IT system security Security control centre Global Site Security IT risk assessment Security technology Intrusion detection Plant & property protection 11/19/2009 Copyright Infineon Technologies All rights reserved. Page 37

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